첨단 반도체 패키징 시장(2027-2037년)

Advanced semiconductor packaging has become one of the most strategically important domains in the entire electronics industry. As the performance, power, and economic returns from transistor scaling diminish at the leading edge, the package itself has emerged as the primary lever for improving system performance. Where computing capability once came chiefly from shrinking devices, it now comes increasingly from how dies are interconnected, how closely memory is placed to compute, and how many heterogeneous components can be integrated into a single package. This shift has elevated packaging from a back-end, cost-driven step to a value-defining stage of semiconductor design and manufacture.

The principal driver of this transformation is artificial intelligence. AI training and inference demand enormous memory bandwidth, dense die-to-die connectivity, and efficient power delivery, pushing 2.5D and 3D architectures, high-bandwidth memory, and ever-larger package formats into the mainstream. These requirements have made advanced packaging both a key enabler of, and a critical bottleneck for, the most demanding computing systems. The technology landscape is defined by several converging vectors: copper-to-copper hybrid bonding, which enables extraordinarily fine-pitch vertical interconnects; chiplet-based, heterogeneous integration that combines logic, memory, analog, and increasingly photonics from different process nodes; glass substrates and interposers as a new high-end platform; panel-level processing for larger and more cost-effective packages; and co-packaged optics, which brings the optical interface directly into the package.

Underpinning these trends is a deep and increasingly contested ecosystem spanning integrated device manufacturers, foundries, outsourced assembly and test providers, memory makers, equipment and materials suppliers, and a fast-growing optical-interconnect sector. The industry is also experiencing significant structural change, including the partial reshoring of leading-edge packaging capacity, the rise of hyperscaler custom silicon, and growing collaboration across the value chain as the complexity of integration intensifies. Materials innovation, thermal management, and design-stage co-optimisation have become essential disciplines rather than peripheral concerns.

At the same time, the field faces substantial challenges: yield and cost at large package formats, manufacturing maturity for glass and panel processing, thermal density in tightly integrated stacks, optical alignment and test for co-packaged optics, standardisation of die-to-die interfaces, and a concentrated, capital-intensive supply chain. Despite these hurdles, advanced packaging is firmly established as a foundational technology for next-generation computing, communications, automotive, and consumer systems, and its strategic significance is expected to deepen throughout the coming decade.

The Global Market for Advanced Semiconductor Packaging 2027–2037 provides a comprehensive analysis of the advanced semiconductor packaging industry, examining the technologies, materials, applications, market trends, competitive landscape, and outlook that will shape the sector through 2037. As gains from transistor scaling diminish at the leading edge, advanced packaging has become the primary lever for system performance, and this report maps the technologies and players driving that shift across AI, high-performance computing, automotive, mobile, and consumer markets. It combines technical depth with market analysis, supported by detailed forecasts and an extensive directory of company profiles.

The report covers:

