시장보고서
상품코드
1814240

AI용 첨단 일렉트로닉스 기술(2026-2036년)

Advanced Electronics Technologies for AI 2026-2036

발행일: | 리서치사: Future Markets, Inc. | 페이지 정보: 영문 692 Pages, 173 Tables, 146 Figures | 배송안내 : 즉시배송

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

AI 혁명은 중요한 변곡점에 서 있습니다. 복잡한 도시 환경을 탐색하는 자율주행차부터 방대한 유전체 데이터 세트를 처리하는 개인 맞춤형 의료 진단에 이르기까지, 세계 경제의 모든 부문에서 AI 용도이 확산됨에 따라 컴퓨팅 수요는 기존 실리콘 기반 아키텍처의 처리 능력을 능가하고 있습니다. 뉴로모픽 컴퓨팅, 양자 컴퓨팅, 엣지 AI 프로세서의 융합은 단순한 진화의 진전이 아니라 향후 10년 이후 AI의 궤도를 결정하는 근본적인 패러다임의 전환을 의미합니다. 이러한 기술적 수렴은 서로 다른 AI 워크로드가 근본적으로 다른 컴퓨팅 접근 방식을 필요로 한다는 인식에서 비롯됐습니다. 반세기 이상 디지털 혁명의 촉진제 역할을 해온 전통적인 폰노이만 아키텍처는 현대 AI 시스템의 다양한 요구사항, 즉 대규모 언어 모델 학습을 위한 대규모 병렬 처리 요구, 자율 시스템의 초저지연 요구사항, 모바일 및 IoT 디바이스의 에너지 제약, 동적 환경에 대한 실시간 적응력 등 극복해야 할 과제에 직면해 있습니다. 제약, 동적 환경에 필요한 실시간 적응 능력을 충족하는 데 있어 극복할 수 없는 문제에 직면해 있습니다.

반도체 산업은 무어의 법칙(트랜지스터 밀도가 약 2년마다 2배씩 증가한다는 관측)을 준수해 왔지만, 근본적인 물리적 한계에 도달했습니다. 트랜지스터가 원자 크기에 가까워짐에 따라 양자 효과, 제조 비용, 전력 밀도 문제로 인해 지속적인 미세화는 점점 더 어려워지고 있습니다. 모델의 복잡성과 데이터 양이 기하급수적으로 증가함에 따라 기존의 스케일링 접근 방식으로는 더 이상 대응할 수 없기 때문입니다. 이에 대한 대응책으로 특정 AI 워크로드에 최적화된 도메인별 아키텍처로 결정적인 전환이 이루어지고 있습니다. GPU(Graphics Processing Unit)는 딥 뉴럴 네트워크 학습을 위한 초병렬 처리 기능을 제공함으로써 이러한 변화에 착수했습니다. TPU(Tensor Processing Unit)가 그 뒤를 이어 머신러닝 알고리즘의 핵심인 행렬 연산에 특화된 가속화를 제공하게 되었습니다. 그러나 이러한 솔루션은 보다 심오한 아키텍처 혁명의 시작에 불과합니다.

뉴로모픽 컴퓨팅은 인간 두뇌의 뛰어난 효율성과 적응성에서 영감을 얻어, 이벤트가 발생했을 때만 정보를 처리하는 스파이킹 신경망을 구현함으로써 기존의 연속적으로 작동하는 프로세서에 비해 전력 소비를 획기적으로 줄입니다. 이 이벤트 기반 처리 패러다임은 센서 데이터를 처리하는 자율주행차, 환경 조건을 모니터링하는 IoT 장치 등 상시 센싱과 실시간 적응이 필요한 용도에 특히 유용합니다. 이 기술의 상업적 가능성은 인텔의 Loihi 2 뉴로모픽 연구 칩과 IBM의 TrueNorth 프로세서와 같은 선구적인 구현을 통해 입증되었습니다. 브레인칩(BrainChip)과 같은 스타트업은 엣지 AI 용도를 위한 뉴로모픽 액셀러레이터를 상용화하고 있으며, 프로페시(Prophesee)와 같은 기업은 마이크로초 단위의 시간 해상도와 최소한의 전력 소비로 빠른 동작을 포착할 수 있는 뉴로모픽 비전 센서를 개발하고 있습니다. 개발하고 있습니다. 뉴로모픽 시스템은 에너지 효율성뿐만 아니라, 시간적 데이터 처리, 인메모리 컴퓨팅 실행, 대규모 재교육이 필요 없는 지속적인 학습을 실현하는 데 있어 고유한 이점을 제공합니다. 이러한 능력은 산업용 예지보전부터 실시간 환경 파악이 필요한 AR 시스템까지 다양한 응용 분야에 필수적인 것으로 입증되었습니다.

양자 컴퓨팅은 디지털 컴퓨터가 발명된 이래로 연산 능력에 있어 가장 혁명적인 발전일 것입니다. 중첩과 얽힘을 포함한 양자 현상을 활용하면 양자 시스템은 고전 컴퓨터보다 기하급수적으로 빠르게 특정 클래스의 문제를 해결할 수 있습니다. AI의 경우, 이 능력은 최적화, 패턴 인식, 머신러닝 알고리즘 개발에서 혁신적인 발전을 약속합니다.

