전자 부품용 플라스틱 : 기술 및 세계 시장

The global market for plastics in electronic components was valued at $16.4 billion in 2025 and is estimated to increase from $17.3 billion in 2026 to reach $23.6 billion by the end of 2031, at a compound annual growth rate (CAGR) of 6.4% from 2026 through 2031.

The Asia-Pacific market for plastics in electronic components was valued at $7.8 billion in 2025 and is estimated to increase from $8.3 billion in 2026 to reach $11.9 billion by the end of 2031, at a CAGR of 7.6% from 2026 through 2031.

The North American market for plastics in electronic components was valued at $3.9 billion in 2025 and is estimated to increase from $4.1 billion in 2026 to reach $5.5 billion by the end of 2031, at a CAGR of 6% from 2026 through 2031.

Report Scope

This report provides a detailed global market analysis of plastics in electronic components, reflecting the latest data, trends, and market projections. Plastics in electronic components are thermoplastic and thermoset polymer materials used as integral functional materials within electronic architectures to enable electrical, thermal, mechanical, dielectric, and environmental performance in modern electronic systems. These plastics are not merely structural or cosmetic materials; rather, they serve as critical enabling materials that directly support the operation, protection, miniaturization, interconnection, insulation, encapsulation, thermal stability, and signal integrity of electronic components. They are incorporated into the internal composition of connectors, printed circuit board (PCB) substrates, semiconductor packaging systems, passive and active electronic components, electromechanical assemblies, sensors, micro-electronics, and thermal-management systems used across advanced electronics applications.The report focuses on the polymer type, component type, and end-use aspects of plastics in electronic components. The base year for the study is 2025, with estimates and forecasts for 2026 through 2031. Market estimates are valued in U.S. dollars (millions). Forecast growth rates are based on expected industry capacity additions, feedback from industry leaders, revenue reported by major companies, and anticipated regulatory updates. Data from major plastics associations-such as Plastics Europe, Plastics Industry Association, the International Council of Chemical Associations, the British Plastics Federation, the Vietnam Plastics Association, the Indian Polyurethane Association, and the China Plastics Processing Industry Association were used to anticipate market dynamics and to further measure market size.

For this analysis, the global market for plastics in electronic components is segmented as follows:

• Polymer type:Thermoplastics and thermosets.
• Thermoplastics: Commodity and engineering plastics, high-performance engineering plastics, and ultra-high-performance plastics.
• Commodity and engineering plastics: Polyamide, PBT/PET, polycarbonate, acrylonitrile butadiene styrene, polyvinyl chloride, polypropylene, polyethylene, and polymethyl methacrylate.
• High-performance engineering plastics: Polyphenylene sulfide, polyetherimide, and sulfone polymers.
• Ultra-high-performance plastics: Fluoropolymers, liquid crystal polymers, and polyetheretherketone.
• Thermosets: Epoxy resins, silicone resins, phenolics, polyurethanes, and unsaturated polyesters.
• Component Type: Interconnects and connectors, printed circuit boards, active components, passive components, electromechanical components, sensors and micro-electronics, thermal management components, and others (antenna and RF plastic assemblies, optical and photonic electronic components, fuse, and circuit protection components).
• End Use: Consumer electronics, automotive, AI and data centers, industrial, telecom, energy and power, medical, and others (aerospace, defense, smart infrastructure, marine).
• Region: North America, Europe, Asia-Pacific, South America, and the Middle East and Africa.

Report Includes

• 110 data tables and 47 additional tables
• Analysis of the plastics in electronics components market, including current market size and future growth potential
• Market size estimates for 2025 (base year) and forecasts for the period 2026 through 2031
• Detailed segmentation of the market by polymer type, thermosets, application and electronic component type
• Analysis of key market drivers, restraints, and opportunities influencing market growth
• Insights into industry trends, emerging technologies and developments in plastics in electronics components
• Analysis of regional markets, including North America, Europe, Asia-Pacific, South America and Middle East and Africa
• Competitive landscape analysis, including market share, ranking and strategic developments of key players
• Profiles of leading and emerging companies, including their product portfolios, financials, and recent developments
• Company profiles of major players within the industry, including BASF, SABIC, Celanese Corp., Toray Industries Inc., and Mitsubishi Chemical Group Corp.