• Executive summary - technology overview, evolution of packaging, supply chains, key technology trends, growth drivers, competitive landscape, market challenges, and future outlook.
• Semiconductor packaging technologies - transistor device scaling and the sub-2nm paradox; wafer-level and fan-out packaging; chiplets and disaggregation; interconnection methods; interposer technologies including silicon, organic, silicon bridge, and glass; 2.5D and 3D packaging; copper-to-copper hybrid bonding, including low- and room-temperature processes; and die-to-die I/O.
• Wafer-level packaging - WLCSP, fan-out, fan-in, panel-level packaging, manufacturing processes, trends, and applications.
• System-in-package and heterogeneous integration - integration approaches, manufacturing methods, drivers, applications, IC substrates, and co-packaged optics.
• Monolithic 3D ICs - architectures, 2D materials, benefits, and challenges.
• Markets and applications - mobile, HPC, AI, automotive (including ADAS and EV power electronics), IoT, medical, consumer, aerospace and defense, additive manufacturing, and silicon photonics.
• Glass substrates and interposers - benefits, material properties, TGV formation and metallisation, panel processing, supplier roadmaps, and technical challenges.
• Co-packaged optics - co-packaging approaches, EIC/PIC integration, couplers, advantages and limitations, time to market, and company technologies.
• Thermal interface materials - candidates, roadmaps, and applications.
• Global market forecasts - by packaging type, units and wafers, end-use market, region, and by 3D SoC, 3D stacked memory, UHD FO/RDL interposer, 2.5D interposers, and embedded silicon bridge.
• Market trends and roadmaps - data center, AI and graphics, CPU, autonomous vehicles, interconnect and node roadmaps, and commercialized products across GPUs, AI ASICs, CPUs, and CPO switches.
• Market players, challenges, and company profiles - covering IDMs, foundries, OSATs, OEMs, equipment, materials, and substrate suppliers. Companies profiled include AaltoSemi, Absolics, ACCRETECH, Adeia, Advanced Micro Devices (AMD), Ajinomoto, Alphawave Semi, Amkor Technology, Analog Devices, AMQ Intelligent, Apple, Applied Materials, Ardentec, ARM, ASE, ASMPT, Astera Labs, Ayar Labs, Besi, Biren Technology, Blue Ocean Smart System, Brewer Science, Broadcom, BroadPak, Cadence, Cambricon, Capcon, CAS Microelectronics, CD Micro-Technology, CEA-Leti, Celestial AI, Cerebras, China Wafer Level CSP, Chipbond, Chipletz, ChipMOS, Coherent, Corning, Dai Nippon Printing (DNP), Dewo Advanced Automation, Disco, DuPont, Ebara, Eliyan, EMC Semiconductor, EPS Technology, Entegris, EV Group, GlobalFoundries, Global Unichip, Gloway, Goldenscope, Gona, Graphcore, Greatek, Hangke, Hanmi Semiconductor, HD Microsystems, HiSilicon, HLMC, Huatian, Huawei, Ibiden, IBM, ICLeague, imec, Indium Corporation, Infineon, Integra, Inari Amertron, Intel, JCET, Jiangsu ICAT, Jingdu, Keyang, King Yuan, Kioxia, KyLitho, Kyocera, Lam Research, Lapis, LB Semicon, Leading Interconnect, LG Innotek, Lidrotec, Lightmatter, Lumentum, Lux Semiconductors, Malaysian Pacific Industries, Marvell, Micron, MediaTek, Meta, Micross, Mitsubishi, NCAP China, NEC, Nippon Electric Glass (NEG), Nepes, Nvidia, Onsemi, Orient Semiconductor, Panasonic, Plan Optik, Powertech, Pragmatic, Qorvo, Renesas, RMT, Rohm, Rong, Samsung Electronics, Samtec, Schott, Sharp, Shinko, Showa Denko/Resonac, Sigurd, Silicon Box, SPIL, SJ Semiconductor, SK Hynix, Skywater, SMIC, Sony, Starmask, STMicroelectronics, Suss Microtec, Synopsys, SZLQ, Taiwan Semiconductor Manufacturing Company (TSMC), Techsense, Tezzaron, Tokyo Electron (TEL), Tongfu, Texas Instruments, Tokyo Seimitsu, Tong Hsing, Toppan, Toray, Toshiba, Tower Semiconductor, UMC, Unimicron, Unisem, UTAC, Walton, Winstek, Xinhe, Yibu, and Yuehai.

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Semiconductor Packaging Technology Overview
  • 1.1.1 Key challenges
  • 1.1.2 Evolution of semiconductor packaging
    • 1.1.2.1 From 1D to 3D
  • 1.1.3 Conventional packaging approaches
  • 1.1.4 Advanced packaging approaches
• 1.2 Semiconductor Supply Chain
• 1.3 Advanced Packaging Supply Chain
• 1.4 Key Technology Trends in Advanced Packaging
• 1.5 Market Growth Drivers
• 1.6 Competitive Landscape
• 1.7 Market Challenges
• 1.8 Future outlook
  • 1.8.1 Heterogeneous Integration
  • 1.8.2 Chiplets and Die Disaggregation
  • 1.8.3 Advanced Interconnects
  • 1.8.4 Scaling and Miniaturization
  • 1.8.5 Thermal Management
  • 1.8.6 Materials Innovation
  • 1.8.7 Supply Chain Developments
  • 1.8.8 Role of Simulation and Data Analytics