본 보고서에서는 뉴로모픽 컴퓨팅, 양자 컴퓨팅, 엣지 AI 프로세서의 3가지 기술에 대해 조사 분석했으며, 2026-2036년까지의 상세한 시장 예측과 함께 기술 발전, 경쟁 구도 등의 정보를 제공합니다.

목차

제1장 서론

  • 뉴로모픽 컴퓨팅과 양자 컴퓨팅의 융합 가능성
  • 엣지 AI와 뉴로모픽 시스템의 통합
  • 하이브리드 컴퓨팅 아키텍처 개발
  • 멀티모달 AI 처리 시스템의 진화
  • 에코시스템의 표준화 요건

제2장 뉴로모픽 컴퓨팅

  • 뉴로모픽 컴퓨팅 및 센싱 시장 개요
  • 뉴로모픽 컴퓨팅과 생성형 AI
  • 시장 밸류체인
  • 시장 맵
  • 자금조달과 투자
  • 전략적 파트너십과 제휴
  • 규제와 윤리에 관한 고려사항
  • 지속가능성과 환경에 대한 영향
  • 서론
  • 뉴로모픽 컴퓨팅 기술과 아키텍처
  • 뉴로모픽 센싱 기술과 아키텍처
  • 시장 분석과 예측
  • 뉴로모픽 컴퓨팅 기업 개요(기업 144개사 개요)

제3장 양자 컴퓨팅

  • 제1/제2 양자 혁명
  • 현재의 양자 컴퓨팅 시장 구도
  • 투자 상황
  • 세계의 정부 이니셔티브
  • 시장 구도
  • 최근의 양자 컴퓨팅 산업 발전(2023년-2025년)
  • 양자 컴퓨팅 최종 용도 시장과 이점
  • 비즈니스 모델
  • 로드맵
  • 양자 기술 채택 과제
  • SWOT 분석
  • 양자 컴퓨팅 밸류체인
  • 양자 컴퓨팅과 AI
  • 세계 시장 예측(2025년-2046년)
  • 서론
  • 양자 알고리즘
  • 양자 컴퓨팅 하드웨어
  • 양자 컴퓨팅 인프라
  • 양자 컴퓨팅 소프트웨어
  • 양자 컴퓨팅 시장과 용도
  • 양자 컴퓨팅 기업 개요(기업 218개사 개요)

제4장 엣지 AI 프로세서

  • 시장 개요
  • 엣지 AI 기술 아키텍처
  • 애플리케이션 시장 분석
  • 경쟁 구도와 시장 기업
  • 시장 성장 촉진요인과 기술 동향
  • 엣지 AI 프로세서 기업 개요(기업 49개사 개요)

제5장 참고 문헌

LSH 25.09.25

The artificial intelligence revolution stands at a critical inflection point. As AI applications proliferate across every sector of the global economy-from autonomous vehicles navigating complex urban environments to personalized medical diagnostics processing vast genomic datasets-the computational demands have outstripped the capabilities of traditional silicon-based architectures. The convergence of neuromorphic computing, quantum computing, and edge AI processors represents not merely an evolutionary advancement, but a fundamental paradigm shift that will determine the trajectory of artificial intelligence for the next decade and beyond. This technological convergence emerges from the recognition that different AI workloads require fundamentally different computational approaches. Traditional von Neumann architectures, which have powered the digital revolution for over half a century, face insurmountable challenges in meeting the diverse requirements of modern AI systems: the massive parallel processing demands of training large language models, the ultra-low latency requirements of autonomous systems, the energy constraints of mobile and IoT devices, and the real-time adaptation capabilities needed for dynamic environments.

The semiconductor industry's adherence to Moore's Law-the observation that transistor density doubles approximately every two years-has reached fundamental physical limits. As transistors approach atomic dimensions, quantum effects, manufacturing costs, and power density challenges have made continued scaling increasingly difficult. This limitation has profound implications for AI development, as the exponential growth in model complexity and data volumes can no longer be supported through traditional scaling approaches. The response has been a decisive shift toward domain-specific architectures optimized for particular AI workloads. Graphics Processing Units (GPUs) initiated this transformation by providing massively parallel processing capabilities for training deep neural networks. Tensor Processing Units (TPUs) followed, offering specialized acceleration for matrix operations core to machine learning algorithms. However, these solutions represent only the beginning of a more profound architectural revolution.

Neuromorphic computing draws inspiration from the human brain's remarkable efficiency and adaptability, implementing spiking neural networks that process information only when events occur, dramatically reducing power consumption compared to traditional continuously-operating processors. This event-driven processing paradigm proves particularly valuable for applications requiring always-on sensing and real-time adaptation, such as autonomous vehicles processing sensor data or IoT devices monitoring environmental conditions. The technology's commercial viability has been demonstrated through pioneering implementations including Intel's Loihi 2 neuromorphic research chip and IBM's TrueNorth processor. Startups like BrainChip have commercialized neuromorphic accelerators for edge AI applications, while companies like Prophesee have developed neuromorphic vision sensors capable of capturing high-speed motion with microsecond temporal resolution and minimal power consumption. Beyond energy efficiency, neuromorphic systems offer unique advantages in handling temporal data, performing in-memory computation, and enabling continuous learning without extensive retraining. These capabilities prove essential for applications ranging from industrial predictive maintenance to augmented reality systems requiring real-time environmental understanding.

