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 카트 문의
시장보고서
상품코드
1545508

세계의 전해 동박 시장

Electrodeposited Copper Foils
발행일: | 리서치사: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 페이지 정보: 영문 179 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

전해 동박 세계 시장은 2030년까지 204억 달러에 달할 것으로 전망

2023년 108억 달러로 추정되는 전해 동박 세계 시장은 2023-2030년 분석 기간 동안 연평균 9.5% 성장하여 2030년에는 204억 달러에 달할 것으로 예상됩니다. 본 보고서에서 분석한 부문 중 하나인 20μm 이하 두께의 포일은 CAGR 11.3%를 기록하여 분석 기간 종료 시점에 132억 달러에 도달할 것으로 예상됩니다. 20-50μm 두께의 포일 부문의 성장률은 분석 기간 동안 CAGR 7.5%로 추정됩니다.

미국 시장 29억 달러, 중국은 CAGR 13.7%로 성장 전망

미국의 전해 동박 시장은 2023년 29억 달러로 추정됩니다. 세계 2위의 경제 대국인 중국은 2030년까지 시장 규모가 46억 달러에 달할 것으로 예상되며, 2023-2030년 분석 기간 동안 13.7%의 CAGR을 기록할 것으로 예상됩니다. 다른 주목할 만한 지역 시장으로는 일본과 캐나다가 있으며, 분석 기간 동안 각각 6.5%와 7.6%의 CAGR을 기록할 것으로 예상됩니다. 유럽에서는 독일이 연평균 7.4%의 성장률을 보일 것으로 예상됩니다.

세계 전해 동박 시장 - 주요 동향 및 촉진요인 요약

현대 전자제품 제조에서 전해 동박은 어떻게 중요한가?

전해 동박은 인쇄회로기판(PCB) 및 다양한 전자 장치 제조의 기본 부품으로 현대 전자제품 제조에서 중요한 역할을 하고 있습니다. 이 동박은 티타늄으로 만든 회전 드럼에 얇은 구리 층을 침전시키고 이를 박리하는 전기화학적 공정을 통해 생산됩니다. 완성된 동박은 전도성이 높고, 매우 얇고, 균일한 정밀도를 가지며, 고밀도 및 고주파 전자기기에 필수적인 특성을 가지고 있습니다. 전자 산업이 더 작고, 더 빠르고, 더 신뢰할 수 있는 장치를 계속 추구함에 따라 고품질 전해 동박의 중요성이 커지고 있습니다. 이러한 소재는 스마트폰, 컴퓨터, 첨단 자동차 전자제품 및 기타 첨단 기술 애플리케이션에 사용되는 최신 PCB에 요구되는 미세한 라인 형상을 구현하는 데 필수적입니다.

전해 동박의 기능성은 어떤 기술 혁신을 통해 향상될 수 있을까요?

전해 동박의 기술 혁신은 주로 전자 산업의 진화하는 요구 사항을 충족시키기 위해 성능 특성을 향상시키는 것을 목표로 하고 있습니다. 예를 들어, 최신 고밀도 배선(HDI) PCB에 필수적인 10마이크로미터 이하의 초박형 호일 개발이 그 예입니다. 또한, 호일 표면 처리 방법을 개선하여 전자 장치의 신뢰성과 성능에 중요한 요소인 유전체 재료와의 접착력을 향상시켰습니다. 제조업체들은 또한 고온 납땜과 같은 전자기기 조립과 관련된 까다로운 공정을 견딜 수 있도록 호일의 기계적 강도와 내열성을 향상시키는 데 주력하고 있습니다. 또한, 표면 거칠기를 줄이고 미세한 수준에서 결정립 구조를 제어하기 위한 노력으로 고주파 응용 분야에서 중요한 전기적 성능을 보다 안정적으로 제공하는 포일을 생산하고 있습니다.

전해 동박은 환경에 어떤 영향을 미칠까?