2 SEMICONDUCTOR PACKAGING TECHNOLOGIES

• 2.1 Transistor Device Scaling
  • 2.1.1 Overview
  • 2.1.2 Heterogeneous Architecture Transition
  • 2.1.3 Co-Design Focus Areas
• 2.2 Wafer Level Packaging
• 2.3 Fan-Out Wafer Level Packaging
• 2.4 Chiplets
  • 2.4.1 AMD EPYC and Ryzen processor families
  • 2.4.2 Disaggregation Needs
• 2.5 Interconnection in Semiconductor Packaging
  • 2.5.1 Overview
  • 2.5.2 Wire Bonding
  • 2.5.3 Flip-chip bonding
  • 2.5.4 Interposer
    • 2.5.4.1 Interposer technology comparison
    • 2.5.4.2 Glass interposer
      • 2.5.4.2.1 Technical challenge of glass interposer
      • 2.5.4.2.2 Different Interposer material comparison
  • 2.5.5 Through-silicon via (TSV) bonding
  • 2.5.6 Hybrid bonding with chiplets
  • 2.5.7 Re-architecting die-to-die I/O
• 2.6 2.5D and 3D Packaging
  • 2.6.1 2.5D packaging
    • 2.6.1.1 Overview
      • 2.6.1.1.1 Silicon Interposer 2.5D
        • 2.6.1.1.1.1 Through Si Via (TSV)
        • 2.6.1.1.1.2 (SiO2) based redistribution layers (RDLs)
      • 2.6.1.1.2 2.5D Organic-based packaging
        • 2.6.1.1.2.1 Chip-first and chip-last fan-out packaging
        • 2.6.1.1.2.2 Organic substrates
        • 2.6.1.1.2.3 Organic RDL
      • 2.6.1.1.3 2.5D glass-based packaging
        • 2.6.1.1.3.1 Benefits
        • 2.6.1.1.3.2 Glass Si interposers in advanced packaging
        • 2.6.1.1.3.3 Glass material properties
        • 2.6.1.1.3.4 2/2 μm line/space metal pitch on glass substrates
        • 2.6.1.1.3.5 3D Glass Panel Embedding (GPE) packaging
        • 2.6.1.1.3.6 Thermal management
        • 2.6.1.1.3.7 Polymer dielectric films
        • 2.6.1.1.3.8 Challenges
        • 2.6.1.1.3.9 Comparison with other substrates
        • 2.6.1.1.3.10 TGV formation and metallisation
      • 2.6.1.1.4 2.5D vs. 3D Packaging
    • 2.6.1.2 Benefits
    • 2.6.1.3 Challenges
    • 2.6.1.4 Trends
    • 2.6.1.5 Market players
  • 2.6.2 3D packaging
    • 2.6.2.1 Conventional 3D packaging
    • 2.6.2.2 Advanced 3D Packaging with through-silicon vias (TSVs)
    • 2.6.2.3 W2W vs D2W vs Collective D2W
    • 2.6.2.4 Direct Molecular Bonding
    • 2.6.2.5 3D Interconnect Trends
    • 2.6.2.6 Hybrid Bonding
      • 2.6.2.6.1 Devices using hybrid bonding
      • 2.6.2.6.2 Fusion Bond
      • 2.6.2.6.3 Low- and room-temperature Cu-Cu bonding
      • 2.6.2.6.4 Devices using hybrid bonding
    • 2.6.2.7 3D stacking supply chain
    • 2.6.2.8 3D Microbump technology
      • 2.6.2.8.1 Technologies
      • 2.6.2.8.2 Challenges
      • 2.6.2.8.3 Bumpless copper-to-copper (Cu-Cu) hybrid bonding
    • 2.6.2.9 Trends
      • 2.6.2.9.1 Memory drives the next wave
      • 2.6.2.9.2 Low- and room-temperature Cu-Cu bonding