Quantum computing represents perhaps the most revolutionary advancement in computational capability since the invention of digital computers. By leveraging quantum phenomena including superposition and entanglement, quantum systems can potentially solve certain classes of problems exponentially faster than classical computers. For artificial intelligence, this capability promises transformative advances in optimization, pattern recognition, and machine learning algorithm development. Quantum machine learning algorithms like quantum support vector machines and quantum neural networks demonstrate the potential for processing vast datasets more efficiently than classical approaches. Quantum optimization algorithms show particular promise for solving complex combinatorial problems common in AI applications, from drug discovery molecular simulations to financial portfolio optimization and supply chain management. Major technology companies including IBM, Google, and IonQ have developed increasingly sophisticated quantum processors, while cloud-based quantum computing services democratize access to quantum capabilities for AI researchers and developers. The integration of quantum and classical computing through hybrid architectures enables practical applications that leverage quantum advantages while maintaining compatibility with existing AI workflows. The proliferation of connected devices and the need for real-time AI processing has driven the development of specialized edge AI processors capable of running sophisticated algorithms directly on mobile devices, IoT sensors, and embedded systems. This distributed intelligence paradigm addresses critical limitations of cloud-based AI processing: network latency, bandwidth constraints, privacy concerns, and the need for autonomous operation in connectivity-challenged environments.

Edge AI processors employ diverse architectural approaches including dedicated neural processing units (NPUs), analog computing techniques, and neuromorphic processing elements optimized for specific workloads. Companies like NVIDIA with their Jetson ecosystem, Qualcomm with integrated AI accelerators, and startups like Mythic with analog matrix processors are pioneering solutions that deliver increasingly sophisticated AI capabilities within the power and size constraints of edge devices.

The convergence of these three technological domains creates unprecedented opportunities for solving AI's most challenging problems. Neuromorphic principles could enhance quantum error correction and control systems. Quantum algorithms might accelerate neuromorphic network training and optimization. Edge processors could enable hybrid quantum-classical computing workflows and distribute neuromorphic processing capabilities across IoT networks. This technological convergence is reshaping not only the capabilities of AI systems but also the economic dynamics of the technology industry. The market represents a fundamental shift from general-purpose computing platforms to specialized architectures optimized for specific AI workloads, creating new competitive dynamics and investment opportunities across the entire technology ecosystem.

"Advanced Electronics Technologies for AI 2026-2036" analyzes the convergence of three revolutionary electronics technologies reshaping the artificial intelligence landscape: neuromorphic computing, quantum computing, and edge AI processors. The report provides detailed market forecasts spanning 2026-2036, examining market dynamics across multiple technology vectors that collectively represent a transformative shift from conventional von Neumann architectures to specialized, brain-inspired, quantum-enhanced, and edge-distributed computing platforms. Our analysis reveals a rapidly accelerating market trajectory driven by exponential demand for energy-efficient, real-time AI processing capabilities across autonomous systems, healthcare applications, industrial automation, and smart city infrastructures.

Technology convergence analysis examines synergistic interactions between these three domains, identifying cross-platform opportunities where quantum algorithms enhance neuromorphic training, where edge processors enable hybrid quantum-classical workflows, and where neuromorphic principles improve quantum error correction systems. The report provides detailed assessments of hybrid computing architectures, multi-modal AI processing systems, and ecosystem standardization requirements driving interoperability across diverse computing platforms. Market segmentation delivers granular analysis across vertical applications including automotive (autonomous vehicles, ADAS), healthcare (medical devices, diagnostics, prosthetics), industrial IoT (predictive maintenance, quality control), smart cities (traffic management, environmental monitoring), aerospace/defense (UAVs, satellite imaging, cybersecurity), and data center infrastructure (high-performance computing, cloud services). Regional market analysis covers North America, Europe, Asia-Pacific, and emerging markets, examining technology adoption patterns, government initiatives, and investment landscapes.

Competitive landscape intelligence provides comprehensive profiles of >400 companies across all three technology domains. Neuromorphic computing profiles span chip manufacturers, sensor developers, memory technology providers, and software framework developers. Quantum computing coverage includes platform providers, specialized hardware companies, software developers, and materials suppliers. Edge AI processor analysis encompasses established semiconductor companies alongside innovative start-ups.

Investment analysis evaluates funding trends, strategic partnerships, and market opportunities across $2+ trillion in combined market potential through 2036. The report includes detailed venture capital analysis, government funding initiatives, corporate R&D investments, and strategic acquisition activity shaping competitive dynamics. Manufacturing capacity analysis addresses supply chain vulnerabilities, quality control procedures, and fabrication process requirements for next-generation computing architectures.

