자동차 칩렛에 대한 전략적 인사이트(2025년)

Building with Bricks: How Chiplets Unlock Scalable Automotive Computing and Accelerate SDV Performance

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, silicon vendors, foundries/OSATs, substrate and IP providers are converging to reduce cost and time-to-market while strengthening compliance and supply resilience. With rising emphasis on reuse and upgradability, chiplets move beyond first-wave ADAS into central compute, zonal/body controllers, infotainment, connectivity/telematics, powertrain inverters, and sensor hubs. The study explores key trends, including centralized/zonal E/E migration, die-to-die interconnect standardization, packaging choices, safety/cyber workflows, KGD and D2D test (BIST/DFT), and lifecycle and over-the-air implications for multi-die ECUs. Drawing on industry experts and secondary research, it delivers a comparative benchmarking of leading ecosystems and suppliers across compute, packaging/test, substrates, and IP; maps OEM and Tier 1 activity with indicative SOP windows and design-ownership patterns; and outlines market structure, maturity, and bottlenecks. It identifies near-term growth opportunities-multi-chiplet central compute, ADAS/AI accelerators, zonal I/O and security chiplets, auto-grade D2D test and KGD services, and chiplet-to-cloud lifecycle management-and provides partner selection criteria, packaging/test guardrails, governance checklists, and actionable recommendations for OEMs, Tier 1s, and technology providers.

Table of Contents

Research Scope

• Scope of Analysis
• Nomenclature
• Overview of the Structure and Content

Strategic Imperatives

• Why is it Increasingly Difficult to Grow?
• The Strategic Imperative 8-TM
• The Impact of the Top 3 Strategic Imperatives on Chiplets in the Automotive Industry

Key Takeaways

• Key Takeaways: Chiplets in Automotive (2025-2030)
• BOM at a Glance: How Cheap is it, Really?
• TCO at a Glance: How Cheap is it, Really?
• OEMs' Chiplet Commitment

Industry Overview: Chiplets in the Automotive Domain

• Introduction to Chiplets
• Macro Trend: SDV is Reshaping E/E Architectures
• Macro Trend: Today's E/E Pain Points and How Chiplets Help
• Why Now for Automotive? Technology and Business Triggers
• SoC vs SiP/MCM vs Chiplet-Based: What is the Difference?
• Packaging Landscapes for Chiplets
• Die-to-Die Interconnects
• Regulatory and Standardization Framework for Automotive Chiplets
• Chiplet Segmentation Framework

Competitive Landscape: Key Players & Chiplet Solutions

• Competitive Landscape: Key Players and Chiplet Solutions
• BMW and Mercedes: Qualcomm/NVIDIA Today, Chiplets Tomorrow
• Renesas
• Renesas: Chiplet Technical Deep Dive
• NXP
• NXP: Chiplet Technical Deep Dive
• NVIDIA
• NVIDIA: Chiplet Technical Deep Dive
• Qualcomm
• Qualcomm: Chiplet Technical Deep Dive
• AMD/XILINX
• AMD/XILINX: Chiplet Technical Deep Dive
• TSMC
• TSMC (Foundry and Packaging): Chiplet Technical Deep Dive
• SIFIVE
• SIFIVE (RISC-V IP): Chiplet Technical Deep Dive
• SYNOPSYS
• SYNOPSYS: Chiplet Technical Deep Dive
• AMKOR Technology
• AMKOR Technology: Chiplet Technical Deep Dive
• Athos Silicon
• Athos Silicon: Chiplet Technical Deep Dive

OEM Activity & Partnerships

• OEM Activity on Chiplets: Who's Partnering, Where, and How Fast
• Chiplet Value Chain and Design Ownership: Who Does What?
• China: What to Learn and What to Watch

Growth Opportunity Analysis

• Growth Metrics
• Growth Drivers
• Growth Restraints
• Market Size and Current Adoption
• Market by Segment
• Market Size and Forecast to 2030
• Strategic Recommendations for OEMs and Suppliers

Growth Opportunity Universe

• Growth Opportunity 1: Automotive-Grade D2D Test & KGD Services
• Growth Opportunity 2: Consolidated Multi-Chiplet Central Compute ECU
• Growth Opportunity 3: Chiplet-Enabled AI/ADAS Accelerator Tiles
• Growth Opportunity 4: Zonal/Body Controllers with Chiplet I/O + Security
• Growth Opportunity 5: Secure Chiplet-to-Cloud Data & Lifecycle Management

Appendix & Next Steps

• Benefits and Impacts of Growth Opportunities
• Next Steps
• List of Exhibits
• Legal Disclaimer