3 WAFER-LEVEL PACKAGING

• 3.1 Introduction
  • 3.1.1 WLP to PLP
• 3.2 Benefits
• 3.3 Types of Wafer Level Packaging
  • 3.3.1 Wafer Level Chip Scale Packaging
    • 3.3.1.1 Overview
    • 3.3.1.2 Advantages
    • 3.3.1.3 Applications
  • 3.3.2 Wafer Level Fan-Out Packaging
    • 3.3.2.1 Overview
    • 3.3.2.2 Advantages
    • 3.3.2.3 Applications
  • 3.3.3 Wafer Level Fan-In Packaging
    • 3.3.3.1 Overview
    • 3.3.3.2 Advantages
    • 3.3.3.3 Applications
  • 3.3.4 Other Types of WLP
    • 3.3.4.1 Cu-Pillar Flip Chip
    • 3.3.4.2 Advantages
      • 3.3.4.2.1 Applications
    • 3.3.4.3 Embedded Wafer Level BGA (eWLB)
    • 3.3.4.4 Advantages
      • 3.3.4.4.1 Applications
    • 3.3.4.5 Chip-last FO-WLP
      • 3.3.4.5.1 Advantages
      • 3.3.4.5.2 Applications
    • 3.3.4.6 Wafer-on-Wafer (WoW)
      • 3.3.4.6.1 Applications
• 3.4 WLP Manufacturing Processes
  • 3.4.1 Wafer Preparation
  • 3.4.2 RDL Buildup
  • 3.4.3 Bumping
  • 3.4.4 Encapsulation
  • 3.4.5 Integration
  • 3.4.6 Test and Singulation
• 3.5 Wafer Level Packaging Trends
• 3.6 Applications of Wafer Level Packaging
  • 3.6.1 Mobile and Consumer Electronics
  • 3.6.2 Automotive Electronics
  • 3.6.3 IoT and Industrial
  • 3.6.4 High Performance Computing
  • 3.6.5 Aerospace and Defense
• 3.7 Wafer Level Packaging Outlook

4 SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION

• 4.1 Introduction
• 4.2 Approaches for heterogenous integration
  • 4.2.1 Technology Building Blocks
• 4.3 SiP Manufacturing Approaches
  • 4.3.1 2.5D Integrated Interposers
  • 4.3.2 Multi-Chip Modules
  • 4.3.3 3D Stacked packages
  • 4.3.4 Fan-Out Wafer Level Packaging
  • 4.3.5 Flip Chip Package-on-Package
• 4.4 SiP Component Integration
• 4.5 Heterogeneous Integration Drivers
• 4.6 Trends Driving SiP Adoption
• 4.7 SiP Applications
• 4.8 SiP Industry Landscape
• 4.9 Future Outlook on Heterogeneous Integration
• 4.10 CPO (Co-Packaged Optics)
  • 4.10.1 Co-packaging approaches
  • 4.10.2 Heterogeneous integration of EIC and PIC
  • 4.10.3 Interconnect Technology (in CPO)
  • 4.10.4 Type of couplers
  • 4.10.5 Advantages and limitations
  • 4.10.6 CPO technologies, by company
• 4.11 IC Substrates

5 MONOLITHIC 3D IC

• 5.1 Overview
  • 5.1.1 Transitioning from 2D Systems
  • 5.1.2 Motivation for developing monolithic 3D manufacturing
  • 5.1.3 Improved M3D Interconnect Density
  • 5.1.4 Heterogenous 3D vs Monolithic 3D
  • 5.1.5 2D Materials
• 5.2 Benefits
• 5.3 Challenges
• 5.4 Future outlook