Report contents include:

  • Neuromorphic Computing
    • Market overview with global revenues 2024-2036 and segmentation analysis
    • Moore's Law limitations driving neuromorphic adoption
    • Technology architectures: spiking neural networks, memory approaches, hardware processors
    • Sensing technologies: event-based sensors, hybrid approaches, bio-inspired designs
    • Application markets: mobile/consumer, automotive, industrial, healthcare, aerospace/defense, datacenters
    • Competitive landscape with 144 company profiles
    • Regional market analysis and forecasts
    • Technology roadmaps and emerging trends
    • Investment landscape and strategic partnerships
    • Regulatory considerations and sustainability impact
  • Quantum Computing
    • First and second quantum revolution context
    • Current market landscape with technical progress assessment
    • Investment analysis covering $billions in funding 2024-2025
    • Global government initiatives across major economies
    • Business models and market dynamics
    • Hardware technologies: superconducting, trapped ion, silicon spin, photonic, topological qubits
    • Software stack and quantum algorithms
    • Infrastructure requirements and cloud services
    • Applications across pharmaceuticals, chemicals, transportation, financial services, automotive
    • Materials requirements: superconductors, photonics, nanomaterials
    • 200+ company profiles spanning entire value chain
  • Edge AI Processors
    • Market size evolution and geographic distribution
    • Technology architectures: NPUs, SoC integration, power optimization
    • Application analysis: industrial IoT, smartphones, automotive, smart cities, healthcare
    • Competitive landscape covering established players and startups
    • Market drivers: latency requirements, privacy imperatives, bandwidth limitations
    • 49 detailed company profiles
    • Technology trends and future roadmaps
  • Profiles of 401 companies. Companies profiled include ABR (Applied Brain Research), AiM Future, AI Storm, AlpsenTek, Amazon Web Services, Ambarella, Ambient Scientific, AMD, ANAFLASH, Analog Inference, AnotherBrain, Apple, ARM, Aryballe Technologies, Aspinity, Avalanche Technology, Axelera AI, Baidu, Beijing Xinzhida Neurotechnology, A* Quantum, AbaQus, Aegiq, Agnostiq, Airbus, Alice&Bob, Aliro Quantum, Alpine Quantum Technologies, Anyon Systems, Archer Materials, Arclight Quantum, Arctic Instruments, ARQUE Systems, Atlantic Quantum, Atom Computing, Atom Quantum Labs, Atos Quantum, Baidu, BEIT, Bifrost Electronics, Advanced Micro Devices, Alpha ICs, Amazon Web Services, Ambarella, Anaflash, Apple, Axelera AI, Axera Semiconductor, Blaize, BrainChip Holdings, Cerebras Systems, Corerain Technologies, DEEPX, DeGirum, EdgeCortix, Efinix, Enerzai, Google, Graphcore, GreenWaves Technologies and more.....

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Neuromorphic-Quantum Computing Convergence Potential
  • 1.2. Edge AI and Neuromorphic System Integration
  • 1.3. Hybrid Computing Architecture Development
  • 1.4. Multi-Modal AI Processing System Evolution
  • 1.5. Ecosystem Standardization Requirements

