전자 접착제 시장 기회, 성장 촉진 요인, 산업 동향 분석, 예측(2025-2034년)

The Global Electronic Adhesives Market, valued at USD 5 billion in 2024, is poised for steady growth, with projections indicating a compound annual growth rate (CAGR) of 6% between 2025 and 2034. This expansion is driven by the rapid adoption of electronic devices across diverse industries, including automotive, medical, aerospace, and consumer electronics. As technology continues to advance, the need for high-performance adhesives with enhanced thermal and electrical properties is becoming increasingly crucial.

The shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) has further fueled demand for specialized adhesives capable of meeting the rigorous requirements of modern electronic components. Additionally, the proliferation of 5G networks, IoT applications, and smart devices has intensified the need for adhesives that offer superior bonding strength, durability, and resistance to environmental factors. Leading manufacturers are focusing on the development of eco-friendly and sustainable adhesive solutions to align with global sustainability initiatives. Regulatory policies promoting the use of low-emission materials and energy-efficient electronic components are expected to play a pivotal role in shaping the market's trajectory.

The epoxy segment, valued at USD 2 billion in 2024, is projected to grow at a CAGR of 5.7% over the forecast period. Epoxy-based adhesives provide exceptional protection to electronic components by shielding them from environmental stressors such as moisture, heat, and electrical interference. Widely used for encapsulation, potting, and conformal coatings, these adhesives play a critical role in ensuring the longevity and reliability of electronic circuits. The increasing miniaturization of electronic devices, coupled with the rising adoption of EVs and next-generation technologies, continues to drive demand for epoxy adhesives. Furthermore, ongoing research and development efforts are focused on creating sustainable epoxy formulations that minimize environmental impact without compromising performance. Companies are integrating bio-based materials into epoxy adhesives to enhance sustainability while maintaining their essential properties for high-performance applications in electronics manufacturing.

The surface-mounting segment held the largest share of the electronic adhesives market in 2024, accounting for 47.9% of total revenue. Surface-mount technology (SMT) adhesives are essential for securing electronic components onto printed circuit boards (PCBs), ensuring durability and stability in high-performance applications. As consumer demand for compact, lightweight, and feature-rich electronic devices continues to grow, SMT adhesives have become indispensable in modern electronics manufacturing. These adhesives provide excellent mechanical strength, thermal resistance, and electrical insulation, making them crucial for maintaining the reliability of electronic products. Manufacturers are focusing on developing high-performance SMT adhesives with faster curing times and enhanced adhesion properties to meet the evolving needs of the electronics industry.

The U.S. electronic adhesives market, valued at USD 883.2 million in 2024, is expected to grow at a CAGR of 5.1% over the forecast period. The country's strong presence in advanced electronics manufacturing, coupled with the increasing adoption of smart devices, is driving significant market expansion. The automotive sector, in particular, is fueling demand for high-performance adhesives as vehicles become more reliant on electronic systems for safety, navigation, and connectivity. Additionally, the U.S. benefits from a robust research and development ecosystem, fostering innovation in adhesive formulations to meet stringent industry standards. With ongoing advancements in semiconductor technology, 5G infrastructure, and sustainable manufacturing practices, the U.S. electronic adhesives market is well-positioned for sustained growth throughout the forecast period.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definitions
• 1.2 Base estimates & calculations
• 1.3 Forecast calculations
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Industry synopsis, 2021-2034

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Factor affecting the value chain
  • 3.1.2 Profit margin analysis
  • 3.1.3 Disruptions
  • 3.1.4 Future outlook
  • 3.1.5 Manufacturers
  • 3.1.6 Distributors
• 3.2 Supplier landscape
• 3.3 Profit margin analysis
• 3.4 Key news & initiatives
• 3.5 Regulatory landscape
• 3.6 Impact forces
  • 3.6.1 Growth drivers
    • 3.6.1.1 Miniaturization of electronic devices
    • 3.6.1.2 Increasing adoption of smart manufacturing and Industry 4.0 concepts
    • 3.6.1.3 The growing popularity of wearable devices and Internet of Things (IoT) applications
  • 3.6.2 Industry pitfalls & challenges
    • 3.6.2.1 Rising raw material costs
• 3.7 Growth potential analysis
• 3.8 Porter’s analysis
• 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
• 4.3 Competitive positioning matrix
• 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Resin Type, 2021-2034 (USD Billion) (Kilo Tons)

• 5.1 Key trends
• 5.2 Epoxy
• 5.3 Acrylics
• 5.4 Polyurethane
• 5.5 Silicone
• 5.6 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021-2034 (USD Billion) (Kilo Tons)

• 6.1 Key trends
• 6.2 Conformal coatings
• 6.3 Surface mounting
• 6.4 Encapsulation
• 6.5 Wire tacking
• 6.6 Others

Chapter 7 Market Estimates & Forecast, By End Use Industry, 2021-2034 (USD Billion) (Kilo Tons)

• 7.1 Key trends
• 7.2 Consumer electronics
• 7.3 Automotive
• 7.4 Communications
• 7.5 Medical
• 7.6 Aerospace and defense
• 7.7 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2034 (USD Billion) (Kilo Tons)

• 8.1 Key trends
• 8.2 North America
  • 8.2.1 U.S.
  • 8.2.2 Canada
• 8.3 Europe
  • 8.3.1 UK
  • 8.3.2 Germany
  • 8.3.3 France
  • 8.3.4 Italy
  • 8.3.5 Spain
  • 8.3.6 Russia
• 8.4 Asia Pacific
  • 8.4.1 China
  • 8.4.2 India
  • 8.4.3 Japan
  • 8.4.4 South Korea
  • 8.4.5 Australia
• 8.5 Latin America
  • 8.5.1 Brazil
  • 8.5.2 Mexico
• 8.6 MEA
  • 8.6.1 South Africa
  • 8.6.2 Saudi Arabia
  • 8.6.3 UAE

Chapter 9 Company Profiles

• 9.1 3M
• 9.2 Avery Dennison Corporation
• 9.3 Dow Chemical Company
• 9.4 Dymax Corporation
• 9.5 Evonik Industries
• 9.6 Ellsworth Adhesives
• 9.7 Henkel
• 9.8 H.B. Fuller Company
• 9.9 Hitachi Chemical
• 9.10 Indium Corporation
• 9.11 Kyocera Chemical Corporation
• 9.12 Mitsui Chemicals
• 9.13 Master Bond
• 9.14 Nagase Chemtex Corporation
• 9.15 Shin-Etsu Chemical