전해 동박은 주로 전자 장치의 에너지 효율과 수명 연장에 기여함으로써 환경 지속가능성에 영향을 미치고 있습니다. 더 작고, 더 가볍고, 더 효율적인 전자 장치를 제조할 수 있게 함으로써, 이 호일은 작동 수명 동안 장치의 전반적인 에너지 소비를 줄이는 데 기여합니다. 또한, 이러한 호일을 제조하는 데 사용되는 전착 공정은 환경 효율성을 높이기 위해 지속적으로 개선되고 있습니다. 여기에는 침전 공정에 사용되는 구리 및 기타 재료의 재활용과 폐기물 및 화학제품별 감소의 진전이 포함됩니다. 전 세계적으로 환경 기준이 강화됨에 따라 업계는 친환경 화학제품의 사용과 에너지 효율이 높은 공정 등 보다 지속가능한 제조 방식으로 전환하고 있습니다.

전해 동박 시장의 성장을 촉진하는 추세는 무엇인가?

전해 동박 시장의 성장은 소비자 전자제품 시장의 급속한 성장, 자동차 전자제품의 발전, 지속가능한 에너지 기술의 채택 증가 등 몇 가지 주요 트렌드에 의해 주도되고 있습니다. 소비자 전자제품의 소형화 및 고성능화 추세는 HDI PCB에 필수적인 고품질 동박에 대한 수요를 증가시키고 있습니다. 자동차 분야에서는 전기자동차(EV)로의 전환과 안전, 내비게이션, 성능 관리와 같은 전자 시스템의 사용이 증가하면서 자동차 애플리케이션에 첨단 동박의 사용이 증가하고 있습니다. 또한 재생에너지 기술, 특히 태양전지용 동박을 사용하는 태양전지 패널의 등장으로 시장 성장에 더욱 박차를 가하고 있습니다. 이러한 추세는 동박 제조 및 가공 기술의 지속적인 혁신과 함께 향후 전해 동박 산업의 확장을 지속할 것으로 보입니다.

조사 대상 기업 예시(총 11건)

  • Arcotech Ltd.
  • Chang Chun Petrochemical Co.
  • Circuit Foil Luxembourg
  • Co-tech Development Corporation
  • Furukawa Electric Co.
  • Guangdong Chaohua Technology Co.
  • Iljin Materials Co.
  • Jiangxi Copper Corp.
  • JX Nippon Mining & Metals Corporation
  • Kingboard Copper Foil Holdings Limited
  • Lingbao Huaxin Copper Foil Co.
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co.
  • Nan Ya Plastics Corporation
  • Shandong Jinbao Electronics Co.
  • Targray Technology International Inc.

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 성장 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 스페인
  • 러시아
  • 기타 유럽
  • 아시아태평양
  • 호주
  • 인도
  • 한국
  • 기타 아시아태평양
  • 라틴아메리카
  • 아르헨티나
  • 브라질
  • 멕시코
  • 기타 라틴아메리카
  • 중동
  • 이란
  • 이스라엘
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동
  • 아프리카

제4장 경쟁

ksm 24.09.10

Global Electrodeposited Copper Foils Market to Reach US$20.4 Billion by 2030

The global market for Electrodeposited Copper Foils estimated at US$10.8 Billion in the year 2023, is expected to reach US$20.4 Billion by 2030, growing at a CAGR of 9.5% over the analysis period 2023-2030. Below 20 μm Thickness Foils, one of the segments analyzed in the report, is expected to record a 11.3% CAGR and reach US$13.2 Billion by the end of the analysis period. Growth in the 20 - 50 μm Thickness Foils segment is estimated at 7.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.9 Billion While China is Forecast to Grow at 13.7% CAGR

The Electrodeposited Copper Foils market in the U.S. is estimated at US$2.9 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$4.6 Billion by the year 2030 trailing a CAGR of 13.7% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.5% and 7.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.4% CAGR.