2. NEUROMORPHIC COMPUTING

  • 2.1. Overview of the neuromorphic computing and sensing market
    • 2.1.1. Global Market Revenues 2024-2036
    • 2.1.2. Market segmentation
    • 2.1.3. Ending of Moore's Law
    • 2.1.4. Historical market
    • 2.1.5. Key market trends and growth drivers
    • 2.1.6. Market challenges and limitations
    • 2.1.7. Future outlook and opportunities
      • 2.1.7.1. Emerging trends
        • 2.1.7.1.1. Hybrid Neuromorphic-Conventional Computing and Sensing Systems
        • 2.1.7.1.2. Edge AI and IoT
        • 2.1.7.1.3. Quantum Computing
        • 2.1.7.1.4. Explainable AI
        • 2.1.7.1.5. Brain-Computer Interfaces
        • 2.1.7.1.6. Energy-efficient AI at scale
        • 2.1.7.1.7. Real-time learning and adaptation
        • 2.1.7.1.8. Enhanced Perception Systems
        • 2.1.7.1.9. Large-scale Neuroscience Simulations
        • 2.1.7.1.10. Secure, Decentralized AI
        • 2.1.7.1.11. Robotics that mimic humans
        • 2.1.7.1.12. Neural implants for healthcare
        • 2.1.7.1.13. New Application Areas and Use Cases
        • 2.1.7.1.14. Disruptive Business Models and Services
        • 2.1.7.1.15. Collaborative Ecosystem Development
        • 2.1.7.1.16. Skill Development and Workforce Training
      • 2.1.7.2. Technology roadmap
  • 2.2. Neuromorphic computing and generative AI
  • 2.3. Market value chain
  • 2.4. Market map
  • 2.5. Funding and investments
  • 2.6. Strategic Partnerships and Collaborations
  • 2.7. Regulatory and Ethical Considerations
    • 2.7.1. Data Privacy and Security
    • 2.7.2. Bias and Fairness in Neuromorphic Systems
    • 2.7.3. Intellectual Property and Patent Landscape
  • 2.8. Sustainability and Environmental Impact
    • 2.8.1. Carbon Footprint Analysis of Neuromorphic Systems
    • 2.8.2. Energy Efficiency Metrics and Benchmarking
    • 2.8.3. Green Manufacturing Practices
    • 2.8.4. End-of-life and Recycling Considerations
    • 2.8.5. Environmental Regulations Compliance
  • 2.9. Introduction
    • 2.9.1. Definition and concept of neuromorphic computing and sensing
    • 2.9.2. Main neuromorphic approaches
      • 2.9.2.1. Large-scale hardware neuromorphic computing systems
      • 2.9.2.2. Non-volatile memory technologies
      • 2.9.2.3. Advanced memristive materials and devices
    • 2.9.3. Fabrication Processes for Neuromorphic Systems
    • 2.9.4. Key Material Suppliers
    • 2.9.5. Supply Chain Vulnerabilities and Mitigation
    • 2.9.6. Manufacturing Capacity Analysis
    • 2.9.7. Quality Control and Testing Procedures
    • 2.9.8. Comparison with traditional computing and sensing approaches
    • 2.9.9. Neuromorphic computing vs. quantum computing
    • 2.9.10. Key features and advantages
      • 2.9.10.1. Low latency and real-time processing
      • 2.9.10.2. Power efficiency and energy savings
      • 2.9.10.3. Scalability and adaptability
      • 2.9.10.4. Online learning and autonomous decision-making
    • 2.9.11. Markets and Applications
      • 2.9.11.1. Edge AI and IoT
      • 2.9.11.2. Autonomous Vehicles and Robotics
      • 2.9.11.3. Cybersecurity and Anomaly Detection
      • 2.9.11.4. Smart Sensors and Monitoring Systems
      • 2.9.11.5. Datacenter and High-Performance Computing
  • 2.10. Neuromorphic Computing Technologies and Architecture
    • 2.10.1. Spiking Neural Networks (SNNs)
      • 2.10.1.1. Biological inspiration and principles
      • 2.10.1.2. Types of SNNs and their characteristics
      • 2.10.1.3. Advantages and limitations of SNNs
    • 2.10.2. Memory Architectures for Neuromorphic Computing
      • 2.10.2.1. Conventional memory approaches (SRAM, DRAM)
      • 2.10.2.2. Emerging non-volatile memory (eNVM) technologies
        • 2.10.2.2.1. Phase-Change Memory (PCM)
        • 2.10.2.2.2. Resistive RAM (RRAM)
        • 2.10.2.2.3. Magnetoresistive RAM (MRAM)
        • 2.10.2.2.4. Ferroelectric RAM (FeRAM)
      • 2.10.2.3. In-memory computing and near-memory computing
      • 2.10.2.4. Hybrid memory architectures
    • 2.10.3. Neuromorphic Hardware and Processors
      • 2.10.3.1. Digital neuromorphic processors
      • 2.10.3.2. Analog neuromorphic processors
      • 2.10.3.3. Mixed-signal neuromorphic processors
      • 2.10.3.4. FPGA-based neuromorphic systems
      • 2.10.3.5. Neuromorphic accelerators and co-processors
    • 2.10.4. Software and Frameworks for Neuromorphic Computing
      • 2.10.4.1. Neuromorphic programming languages and tools
      • 2.10.4.2. Neuromorphic simulation platforms and frameworks
      • 2.10.4.3. Neuromorphic algorithm libraries and repositories
      • 2.10.4.4. Neuromorphic software development kits (SDKs)
  • 2.11. Neuromorphic Sensing Technologies and Architectures
    • 2.11.1. Event-Based Sensors and Processing
      • 2.11.1.1. Neuromorphic vision sensors
      • 2.11.1.2. Neuromorphic auditory sensors
      • 2.11.1.3. Neuromorphic olfactory sensors
      • 2.11.1.4. Event-driven processing and algorithms
    • 2.11.2. Hybrid Sensing Approaches
      • 2.11.2.1. Combination of conventional and event-based sensors
      • 2.11.2.2. Fusion of multiple sensing modalities
      • 2.11.2.3. Advantages and challenges of hybrid sensing
    • 2.11.3. Neuromorphic Sensor Architectures and Designs
      • 2.11.3.1. Pixel-level processing and computation
      • 2.11.3.2. Sensor-processor co-design and integration
      • 2.11.3.3. Bio-inspired sensor designs and materials
    • 2.11.4. Signal Processing and Feature Extraction Techniques
      • 2.11.4.1. Spike-based Encoding and Decoding
      • 2.11.4.2. Temporal and Spatiotemporal Feature Extraction
      • 2.11.4.3. Neuromorphic Filtering and Denoising
      • 2.11.4.4. Adaptive and Learning-Based Processing
  • 2.12. Market Analysis and Forecasts
    • 2.12.1. Mobile and Consumer Applications
      • 2.12.1.1. Smartphones and wearables
      • 2.12.1.2. Smart home and IoT devices
      • 2.12.1.3. Consumer health and wellness
      • 2.12.1.4. Entertainment and gaming
    • 2.12.2. Automotive and Transportation
      • 2.12.2.1. Advanced Driver Assistance Systems (ADAS)
      • 2.12.2.2. Autonomous vehicles and robotaxis
      • 2.12.2.3. Vehicle infotainment and user experience
      • 2.12.2.4. Smart traffic management and infrastructure
    • 2.12.3. Industrial and Manufacturing
      • 2.12.3.1. Industrial IoT and smart factories
      • 2.12.3.2. Predictive maintenance and anomaly detection
      • 2.12.3.3. Quality control and inspection
      • 2.12.3.4. Logistics and supply chain optimization
    • 2.12.4. Healthcare and Medical Devices
      • 2.12.4.1. Medical imaging and diagnostics
      • 2.12.4.2. Wearable health monitoring devices
      • 2.12.4.3. Personalized medicine and drug discovery
      • 2.12.4.4. Assistive technologies and prosthetics
    • 2.12.5. Aerospace and Defense
      • 2.12.5.1. Unmanned Aerial Vehicles (UAVs) and drones
      • 2.12.5.2. Satellite imaging and remote sensing
      • 2.12.5.3. Missile guidance and target recognition
      • 2.12.5.4. Cybersecurity and threat detection:
    • 2.12.6. Datacenters and Cloud Services
      • 2.12.6.1. High-performance computing and scientific simulations:
      • 2.12.6.2. Big data analytics and machine learning
      • 2.12.6.3. Cloud-based AI services and platforms
      • 2.12.6.4. Energy-efficient datacenter infrastructure
    • 2.12.7. Regional Market Analysis and Forecasts
    • 2.12.8. Competitive Landscape and Key Players
      • 2.12.8.1. Overview of the Neuromorphic Computing and Sensing Ecosystem
      • 2.12.8.2. Neuromorphic Chip Manufacturers and Processors
      • 2.12.8.3. Neuromorphic Sensor Manufacturers
      • 2.12.8.4. Emerging Non-Volatile Memory (eNVM) Manufacturers
      • 2.12.8.5. Neuromorphic Software and Framework Providers
      • 2.12.8.6. Research Institutions and Academia
    • 2.12.9. Competing Emerging Technologies
      • 2.12.9.1. Quantum Computing
      • 2.12.9.2. Photonic Computing
      • 2.12.9.3. DNA Computing
      • 2.12.9.4. Spintronic Computing
      • 2.12.9.5. Chemical Computing
      • 2.12.9.6. Superconducting Computing
      • 2.12.9.7. Analog AI Chips
      • 2.12.9.8. In-Memory Computing
      • 2.12.9.9. Reversible Computing
      • 2.12.9.10. Quantum Dot Computing
      • 2.12.9.11. Technology Substitution Analysis
      • 2.12.9.12. Migration Pathways
      • 2.12.9.13. Comparative Advantages/Disadvantages
  • 2.13. Neuromorphic Computing Company Profiles (144 company profiles)