6 MARKETS AND APPLICATIONS

• 6.1 Market value chain
  • 6.1.1 SiP OEM/Designers
  • 6.1.2 Chiplet OEM/Designer and Chiplet Foundry
  • 6.1.3 Chiplet Integrator
    • 6.1.3.1 Integrated Device Manufacturers (IDMs)
    • 6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers
  • 6.1.4 Material Suppliers
  • 6.1.5 Equipment Suppliers
  • 6.1.6 Substrate and PCB suppliers
  • 6.1.7 EDA Tools Suppliers
  • 6.1.8 Interposer Foundry
• 6.2 Packaging trends by market
  • 6.2.1 Mobile Devices
  • 6.2.2 High-Performance Computing (HPC)
  • 6.2.3 Automotive
  • 6.2.4 Internet of Things (IoT)
  • 6.2.5 Consumer Electronics
  • 6.2.6 Aerospace and Defense
  • 6.2.7 Medical Devices
• 6.3 Design requirements
• 6.4 Artificial Intelligence (AI)
  • 6.4.1 Challenges in AI
  • 6.4.2 Advanced Packaging Solutions
    • 6.4.2.1 2.5D and 3D Integration
    • 6.4.2.2 Chiplet-based Packaging
    • 6.4.2.3 Wafer-Level Packaging (WLP)
  • 6.4.3 Addressing AI Challenges through Advanced Packaging
    • 6.4.3.1 Processing Power
    • 6.4.3.2 Memory Bandwidth
    • 6.4.3.3 Energy Efficiency
    • 6.4.3.4 Scalability
  • 6.4.4 Applications
    • 6.4.4.1 Data Center and Cloud Computing
    • 6.4.4.2 Edge Devices and IoT
    • 6.4.4.3 Healthcare and Medical Devices
    • 6.4.4.4 Autonomous Vehicles
• 6.5 Mobile Devices
  • 6.5.1 Challenges
  • 6.5.2 Advanced Packaging Solutions
    • 6.5.2.1 System-in-Package (SiP)
    • 6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
    • 6.5.2.3 3D IC Packaging
    • 6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)
  • 6.5.3 Addressing Challenges through Advanced Packaging
    • 6.5.3.1 Power Consumption and Thermal Management
    • 6.5.3.2 Size Constraints
    • 6.5.3.3 Cost
  • 6.5.4 Applications
    • 6.5.4.1 Smartphones
    • 6.5.4.2 Tablets
    • 6.5.4.3 Wearables
    • 6.5.4.4 AR/VR Devices
  • 6.5.5 Future trends
• 6.6 High Performance Computing (HPC)
  • 6.6.1 Challenges
  • 6.6.2 Advanced Packaging Solutions for HPC
    • 6.6.2.1 2.5D and 3D Integration
    • 6.6.2.2 Hybrid bonding
    • 6.6.2.3 Multi-Chip Modules (MCMs)
    • 6.6.2.4 Chiplet-based Architectures
    • 6.6.2.5 Advanced Interconnect Technologies
  • 6.6.3 Addressing HPC Challenges through Advanced Packaging
    • 6.6.3.1 Performance Scaling
    • 6.6.3.2 Power Consumption
    • 6.6.3.3 Interconnect Bandwidth
    • 6.6.3.4 Reliability
  • 6.6.4 Applications
    • 6.6.4.1 Supercomputers
    • 6.6.4.2 Data Center and Cloud Computing
    • 6.6.4.3 Artificial Intelligence and Machine Learning
    • 6.6.4.4 Scientific Computing and Simulation
    • 6.6.4.5 Co-Packaged Optics
      • 6.6.4.5.1 Network Switch
      • 6.6.4.5.2 Optical communication in data centers
      • 6.6.4.5.3 Thermal Management
      • 6.6.4.5.4 Challenges in CPO
      • 6.6.4.5.5 Package Structure
      • 6.6.4.5.6 Fan-Out Embedded Bridge (FOEB) structure
      • 6.6.4.5.7 Advancing Switching and AI Networks
      • 6.6.4.5.8 Making on-chip photonics manufacturable
  • 6.6.5 Thermal Interface Materials
  • 6.6.6 Future Trends
• 6.7 Automotive Electronics
  • 6.7.1 Challenges
  • 6.7.2 Advanced Packaging Solutions for Automotive Electronics
    • 6.7.2.1 System-in-Package (SiP)
    • 6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)
    • 6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)
  • 6.7.3 Addressing Automotive Electronics Challenges through Advanced Packaging
    • 6.7.3.1 ADAS/Autonomous driving systems
    • 6.7.3.2 Harsh Environment Reliability
    • 6.7.3.3 Safety and Reliability
    • 6.7.3.4 Miniaturization and Integration
    • 6.7.3.5 High-Speed Communication
    • 6.7.3.6 Thermal Management
  • 6.7.4 Applications
    • 6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving
      • 6.7.4.1.1 Radar packaging
    • 6.7.4.2 Electric Vehicle (EV) Power Electronics
    • 6.7.4.3 Infotainment and Telematics
    • 6.7.4.4 Sensors and Actuators
  • 6.7.5 Future Trends
• 6.8 Internet of Things (IoT) Devices
  • 6.8.1 Challenges
  • 6.8.2 Advanced Packaging Solutions for IoT Devices