Global Electrodeposited Copper Foils Market - Key Trends and Drivers Summarized

How Are Electrodeposited Copper Foils Pivotal in Modern Electronics Manufacturing?

Electrodeposited copper foils play a crucial role in modern electronics manufacturing, serving as fundamental components in the fabrication of printed circuit boards (PCBs) and various electronic devices. These foils are produced through an electrochemical process that deposits a thin layer of copper onto a titanium rotating drum, from which it is subsequently peeled off. The resulting copper foils are highly conductive, extremely thin, and uniformly precise, characteristics essential for high-density and high-frequency electronic applications. As the electronics industry continues to demand smaller, faster, and more reliable devices, the importance of high-quality electrodeposited copper foils grows. These materials are integral to achieving the fine line geometries required in modern PCBs, which are used in smartphones, computers, advanced automotive electronics, and other high-tech applications.

What Innovations Are Enhancing the Functionality of Electrodeposited Copper Foils?

Innovations in electrodeposited copper foils are primarily aimed at improving their performance characteristics to meet the evolving demands of the electronics industry. Advances include the development of ultra-thin foils that are less than 10 micrometers thick, which are essential for the latest generation of high-density interconnect (HDI) PCBs. Additionally, enhancements in the treatment of the foil surface have improved its adhesion to dielectric materials, a critical factor in the reliability and performance of electronic devices. Manufacturers are also focusing on increasing the mechanical strength and heat resistance of the foils to withstand the rigorous processes involved in electronics assembly, such as high-temperature soldering. Furthermore, efforts to reduce surface roughness and control grain structure at the microscopic level have resulted in foils that provide more consistent electrical performance, crucial for high-frequency applications.

How Do Electrodeposited Copper Foils Impact Environmental Sustainability?

Electrodeposited copper foils impact environmental sustainability in several ways, primarily through their contribution to the energy efficiency and longevity of electronic devices. By enabling the production of smaller, lighter, and more efficient electronics, these foils help reduce the overall energy consumption of devices throughout their operational life. Additionally, the electrodeposition process used to manufacture these foils is continually being refined to increase its eco-efficiency. This includes recycling the copper and other materials used in the deposition process, as well as advancements in reducing the waste and chemical byproducts produced. As global environmental standards tighten, the industry is also moving towards more sustainable manufacturing practices, including the use of greener chemicals and more energy-efficient processes.

What Trends Are Driving Growth in the Electrodeposited Copper Foils Market?

The growth of the electrodeposited copper foils market is driven by several key trends, including the rapid expansion of the consumer electronics market, advancements in automotive electronics, and the increasing adoption of sustainable energy technologies. As consumer electronics continue to miniaturize while requiring higher performance, the demand for high-quality copper foils essential for HDI PCBs is increasing. In the automotive sector, the shift towards electric vehicles (EVs) and the growing use of electronic systems for safety, navigation, and performance management are boosting the use of advanced copper foils in automotive applications. Additionally, the rise in renewable energy technologies, particularly solar panels, which use copper foils in their photovoltaic cells, is further propelling market growth. These trends, coupled with ongoing innovations in foil manufacturing and processing technology, are poised to sustain the expansion of the electrodeposited copper foils industry well into the future.