3. QUANTUM COMPUTING

  • 3.1. First and Second quantum revolutions
  • 3.2. Current quantum computing market landscape
    • 3.2.1. Technical Progress and Persistent Challenges
    • 3.2.2. Key developments
  • 3.3. Investment Landscape
    • 3.3.1. Quantum Technologies Investments 2024-2025
  • 3.4. Global Government Initiatives
  • 3.5. Market Landscape
  • 3.6. Recent Quantum Computing Industry Developments 2023-2025
  • 3.7. End Use Markets and Benefits of Quantum Computing
  • 3.8. Business Models
  • 3.9. Roadmap
  • 3.10. Challenges for Quantum Technologies Adoption
  • 3.11. SWOT analysis
  • 3.12. Quantum Computing Value Chain
  • 3.13. Quantum Computing and Artificial Intelligence
  • 3.14. Global market forecast 2025-2046
    • 3.14.1. Revenues
    • 3.14.2. Installed Base Forecast
      • 3.14.2.1. By system
      • 3.14.2.2. By technology
    • 3.14.3. Pricing
    • 3.14.4. Hardware
      • 3.14.4.1. By system
      • 3.14.4.2. By technology
    • 3.14.5. Quantum Computing in Data centres
  • 3.15. Introduction
    • 3.15.1. What is quantum computing?
    • 3.15.2. Operating principle
    • 3.15.3. Classical vs quantum computing
    • 3.15.4. Quantum computing technology
      • 3.15.4.1. Quantum emulators
      • 3.15.4.2. Quantum inspired computing
      • 3.15.4.3. Quantum annealing computers
      • 3.15.4.4. Quantum simulators
      • 3.15.4.5. Digital quantum computers
      • 3.15.4.6. Continuous variables quantum computers
      • 3.15.4.7. Measurement Based Quantum Computing (MBQC)
      • 3.15.4.8. Topological quantum computing
      • 3.15.4.9. Quantum Accelerator
    • 3.15.5. Competition from other technologies
    • 3.15.6. Market Overview
      • 3.15.6.1. Investment in Quantum Computing
      • 3.15.6.2. Business Models
        • 3.15.6.2.1. Quantum as a Service (QaaS)
        • 3.15.6.2.2. Strategic partnerships
        • 3.15.6.2.3. Vertically integrated and modular
        • 3.15.6.2.4. Mixed quantum stacks
      • 3.15.6.3. Semiconductor Manufacturers
  • 3.16. Quantum Algorithms
    • 3.16.1. Quantum Software Stack
      • 3.16.1.1. Quantum Machine Learning
      • 3.16.1.2. Quantum Simulation
      • 3.16.1.3. Quantum Optimization
      • 3.16.1.4. Quantum Cryptography
        • 3.16.1.4.1. Quantum Key Distribution (QKD)
        • 3.16.1.4.2. Post-Quantum Cryptography
  • 3.17. Quantum Computing Hardware
    • 3.17.1. Qubit Technologies
      • 3.17.1.1. Overview
      • 3.17.1.2. Noise effects
      • 3.17.1.3. Logical qubits
      • 3.17.1.4. Quantum Volume
      • 3.17.1.5. Algorithmic Qubits
      • 3.17.1.6. Superconducting Qubits
        • 3.17.1.6.1. Technology description
        • 3.17.1.6.2. Initialization, Manipulation, and Readout
        • 3.17.1.6.3. Materials
        • 3.17.1.6.4. Market players
        • 3.17.1.6.5. Roadmap
        • 3.17.1.6.6. Swot analysis
      • 3.17.1.7. Trapped Ion Qubits
        • 3.17.1.7.1. Technology description
        • 3.17.1.7.2. Initialization, Manipulation, and Readout
        • 3.17.1.7.3. Hardware
        • 3.17.1.7.4. Materials
          • 3.17.1.7.4.1. Integrating optical components
          • 3.17.1.7.4.2. Incorporating high-quality mirrors and optical cavities
          • 3.17.1.7.4.3. Engineering the vacuum packaging and encapsulation
          • 3.17.1.7.4.4. Removal of waste heat
        • 3.17.1.7.5. Roadmap
        • 3.17.1.7.6. Market players
        • 3.17.1.7.7. Swot analysis
      • 3.17.1.8. Silicon Spin Qubits
        • 3.17.1.8.1. Technology description
        • 3.17.1.8.2. Initialization, Manipulation, and Readout
        • 3.17.1.8.3. Integration with CMOS Electronics
        • 3.17.1.8.4. Quantum dots
        • 3.17.1.8.5. Market players
        • 3.17.1.8.6. SWOT analysis
      • 3.17.1.9. Topological Qubits
        • 3.17.1.9.1. Technology description
          • 3.17.1.9.1.1. Cryogenic cooling
        • 3.17.1.9.2. Initialization, Manipulation, and Readout of Topological Qubits
        • 3.17.1.9.3. Scaling topological qubit arrays
        • 3.17.1.9.4. Roadmap
        • 3.17.1.9.5. Market players
        • 3.17.1.9.6. SWOT analysis
      • 3.17.1.10. Photonic Qubits
        • 3.17.1.10.1. Photonics for Quantum Computing
        • 3.17.1.10.2. Technology description
        • 3.17.1.10.3. Initialization, Manipulation, and Readout
        • 3.17.1.10.4. Hardware Architecture
        • 3.17.1.10.5. Roadmap
        • 3.17.1.10.6. Market players