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Drivers
• Trends and Future Developments
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion

Chapter 2 Market Overview

• Overview
• Technology Background
• Criteria for Selecting Plastics in Electronic Components
• Electrical Performance and Dielectric Stability
• Flame Retardancy and Regulatory Compliance
• Thermal Management Capability
• Dimensional Stability and Miniaturization Compatibility
• Chemical Resistance
• EMI Shielding and Electrostatic Discharge (ESD) Protection
• Sustainability and Circularity Requirements
• Value Chain Analysis
• Feedstock and Petrochemical Production
• Polymerization and Base Resin Manufacturing
• Compounding and Functional Material Engineering
• Component Manufacturing
• Electronics Component Integration
• OEM Assembly and End-Use Electronics Manufacturing
• Distribution, Aftermarket, and Repair Ecosystem
• Regulatory Landscape
• Impact of U.S.-Iran Conflict on the Global Market for Plastics in Electronic Components

Chapter 3 Market Dynamics

• Market Dynamics Snapshot
• Market Drivers
• AI Infrastructure and Hyperscale Datacenter Expansion
• Surge in 5G, High-Frequency Electronics, and Telecom Infrastructure
• Electrification and EV Electronics Growth
• Renewable Energy and Power Electronics Expansion
• Market Restraints
• Thermal Management Limitations in High-Power Electronics
• PFAS and Hazardous Chemical Regulations
• Market Opportunities
• Growth of Industrial Automation and Smart Infrastructure
• Rising Adoption of Flexible Electronics, Wearables, and Printed Electronics
• Market Challenges
• Semiconductor and Electronics Supply-Chain Volatility
• Rising Cost of High-Performance Polymers

Chapter 4 Emerging Technologiesand Developments

• Overview
• Emerging Technologies
• Precision Reactive Extrusion
• Nanocomposite Dispersion and Functional Filler Integration
• Ultra-Thin Wall Injection Molding
• Laser Direct Structuring and Molded Interconnect Device Technologies
• Additive Manufacturing
• Suspension Polymerization

Chapter 5 Market Segmentation Analysis

• Segmentation Breakdown
• Market Analysis by Polymer Type
• Key Takeaways
• Thermoplastics
• Thermosets
• Market Analysis by Component Type
• Key Takeaways
• Interconnect and Connectors
• Printed Circuit Boards
• Active Components
• Passive Components
• Electromechanical Components
• Sensors and Micro-Electronics
• Thermal Management Components
• Other Components
• Market Analysis by End Use
• Key Takeaways
• Consumer Electronics
• Automotive
• AI and Data Centers
• Industrial Sector
• Telecom
• Energy and Power
• Medical
• Others
• Geographic Breakdown
• Market Analysis by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• South America
• Middle East and Africa (MEA)

Chapter 6 Competitive Intelligence

• Industry Structure
• Company Market Share Analysis
• BASF
• SABIC
• Celanese Corp.
• Toray Industries Inc.
• Mitsubishi Chemical Group Corp.

Chapter 7 Appendix

• Methodology
• References
• Abbreviations
• Company Profiles
• ARKEMA
• ASAHI KASEI CORP.
• BASF
• CELANESE CORP.
• COVESTRO AG
• EVONIK INDUSTRIES AG
• LG CHEM
• LYONDELLBASELL INDUSTRIES HOLDINGS B.V.
• MITSUBISHI CHEMICAL GROUP CORP.
• SABIC
• SUMITOMO CHEMICAL CO. LTD.
• SYENSQO
• TORAY INDUSTRIES INC.
• UBE CORP.
• VICTREX PLC