Select Competitors (Total 11 Featured) -

  • Arcotech Ltd.
  • Chang Chun Petrochemical Co., Ltd.
  • Circuit Foil Luxembourg
  • Co-tech Development Corporation
  • Furukawa Electric Co., Ltd.
  • Guangdong Chaohua Technology Co., Ltd.
  • Iljin Materials Co., Ltd.
  • Jiangxi Copper Corp.
  • JX Nippon Mining & Metals Corporation
  • Kingboard Copper Foil Holdings Limited
  • Lingbao Huaxin Copper Foil Co., Ltd.
  • LS Mtron Ltd.
  • Mitsui Mining & Smelting Co., Ltd.
  • Nan Ya Plastics Corporation
  • Shandong Jinbao Electronics Co. Ltd.
  • Targray Technology International Inc.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Electrodeposited Copper Foils - Global Key Competitors Percentage Market Share in 2024 (E)
    • Global Economic Update
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Growth in PCB Industry Drives Demand for High-Precision Electrodeposited Copper Foils
    • Innovations in Thin Film and Ultra-Thin Copper Foils Propel Market Opportunities
    • Increasing Applications in Lithium-Ion Batteries Bolster Demand for Copper Foils
    • Expansion of Renewable Energy Sector Spurs Use of Copper Foils in Solar Panels
    • Rising Demand for Electric Vehicles and Their Impact on Copper Foil Usage
    • Impact of 5G Deployment on Copper Foil Demand in Communication Equipment
    • Increasing Role of Asia-Pacific as a Hub for Copper Foil Production and Consumption
    • Innovations in Flexible Copper Foils for Wearable Technology
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for Electrodeposited Copper Foils by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for Electrodeposited Copper Foils by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for EMI Shielding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for EMI Shielding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for EMI Shielding by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Batteries by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for Batteries by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for Batteries by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 16: World Electrodeposited Copper Foils Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Below 20 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Below 20 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 19: World 16-Year Perspective for Below 20 μm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for 20 - 50 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 21: World Historic Review for 20 - 50 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 22: World 16-Year Perspective for 20 - 50 μm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Above 50 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Above 50 μm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 25: World 16-Year Perspective for Above 50 μm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • 6 Active Players in United States
    • TABLE 26: USA Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 28: USA 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 29: USA Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 30: USA Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 31: USA 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • CANADA
    • 7 Active Players in Canada
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: Canada 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 35: Canada Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: Canada Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: Canada 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • JAPAN
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • 8 Active Players in Japan
    • TABLE 38: Japan Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: Japan 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 41: Japan Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Japan Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Japan 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • CHINA
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • 10 Active Players in China
    • TABLE 44: China Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: China Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: China 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 47: China Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: China Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: China 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • EUROPE
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Electrodeposited Copper Foils by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Europe 16-Year Perspective for Electrodeposited Copper Foils by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: Europe 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: Europe 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • FRANCE
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • 6 Active Players in France
    • TABLE 59: France Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 60: France Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: France 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 62: France Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: France Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: France 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • GERMANY
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • 6 Active Players in Germany
    • TABLE 65: Germany Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Germany 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 68: Germany Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Germany Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: Germany 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • ITALY
    • 6 Active Players in Italy
    • TABLE 71: Italy Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: Italy 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 74: Italy Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Italy Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Italy 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • 6 Active Players in United Kingdom
    • TABLE 77: UK Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: UK 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 80: UK Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: UK Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: UK 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • SPAIN
    • 6 Active Players in Spain
    • TABLE 83: Spain Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Spain Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Spain 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 86: Spain Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: Spain Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: Spain 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • RUSSIA
    • 6 Active Players in Russia
    • TABLE 89: Russia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: Russia Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: Russia 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 92: Russia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Russia Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Russia 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • 6 Active Players in Rest of Europe
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Rest of Europe 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for Electrodeposited Copper Foils by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for Electrodeposited Copper Foils by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Asia-Pacific 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Asia-Pacific 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • AUSTRALIA
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2024 (E)
    • 6 Active Players in Australia
    • TABLE 110: Australia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 111: Australia Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 112: Australia 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 113: Australia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 114: Australia Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 115: Australia 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • INDIA
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2024 (E)
    • 7 Active Players in India