        • 3.17.1.10.7. Swot analysis
      • 3.17.1.11. Neutral atom (cold atom) qubits
        • 3.17.1.11.1. Technology description
        • 3.17.1.11.2. Market players
        • 3.17.1.11.3. Swot analysis
      • 3.17.1.12. Diamond-defect qubits
        • 3.17.1.12.1. Technology description
        • 3.17.1.12.2. SWOT analysis
        • 3.17.1.12.3. Market players
      • 3.17.1.13. Quantum annealers
        • 3.17.1.13.1. Technology description
        • 3.17.1.13.2. Initialization and Readout of Quantum Annealers
        • 3.17.1.13.3. Solving combinatorial optimization
        • 3.17.1.13.4. Applications
        • 3.17.1.13.5. Roadmap
        • 3.17.1.13.6. SWOT analysis
        • 3.17.1.13.7. Market players
    • 3.17.2. Architectural Approaches
  • 3.18. Quantum Computing Infrastructure
    • 3.18.1. Infrastructure Requirements
    • 3.18.2. Hardware agnostic platforms
    • 3.18.3. Cryostats
    • 3.18.4. Qubit readout
  • 3.19. Quantum Computing Software
    • 3.19.1. Technology description
    • 3.19.2. Cloud-based services- QCaaS (Quantum Computing as a Service)
    • 3.19.3. Market players
  • 3.20. Markets and Applications for Quantum Computing
    • 3.20.1. Pharmaceuticals
      • 3.20.1.1. Market overview
        • 3.20.1.1.1. Drug discovery
        • 3.20.1.1.2. Diagnostics
        • 3.20.1.1.3. Molecular simulations
        • 3.20.1.1.4. Genomics
        • 3.20.1.1.5. Proteins and RNA folding
      • 3.20.1.2. Market players
    • 3.20.2. Chemicals
      • 3.20.2.1.1. Market overview
      • 3.20.2.2. Market players
    • 3.20.3. Transportation
      • 3.20.3.1. Market overview
      • 3.20.3.2. Market players
    • 3.20.4. Financial services
      • 3.20.4.1. Market overview
      • 3.20.4.2. Market players
    • 3.20.5. Automotive
      • 3.20.5.1. Market overview
      • 3.20.5.2. Market players
    • 3.20.6. Other Crossover Technologies
      • 3.20.6.1. Quantum chemistry and AI
        • 3.20.6.1.1. Technology description
        • 3.20.6.1.2. Applications
        • 3.20.6.1.3. Market players
      • 3.20.6.2. Quantum Communications
        • 3.20.6.2.1. Technology description
        • 3.20.6.2.2. Types
        • 3.20.6.2.3. Applications
        • 3.20.6.2.4. Market players
      • 3.20.6.3. Quantum Sensors
        • 3.20.6.3.1. Technology description
        • 3.20.6.3.2. Applications
        • 3.20.6.3.3. Companies
    • 3.20.7. Quantum Computing and AI
      • 3.20.7.1. Introduction
      • 3.20.7.2. Applications
      • 3.20.7.3. AI Interfacing with Quantum Computing
      • 3.20.7.4. AI in Classical Computing
      • 3.20.7.5. Market Players and Strategies
      • 3.20.7.6. Relationship between quantum computing and artificial intelligence
    • 3.20.8. Materials for Quantum Computing
      • 3.20.8.1. Superconductors
        • 3.20.8.1.1. Overview
        • 3.20.8.1.2. Types and Properties
        • 3.20.8.1.3. Temperature (Tc) of superconducting materials
        • 3.20.8.1.4. Superconducting Nanowire Single Photon Detectors (SNSPD)
        • 3.20.8.1.5. Kinetic Inductance Detectors (KIDs)
        • 3.20.8.1.6. Transition Edge Sensors (TES)
        • 3.20.8.1.7. Opportunities
      • 3.20.8.2. Photonics, Silicon Photonics and Optical Components
        • 3.20.8.2.1. Overview
        • 3.20.8.2.2. Types and Properties
        • 3.20.8.2.3. Vertical-Cavity Surface-Emitting Lasers (VCSELs)
        • 3.20.8.2.4. Alkali azides
        • 3.20.8.2.5. Optical Fiber and Quantum Interconnects
        • 3.20.8.2.6. Semiconductor Single Photon Detectors
        • 3.20.8.2.7. Opportunities
      • 3.20.8.3. Nanomaterials
        • 3.20.8.3.1. Overview
        • 3.20.8.3.2. Types and Properties
          • 3.20.8.3.2.1. 2D Materials
          • 3.20.8.3.2.2. Transition metal dichalcogenide quantum dots
          • 3.20.8.3.2.3. Graphene Membranes
          • 3.20.8.3.2.4. 2.5D materials
          • 3.20.8.3.2.5. Carbon nanotubes
            • 3.20.8.3.2.5.1. Single Walled Carbon Nanotubes
            • 3.20.8.3.2.5.2. Boron Nitride Nanotubes
          • 3.20.8.3.2.6. Diamond
          • 3.20.8.3.2.7. Metal-Organic Frameworks (MOFs)
        • 3.20.8.3.3. Opportunities
    • 3.20.9. Market Analysis
      • 3.20.9.1. Key industry players
        • 3.20.9.1.1. Start-ups
        • 3.20.9.1.2. Tech Giants
        • 3.20.9.1.3. National Initiatives
  • 3.21. Quantum Computing Company Profiles (218 company profiles)

