산업용 전자기기 포장 시장 기회, 성장 촉진요인, 산업 동향 분석, 예측(2025-2034년)

The Global Industrial Electronics Packaging Market, valued at USD 2.05 billion in 2024, is expected to experience steady growth at a CAGR of 4.4% from 2025 to 2034. This growth can be attributed to the increasing demand for high-quality, durable packaging solutions that protect sensitive electronic components during storage, handling, and transportation. As industries across the globe rely more heavily on advanced electronics, the need for efficient packaging that safeguards fragile components has never been more critical. The surge in demand for electronics in various sectors, including automotive, telecommunications, automation, and power systems, has further highlighted the importance of reliable packaging solutions. In addition, rising consumer awareness about sustainability is driving manufacturers to adopt eco-friendly materials, creating a shift toward more environmentally conscious packaging choices. With such a strong market demand, innovations in materials and packaging technologies continue to play a significant role in shaping the future of the industry.

The industrial electronics packaging market is segmented into plastics, metals, paper & board, and other materials. Plastics, in particular, are expected to see a notable growth trajectory, with a projected CAGR of 5% that will bring the segment to a value of USD 2 billion by 2034. This surge in plastic packaging demand is driven by its lightweight nature, cost-efficiency, and exceptional durability, making it the material of choice for industrial electronics. Advanced plastic materials, such as anti-static and conductive varieties, are particularly popular due to their ability to protect sensitive components from electrostatic discharge (ESD), ensuring optimal safety during transit. Furthermore, growing environmental concerns have prompted manufacturers to develop sustainable plastic packaging options, such as recyclable and biodegradable alternatives, aligning with global eco-friendly initiatives.

The market is further divided into key application areas, including semiconductors, power electronics, industrial control systems, telecommunications equipment, automation and robotics equipment, and others. In 2024, the semiconductor segment commanded a significant 29% market share, a trend driven by the rapid growth of the semiconductor industry. The widespread adoption of IoT devices, 5G networks, and AI technologies has intensified the need for sophisticated electronic components, which must be packaged securely to avoid any damage during handling and shipping.

North America's industrial electronics packaging market accounted for 35.5% of the global share in 2024, with the United States being a major contributor. The region's demand for automation, advanced electronics, and smart technology has prompted manufacturers to seek robust packaging materials that ensure the protection of their products. Additionally, a growing emphasis on sustainable packaging solutions has led companies to explore eco-friendly options, ensuring that they meet regulatory standards and sustainability goals. Smart packaging technologies, including RFID tracking and environmental sensors, are becoming increasingly important for improving supply chain visibility, product traceability, and overall operational efficiency. As the industry continues to innovate and expand, these technologies are expected to play a crucial role in the market's evolution.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definitions
• 1.2 Base estimates & calculations
• 1.3 Forecast calculations
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Industry synopsis, 2021-2034

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Factor affecting the value chain
  • 3.1.2 Disruptions
  • 3.1.3 Future outlook
  • 3.1.4 Manufacturers
  • 3.1.5 Distributors
• 3.2 Profit margin analysis
• 3.3 Key news & initiatives
• 3.4 Regulatory landscape
• 3.5 Impact forces
  • 3.5.1 Growth drivers
    • 3.5.1.1 Expansion of the semiconductor industry and its applications
    • 3.5.1.2 Growth in the consumer electronics sector
    • 3.5.1.3 Surge in demand for electric vehicles (eVs)
    • 3.5.1.4 Growth in robotics and industrial automation systems
    • 3.5.1.5 Rising automotive industry
  • 3.5.2 Industry pitfalls & challenges
    • 3.5.2.1 Compatibility with advanced technologies
    • 3.5.2.2 Rising raw material costs
• 3.6 Growth potential analysis
• 3.7 Porter’s analysis
• 3.8 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
• 4.3 Competitive positioning matrix
• 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Material Type, 2021-2034 (USD Billion & Kilo Tons)

• 5.1 Key trends
• 5.2 Plastics
• 5.3 Metals
• 5.4 Paper & board
• 5.5 Others

Chapter 6 Market Estimates & Forecast, By Product Type, 2021-2034 (USD Billion & Kilo Tons)

• 6.1 Key trends
• 6.2 Trays
• 6.3 Tubes
• 6.4 Bags & pouches
• 6.5 Boxes & cases
• 6.6 Racks & cabinets
• 6.7 Others

Chapter 7 Market Estimates & Forecast, By Protection Level, 2021-2034 (USD Billion & Kilo Tons)

• 7.1 Key trends
• 7.2 Standard packaging
• 7.3 Electrostatic discharge packaging
• 7.4 Electromagnetic interference shielding
• 7.5 Hermetic packaging
• 7.6 Others

Chapter 8 Market Estimates & Forecast, By Application, 2021-2034 (USD Billion & Kilo Tons)

• 8.1 Key trends
• 8.2 Semiconductors
• 8.3 Power electronics
• 8.4 Industrial control systems
• 8.5 Telecommunications equipment
• 8.6 Automation and robotics equipment
• 8.7 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021-2034 (USD Billion & Kilo Tons)

• 9.1 Key trends
• 9.2 North America
  • 9.2.1 U.S.
  • 9.2.2 Canada
• 9.3 Europe
  • 9.3.1 UK
  • 9.3.2 Germany
  • 9.3.3 France
  • 9.3.4 Italy
  • 9.3.5 Spain
  • 9.3.6 Russia
• 9.4 Asia Pacific
  • 9.4.1 China
  • 9.4.2 India
  • 9.4.3 Japan
  • 9.4.4 South Korea
  • 9.4.5 Australia
• 9.5 Latin America
  • 9.5.1 Brazil
  • 9.5.2 Mexico
• 9.6 MEA
  • 9.6.1 South Africa
  • 9.6.2 Saudi Arabia
  • 9.6.3 UAE

Chapter 10 Company Profiles

• 10.1 Achilles
• 10.2 Botron
• 10.3 Delphon
• 10.4 Desco
• 10.5 Dou Yee
• 10.6 DS Smith
• 10.7 Ferrari Packaging
• 10.8 GWP
• 10.9 Nefab
• 10.10 Protective Packaging
• 10.11 Protective Packaging Solutions
• 10.12 Schott
• 10.13 Sealed Air
• 10.14 Smurfit Kappa
• 10.15 Teknis
• 10.16 Toppan
• 10.17 Universal Protective Packaging
• 10.18 Xpertpack