    • 6.8.2.1 Wafer-Level Packaging (WLP)
    • 6.8.2.2 System-in-Package (SiP)
    • 6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)
    • 6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)
  • 6.8.3 Addressing IoT Device Challenges through Advanced Packaging
    • 6.8.3.1 Size Constraints
    • 6.8.3.2 Power Consumption
    • 6.8.3.3 Cost Pressures
    • 6.8.3.4 Integration and Functionality
    • 6.8.3.5 Reliability and Robustness
  • 6.8.4 Applications
    • 6.8.4.1 Wearable Devices
    • 6.8.4.2 Smart Home Devices
    • 6.8.4.3 Industrial IoT Devices
    • 6.8.4.4 Medical IoT Devices
  • 6.8.5 Future Trends
• 6.9 5G & 6G Communications Infrastructure
  • 6.9.1 Challenges
  • 6.9.2 Trends in 5G and 6G packaging
  • 6.9.3 Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
    • 6.9.3.1 Antenna-in-Package (AiP)
    • 6.9.3.2 System-in-Package (SiP)
    • 6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)
    • 6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)
  • 6.9.4 Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
    • 6.9.4.1 High-Frequency Operation
    • 6.9.4.2 Massive MIMO and Beamforming
    • 6.9.4.3 Energy Efficiency
    • 6.9.4.4 Cost and Scalability
    • 6.9.4.5 Thermal Management
  • 6.9.5 Applications
    • 6.9.5.1 Base Stations and Small Cells
    • 6.9.5.2 Backhaul and Fronthaul Networks
    • 6.9.5.3 Edge Computing and Network Slicing
    • 6.9.5.4 Satellite and Non-Terrestrial Networks
  • 6.9.6 Future Trends
• 6.10 Aerospace and Defense Electronics
  • 6.10.1 Challenges
  • 6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics
    • 6.10.2.1 3D Packaging and Through-Silicon Vias (TSVs)
    • 6.10.2.2 Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)
    • 6.10.2.3 Flip-Chip and Ball Grid Array (BGA) Packaging
    • 6.10.2.4 Hermetic Packaging and Sealing
  • 6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
    • 6.10.3.1 Size, Weight, and Power (SWaP) Optimization
    • 6.10.3.2 Harsh Environment Reliability
    • 6.10.3.3 High Performance and Speed
    • 6.10.3.4 Long-Term Reliability and Maintainability
    • 6.10.3.5 Security and Anti-Tamper Features
  • 6.10.4 Applications
    • 6.10.4.1 Avionics and Flight Control Systems
    • 6.10.4.2 Radar and Electronic Warfare Systems
    • 6.10.4.3 Satellite Communications and Payload Electronics
    • 6.10.4.4 Missile Guidance and Control Electronics
  • 6.10.5 Future Trends
• 6.11 Medical Electronics
  • 6.11.1 Challenges
  • 6.11.2 Advanced Packaging Solutions for Medical Electronics
    • 6.11.2.1 3D Packaging and Through-Silicon Vias (TSVs)
    • 6.11.2.2 Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)
    • 6.11.2.3 Flexible and Stretchable Packaging
    • 6.11.2.4 Microfluidic Packaging
  • 6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging
    • 6.11.3.1 Miniaturization
    • 6.11.3.2 Biocompatibility
    • 6.11.3.3 Reliability
    • 6.11.3.4 Power Efficiency
    • 6.11.3.5 High Performance
  • 6.11.4 Applications
    • 6.11.4.1 Implantable Devices
    • 6.11.4.2 Wearable Health Monitors
    • 6.11.4.3 Diagnostic Imaging Equipment
    • 6.11.4.4 Surgical Robotics and Instruments
  • 6.11.5 Future Trends
• 6.12 Consumer Electronics
  • 6.12.1 Challenges
  • 6.12.2 Advanced Packaging Solutions for Consumer Electronics
    • 6.12.2.1 System-in-Package (SiP)
    • 6.12.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
    • 6.12.2.3 3D Packaging and Through-Silicon Vias (TSVs)
    • 6.12.2.4 Embedded Die Packaging
  • 6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging
    • 6.12.3.1 Miniaturization
    • 6.12.3.2 Power Efficiency
    • 6.12.3.3 High Performance
    • 6.12.3.4 Cost Reduction
    • 6.12.3.5 Time-to-Market
  • 6.12.4 Applications
    • 6.12.4.1 Smartphones and Tablets
    • 6.12.4.2 Wearables and IoT Devices
    • 6.12.4.3 Gaming Consoles and VR/AR Devices
    • 6.12.4.4 Smart Home Devices
  • 6.12.5 Future Trends
• 6.13 Additive manufacturing for advanced packaging
• 6.14 Silicon photonics