4. EDGE AI PROCESSORS

  • 4.1. Market overview
    • 4.1.1. Market Size
    • 4.1.2. Geographic Market
    • 4.1.3. Technology Architecture Evolution Timeline
  • 4.2. Edge AI Technology Architectures
    • 4.2.1. Neural Processing Unit (NPU) Implementations
    • 4.2.2. System-on-Chip (SoC) Integration Strategies
    • 4.2.3. Power Efficiency and Performance Optimization
      • 4.2.3.1. Sub-7W Thermal Envelope Requirements
      • 4.2.3.2. TOPS/W Optimization Methodologies
      • 4.2.3.3. Model Compression and Quantization
    • 4.2.4. Analog Computing and In-Memory Processing
    • 4.2.5. Dedicated Neural Processing Unit Architectures
    • 4.2.6. GPU-Based Edge Solutions vs. Specialized DPUs
  • 4.3. Application Market Analysis
    • 4.3.1. Industrial IoT and Manufacturing Applications
      • 4.3.1.1. Predictive Maintenance Systems
      • 4.3.1.2. Quality Control and Inspection
      • 4.3.1.3. Real-time Analytics and Optimization
    • 4.3.2. Smartphone and Mobile Device Integration
      • 4.3.2.1. AI-Capable CPU Integration
      • 4.3.2.2. Specialized AI Accelerator Implementation
      • 4.3.2.3. Always-On Processing Capabilities
    • 4.3.3. Automotive and Transportation Systems
    • 4.3.4. Smart Cities and Infrastructure Applications
    • 4.3.5. Healthcare and Wearable Device Integration
    • 4.3.6. Consumer Electronics and Home Automation
  • 4.4. Competitive Landscape and Market Players
    • 4.4.1. Established Semiconductor Giants
      • 4.4.1.1. NVIDIA
      • 4.4.1.2. Intel
      • 4.4.1.3. Qualcomm
      • 4.4.1.4. Xilinx
    • 4.4.2. AI-Focused Startup Companies
      • 4.4.2.1. Mythic
      • 4.4.2.2. Syntiant
      • 4.4.2.3. Kneron
      • 4.4.2.4. DeepX
    • 4.4.3. Cloud Provider Edge Solutions
      • 4.4.3.1. Google Edge TPU
      • 4.4.3.2. AWS Inferentia
  • 4.5. Market Drivers and Technology Trends
    • 4.5.1. Latency Requirements and Real-Time Processing Demands
    • 4.5.2. Data Privacy and Security Imperative Analysis
    • 4.5.3. Bandwidth Limitation and Connectivity Challenge Solutions
    • 4.5.4. IoT Device Proliferation Impact Assessment
    • 4.5.5. Edge-Cloud Computing Architecture Evolution
    • 4.5.6. Power Efficiency and Battery Life Optimization
    • 4.5.7. Autonomous System Processing Requirements
  • 4.6. Edge AI Processor Company Profiles (49 company profiles)

5. REFERENCES

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