    • TABLE 116: India Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 117: India Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 118: India 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 119: India Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 120: India Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 121: India 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • SOUTH KOREA
    • 6 Active Players in South Korea
    • TABLE 122: South Korea Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 123: South Korea Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 124: South Korea 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 125: South Korea Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 126: South Korea Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 127: South Korea 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • REST OF ASIA-PACIFIC
    • 6 Active Players in Rest of Asia-Pacific
    • TABLE 128: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 129: Rest of Asia-Pacific Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 131: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 132: Rest of Asia-Pacific Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 133: Rest of Asia-Pacific 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • LATIN AMERICA
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2024 (E)
    • TABLE 134: Latin America Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 135: Latin America Historic Review for Electrodeposited Copper Foils by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 136: Latin America 16-Year Perspective for Electrodeposited Copper Foils by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2024 & 2030
    • TABLE 137: Latin America Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 138: Latin America Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 139: Latin America 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 140: Latin America Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 141: Latin America Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 142: Latin America 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • ARGENTINA
    • 6 Active Players in Argentina
    • TABLE 143: Argentina Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 144: Argentina Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 145: Argentina 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 146: Argentina Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 147: Argentina Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 148: Argentina 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • BRAZIL
    • 6 Active Players in Brazil
    • TABLE 149: Brazil Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 150: Brazil Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 151: Brazil 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 152: Brazil Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 153: Brazil Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 154: Brazil 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • MEXICO
    • 6 Active Players in Mexico
    • TABLE 155: Mexico Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 156: Mexico Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 157: Mexico 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 158: Mexico Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 159: Mexico Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 160: Mexico 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • REST OF LATIN AMERICA
    • 6 Active Players in Rest of Latin America
    • TABLE 161: Rest of Latin America Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 162: Rest of Latin America Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 163: Rest of Latin America 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 164: Rest of Latin America Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 165: Rest of Latin America Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 166: Rest of Latin America 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • MIDDLE EAST
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2024 (E)
    • TABLE 167: Middle East Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 168: Middle East Historic Review for Electrodeposited Copper Foils by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 169: Middle East 16-Year Perspective for Electrodeposited Copper Foils by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2024 & 2030
    • TABLE 170: Middle East Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 171: Middle East Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 172: Middle East 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 173: Middle East Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 174: Middle East Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 175: Middle East 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • IRAN
    • 6 Active Players in Iran
    • TABLE 176: Iran Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 177: Iran Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 178: Iran 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 179: Iran Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 180: Iran Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 181: Iran 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • ISRAEL
    • 6 Active Players in Israel
    • TABLE 182: Israel Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 183: Israel Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 184: Israel 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 185: Israel Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 186: Israel Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 187: Israel 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • SAUDI ARABIA
    • 6 Active Players in Saudi Arabia
    • TABLE 188: Saudi Arabia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 189: Saudi Arabia Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 190: Saudi Arabia 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 191: Saudi Arabia Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 192: Saudi Arabia Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 193: Saudi Arabia 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • UNITED ARAB EMIRATES
    • 6 Active Players in United Arab Emirates
    • TABLE 194: UAE Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 195: UAE Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 196: UAE 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 197: UAE Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 198: UAE Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 199: UAE 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • REST OF MIDDLE EAST
    • 6 Active Players in Rest of Middle East
    • TABLE 200: Rest of Middle East Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 201: Rest of Middle East Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 202: Rest of Middle East 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 203: Rest of Middle East Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 204: Rest of Middle East Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 205: Rest of Middle East 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030
  • AFRICA
    • Electrodeposited Copper Foils Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2024 (E)
    • 6 Active Players in Africa
    • TABLE 206: Africa Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 207: Africa Historic Review for Electrodeposited Copper Foils by Thickness - Below 20 μm, 20 - 50 μm and Above 50 μm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 208: Africa 16-Year Perspective for Electrodeposited Copper Foils by Thickness - Percentage Breakdown of Value Sales for Below 20 μm, 20 - 50 μm and Above 50 μm for the Years 2014, 2024 & 2030
    • TABLE 209: Africa Recent Past, Current & Future Analysis for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 210: Africa Historic Review for Electrodeposited Copper Foils by Application - Printed Circuit Boards, Batteries, EMI Shielding and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 211: Africa 16-Year Perspective for Electrodeposited Copper Foils by Application - Percentage Breakdown of Value Sales for Printed Circuit Boards, Batteries, EMI Shielding and Other Applications for the Years 2014, 2024 & 2030

IV. COMPETITION

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