7 GLOBAL MARKET FORECASTS

• 7.1 By type
• 7.2 By Units & Wafers
• 7.3 By end-use market
• 7.4 By region
• 7.5 3D SoC
• 7.6 3D Stacked memory
• 7.7 UHD FO / RDL Interposer
• 7.8 2.5D Interposers
• 7.9 Embedded Si bridge

8 MARKET TRENDS

• 8.1 Data center
• 8.2 AI and Graphics
• 8.3 CPU
• 8.4 Autonomous vehicles
• 8.5 Roadmap
  • 8.5.1 Interconnect technology trend
  • 8.5.2 By interconnect density and technology node
  • 8.5.3 By reticle size
  • 8.5.4 By front-end vs back-end
  • 8.5.5 By 2.5D and 3D Technology Trends
  • 8.5.6 By I/O density, I/O pitch and package size
• 8.6 Commercialized Products
  • 8.6.1 3D Memory
  • 8.6.2 GPU
    • 8.6.2.1 Nvidia
    • 8.6.2.2 AMD
    • 8.6.2.3 Intel
  • 8.6.3 AI ASICs
    • 8.6.3.1 Intel
    • 8.6.3.2 Google
    • 8.6.3.3 Amazon
    • 8.6.3.4 Microsoft
    • 8.6.3.5 Huawei
    • 8.6.3.6 Meta
  • 8.6.4 CPU
    • 8.6.4.1 AMD
    • 8.6.4.2 Amazon
    • 8.6.4.3 Intel
    • 8.6.4.4 Nvidia
  • 8.6.5 Networking and CPO switches
    • 8.6.5.1 Nvidia Quantum-X and Spectrum-X Photonics
    • 8.6.5.2 Broadcom Tomahawk CPO (Bailly / Davisson)

9 MARKET PLAYERS

• 9.1 Integrated Device Manufacturers
• 9.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies
• 9.3 Foundries
• 9.4 Electronics OEMs
• 9.5 Packaging Equipment and Materials Companies

