셀룰러 IoT 및 LPWA 칩셋 및 모듈 시장(제10판)

Global demand for IoT wide area networking technology is in a growth phase. Berg Insight forecasts that annual shipments of cellular and non-3GPP LPWA IoT modules will grow at a compound annual growth rate (CAGR) of 7.7 percent from 909 million units in 2025 to 1.32 billion units in 2030. Get up to date with the latest trends from all vertical markets with this unique 150-page report and database covering cellular IoT chipset and module shipments across 30+ device types, 10 technologies and 6 regional markets.

Highlights from the report:

• 360-degree overview of the main IoT wide area networking ecosystems.
• Cellular IoT chipset and module data by region, vertical, device type and technology from 2018–2030.
• Market shares for cellular IoT chipset and module vendors.
• Comparison of technologies and standards.
• Updated profiles of the main suppliers of IoT chipsets and modules.
• Adoption trends for 5G technologies including 5G eMBB, 5G RedCap and 5G eRedCap, as well as LPWA technologies including NB-IoT, LTE-M, LoRa and Sigfox.
• Cellular and non-3GPP LPWA IoT device market forecasts until 2030.

Table of Contents

List of Figures

Executive Summary

1 Wide Area Networks for the Internet of Things

• 1.1 Which things will be connected to wide area networks?
  • 1.1.1 Utility meters
  • 1.1.2 Motor vehicles
  • 1.1.3 Buildings
  • 1.1.4 Asset tracking and supply chain visibility
  • 1.1.5 The opportunity to create smarter and safer cities
  • 1.1.6 The convergence of IoT and AI
• 1.2 What are the technology options?
  • 1.2.1 Network deployment models
  • 1.2.2 Licensed and unlicensed frequency bands
  • 1.2.3 Cost comparison for cellular and LPWA technologies
• 1.3 Which are the leading technology ecosystems?
• 2.1 Technology characteristics
  • 2.1.1 3GPP Release 13 (2016) – Introducing LTE-M and NB-IoT
  • 2.1.2 3GPP Release 14 (2017) – IoT enhancements and C-V2X
  • 2.1.3 3GPP Release 15 (2019) – The first phase of 5G specifications
  • 2.1.4 3GPP Release 16 (2020) – URLLC and 5G NR C-V2X
  • 2.1.5 3GPP Release 17 (2022) – RedCap and NTN communications
  • 2.1.6 3GPP Release 18 (2024) – The first 5G-Advanced specifications and eRedCap .
  • 2.1.7 3GPP Release 19 (2025) – Ambient IoT as a new low-power cellular IoT class
• 2.2 Network footprint
  • 2.2.1 2G/3G mobile networks
  • 2.2.2 4G LTE mobile networks
  • 2.2.3 4G/5G mobile IoT networks (LTE-M and NB-IoT)
  • 2.2.4 5G mobile networks
• 2.3 Semiconductor vendors
  • 2.3.1 Altair Semiconductor
  • 2.3.2 ASR Microelectronics
  • 2.3.3 Eigencomm
  • 2.3.4 HiSilicon
  • 2.3.5 MediaTek
  • 2.3.6 MLINK
  • 2.3.7 Qualcomm
  • 2.3.8 Samsung Electronics
  • 2.3.9 Sequans Communications
  • 2.3.10 UNISOC
  • 2.3.11 Xinyi Information Technology
  • 2.3.12 Other semiconductor vendors
• 2.4 Module vendors
  • 2.4.1 Cavli Wireless
  • 2.4.2 China Mobile IoT
  • 2.4.3 Eagle Wireless
  • 2.4.4 Fibocom
  • 2.4.5 Kontron
  • 2.4.6 Lierda
  • 2.4.7 MeiG Smart Technology
  • 2.4.8 Murata
  • 2.4.9 Neoway
  • 2.4.10 Nordic Semiconductor
  • 2.4.11 Quectel
  • 2.4.12 Rolling Wireless
  • 2.4.13 Semtech
  • 2.4.14 Sunsea AIoT (SIMCom & Longsung)
  • 2.4.15 Telit Cinterion
  • 2.4.16 Trasna
  • 2.4.17 ZxInfoTek
  • 2.4.18 Other cellular IoT module vendors

3 LoRa and LoRaWAN Ecosystem

• 3.1 Technology characteristics
• 3.2 Network footprint
  • 3.2.1 Europe
  • 3.2.2 Asia-Pacific
  • 3.2.3 The Americas
  • 3.2.4 Middle East & Africa
• 3.3 Semiconductor and module vendors
  • 3.3.1 Semtech
  • 3.3.2 Other semiconductor vendors
  • 3.3.3 LoRa module vendors

4 Sigfox Ecosystem

• 4.1 Technology characteristics
• 4.2 Network footprint
  • 4.2.1 Europe
  • 4.2.2 The Americas
  • 4.2.3 Asia-Pacific
  • 4.2.4 Middle East & Africa
  • 4.2.5 UnaBiz partners with the LoRaWAN ecosystem
  • 4.2.6 Examples of major Sigfox use cases
• 4.3 Semiconductor and module vendors
  • 4.3.1 Semiconductor vendors
  • 4.3.2 Sigfox module vendors

5 Emerging Low-Power IoT Connectivity Ecosystems

• 5.1 IEEE 802.15.4
  • 5.1.1 Connectivity stacks based on 802.15.4
  • 5.1.2 Network footprint
• 5.2 Wirepas Mesh
• 5.3 DECT-2020 NR (NR+)
• 5.4 Mioty
• 5.5 Chipset and module vendors

6 Market Forecasts and Trends

• 6.1 Market summary
• 6.2 The cellular IoT device market
  • 6.2.1 The cellular IoT chipset market shares
  • 6.2.2 Cellular IoT module market shares
  • 6.2.3 Automotive cellular IoT chipset market shares
  • 6.2.4 NAD module market shares
• 6.3 The cellular IoT technology landscape
• 6.4 Cellular IoT regional market trends
  • 6.4.1 Europe
  • 6.4.2 North America
  • 6.4.3 Latin America
  • 6.4.4 China
  • 6.4.5 Rest of Asia-Pacific
  • 6.4.6 Middle East & Africa
• 6.5 The LoRa device market
• 6.6 The Sigfox device market
• 6.7 Emerging low-power IoT connectivity technologies

List of Acronyms and Abbreviations