10 MARKET CHALLENGES

11 COMPANY PROFILES

• 11.1 AaltoSemi
• 11.2 Absolic, Inc.
• 11.3 ACCRETECH (Europe) GmbH
• 11.4 Adeia, Inc.
• 11.5 Advanced Micro Devices, Inc. (AMD)
• 11.6 Ajinomoto
• 11.7 Analog Devices, Inc. (ADI)
• 11.8 Amkor Technology
• 11.9 Anmuquan Intelligent Technology (AMQ Intelligent)
• 11.10 Apple
• 11.11 Applied Materials
• 11.12 Ardentec Corporation
• 11.13 Arieca
• 11.14 ARM
• 11.15 ASE
• 11.16 ASMPT Ltd
• 11.17 Ayar Labs
• 11.18 Besi
• 11.19 Biren Technology
• 11.20 Blue Ocean Smart System
• 11.21 Brewer Science
• 11.22 Broadcom
• 11.23 BroadPak
• 11.24 Cadence Design Systems
• 11.25 Cambricon Technologies Co.
• 11.26 Capcon Semiconductor
• 11.27 CAS Microelectronics Integration
• 11.28 CD Micro-Technology
• 11.29 CEA-Leti
• 11.30 Cerebras
• 11.31 China Wafer Level CSP Co
• 11.32 Chipbond Technology Corporation
• 11.33 Chipletz
• 11.34 ChipMOS Technologies, Inc.
• 11.35 Coherent
• 11.36 Corning
• 11.37 Dai Nippon Printing (DNP)
• 11.38 Dewo Advanced Automation (DAA)
• 11.39 Disco
• 11.40 Dupont
• 11.41 Ebara
• 11.42 Eliyan
• 11.43 EMC Semi-Conductor Technology
• 11.44 EPS Technology
• 11.45 Entegris
• 11.46 EV Group
• 11.47 GlobalFoundries
• 11.48 Global Unichip
• 11.49 Gloway
• 11.50 Goldenscope Tech
• 11.51 Gona Semiconductor Technology
• 11.52 Graphcore
• 11.53 Greatek Electronics Inc
• 11.54 Hangke Chuangxing (Aero Inno-Star)
• 11.55 Hanmi Semiconductor
• 11.56 HD Microsystems
• 11.57 HiSilicon
• 11.58 HLMC (Shanghai Huali Microelectronics Corporation)
• 11.59 Huatian Huichuang Technology (Xi'an) Co., Ltd.
• 11.60 Huawei
• 11.61 Ibiden
• 11.62 IBM
• 11.63 ICLeague Technology Co Ltd
• 11.64 IMEC
• 11.65 Indium Corporation
• 11.66 Infineon Technologies AG
• 11.67 Integra
• 11.68 Inari Amertron Berhad
• 11.69 Intel Corporation
• 11.70 JCET Group
• 11.71 Jiangsu IC Assembly & Test (ICAT)
• 11.72 Jingdu Semiconductor
• 11.73 Keyang Semiconductor (KYS)
• 11.74 King Yuan Electronics Co., Ltd.
• 11.75 Kioxia
• 11.76 KyLitho
• 11.77 Kyocera
• 11.78 Lam Research
• 11.79 Lapis Technology
• 11.80 LB Semicon Co Ltd
• 11.81 Leading Interconnect Semiconductor Technology
• 11.82 LG Innotek
• 11.83 Lidrotec GmbH
• 11.84 Lux Semiconductors
• 11.85 Malaysian Pacific Industries Berhad
• 11.86 Micron Technology, Inc.
• 11.87 Mediatek
• 11.88 Micross Components
• 11.89 Mitsubishi
• 11.90 National Center For Advanced Packaging China (NCAP China)
• 11.91 NEC
• 11.92 Nvidia Corporation
• 11.93 Nepes Corporation
• 11.94 Nippon Electric Glass (NEG)
• 11.95 Onsemi
• 11.96 Orient Semiconductor Electronics Ltd.
• 11.97 Panasonic
• 11.98 Plan Optik AG
• 11.99 Powertech Technology Inc.
• 11.100 Pragmatic Semiconductor
• 11.101 Qorvo
• 11.102 Renesas
• 11.103 Rigger Micro Technologies (RMT)
• 11.104 Rohm
• 11.105 Rong Semiconductor
• 11.106 Samsung Electronics
• 11.107 Samtec, Inc.
• 11.108 Schott AG
• 11.109 Sharp
• 11.110 Shinko Electric Industries
• 11.111 Showa Denko (Resonac)
• 11.112 Sigurd Microelectronics Corporation
• 11.113 Silicon Box
• 11.114 Siliconware Precision Industries (SPIL)
• 11.115 SJ Semiconductor
• 11.116 SK Hynix
• 11.117 Skywater
• 11.118 Sony Corporation
• 11.119 Starmask
• 11.120 STMicroelectronics
• 11.121 Suss Microtec
• 11.122 Synopsys
• 11.123 SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
• 11.124 Taiwan Semiconductor Manufacturing Company (TSMC)
• 11.125 Techsense International
• 11.126 Tezzaron Semiconductor
• 11.127 Tokyo Electron (TEL)
• 11.128 Tongfu Microelectronics Co., Ltd.
• 11.129 Toppan
• 11.130 Toray
• 11.131 Texas Instruments
• 11.132 Tokyo Electron
• 11.133 Tokyo Seimitsu Co., Ltd.
• 11.134 Tong Hsing Electronic Industries, Ltd.
• 11.135 Toshiba
• 11.136 Tower Semiconductor
• 11.137 Unimicron
• 11.138 Unisem
• 11.139 UTAC Group
• 11.140 Walton Advanced Engineering Inc.
• 11.141 Winstek Semiconductor Technology Co., Ltd.
• 11.142 Xinhe Semiconductor
• 11.143 Yibu Semiconductor
• 11.144 Yuehai Integrated

12 RESEARCH METHODOLOGY

13 REFERENCES