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세계의 반도체 제조 후공정 장비 시장

Semiconductor Manufacturing Back-End Equipment
발행일: | 리서치사: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 페이지 정보: 영문 237 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

반도체 제조 후공정 장비 세계 시장은 2030년까지 1,184억 달러에 달할 전망

2024년에 692억 달러로 추정되는 반도체 제조 후공정 장비 세계 시장은 2024년부터 2030년까지 CAGR 9.4%로 성장하여 2030년에는 1,184억 달러에 달할 것으로 예측됩니다. 이 보고서에서 분석한 부문 중 하나인 웨이퍼 테스트는 CAGR 11.4%를 기록하며 분석 기간 종료시에는 497억 달러에 달할 것으로 예측됩니다. 다이싱 부문의 성장률은 분석 기간 동안 CAGR 6.7%로 추정됩니다.

미국 시장은 182억 달러로 추정, 중국은 CAGR 8.9%로 성장 예측

미국의 반도체 제조 후공정 장비 시장은 2024년에 182억 달러로 추정됩니다. 세계 2위 경제 대국인 중국은 2030년까지 187억 달러의 시장 규모에 달할 것으로 예측되며, 분석 기간인 2024-2030년 CAGR은 8.9%를 기록할 것으로 예상됩니다. 기타 주목할 만한 지역별 시장으로는 일본과 캐나다가 있고, 분석 기간 동안 CAGR은 각각 8.8%와 7.7%로 예측됩니다. 유럽에서는 독일이 CAGR 7.3%로 성장할 것으로 예측됩니다.

세계의 반도체 제조 후공정 장비 시장 - 주요 동향과 촉진요인 정리

반도체 가치사슬에서 백엔드 장비가 전략적으로 중요한 이유는 무엇일까?

반도체 제조는 크게 전공정과 후공정으로 나뉩니다. 전 공정이 웨이퍼 제조와 리소그래피를 포함한다면, 후 공정은 웨이퍼 테스트, 다이싱, 다이터치, 와이어 본딩, 플립칩, 봉지, 패키징 및 출하 전 최종 테스트를 포함합니다. 후공정은 시스템인패키지(SiP), 2.5D/3D 패키징, 이기종 통합 등 칩의 복잡화에 따라 최근 전략적으로 중요시되고 있습니다. 이러한 패키징 기술 혁신으로 인해 정확도, 청결도, 상호연결의 무결성에 대한 요구가 높아져 후공정 장비의 성능에 대한 요구가 높아지고 있습니다.

또한, 백엔드 프로세스는 칩의 성능, 폼팩터, 열 거동을 결정하는 데 있어 매우 중요한 역할을 하고 있습니다. 예를 들어, 팬아웃 웨이퍼 레벨 패키징(FOWLP), 칩렛, 임베디드 다이와 같은 첨단 패키징 기술에는 고도로 전문화된 조립 및 검사 도구가 필요합니다. 복잡한 상호연결 아키텍처를 지원하고 대량 생산 환경 전반에 걸쳐 공정 일관성을 유지하는 능력으로 후공정 장비는 반도체 비용 효율성과 기술 혁신의 중심이 되고 있습니다. 디바이스 제조사들이 풋프린트 축소와 기능 향상에 경쟁하는 가운데, 시장 출시 시간과 수율 우위를 확보하기 위해 후공정 장비에 대한 설비 투자가 증가하고 있습니다.

기술 발전은 후공정 제조 도구 세트를 어떻게 재구성하고 있는가?

반도체 패키징의 진화는 후공정 제조 툴의 발전과 밀접한 관련이 있습니다. 다이싱 장비는 현재 초박형 웨이퍼를 최소한의 손상으로 초미세먼지 없이 초미세먼지 없이 고속으로 분리할 수 있을 것으로 기대되고 있습니다. 플라즈마 다이싱과 스텔스 레이저 다이싱은 기존의 기계적인 방법을 대체할 수 있는 대안으로 등장하여 칩핑과 오염을 최소화하고 있습니다. 열 압착 본더 및 하이브리드 본더와 같은 첨단 패키징은 특히 고성능 컴퓨팅(HPC), AI, 첨단 메모리 애플리케이션과 같은 고밀도 상호연결 및 칩렛 기반 패키징에 필수적입니다.

와이어 본딩은 레거시 애플리케이션과 비용 중심의 애플리케이션에서 여전히 중요하지만, 하이엔드 부문에서는 다이터치 기술과 플립칩 기술이 주류가 되고 있습니다. 장비 제조업체는 새로운 어셈블리 아키텍처를 지원하기 위해 다이 배치 정확도, 처리량, 재료 호환성에 초점을 맞추고 있습니다. 한편, 씰링 툴은 몰드 언더필, 웨이퍼 레벨 씰링, 컨포멀 코팅을 도입하여 기계적 무결성 및 열적 신뢰성을 보장합니다. 자동 광학 검사(AOI), X-Ray 검사, 3D 측정 시스템은 실시간 결함 검출 및 적응 제어를 위해 후공정 라인에 통합되고 있습니다. 디지털 트윈과 AI 지원 결함 분석이 확산됨에 따라 후공정 장비의 고도화가 반도체 조립의 미래 경쟁력을 결정하게 될 것입니다.

후공정 장비 수요를 견인하는 애플리케이션 및 지역 동향은?

소비자 가전, 스마트폰, 컴퓨팅 하드웨어, 특히 SoC 패키징 및 메모리 통합에서 후공정 장비의 가장 큰 최종사용자는 여전히 후공정 장비의 최대 수요처입니다. 그러나 멀티칩 집적도, 전력 효율, 신뢰성이 최우선인 자동차, 데이터센터, IoT 애플리케이션에 대한 수요가 빠르게 증가하고 있습니다. ADAS(첨단 운전자 보조 시스템), EV 파워모듈, 차량용 인포테인먼트 시스템은 고도의 패키징 및 테스트 능력을 필요로 합니다. 5G와 엣지 AI 디바이스의 부상도 소형, 열 관리형 멀티 다이 패키지에 대한 수요를 증가시키고 있습니다.

지리적으로는 대만, 한국, 중국이 반도체 제조 기반이 탄탄한 만큼 후공정 장비 소비를 주도하고 있습니다. 대만의 OSAT(반도체 조립 및 테스트 아웃소싱) 산업은 ASE 그룹을 중심으로 고밀도 패키징을 지속적으로 확대하고 있으며, 한국은 삼성과 SK하이닉스와 같은 기업의 메모리 패키징 혁신에 집중하고 있습니다. 중국은 국가 주도의 인센티브와 현지 팹 건설을 통해 수입 의존도를 낮추기 위해 국내 후공정 능력을 확대하고 있습니다. 미국, 일본, 유럽은 특히 국방, HPC, 포토닉스를 위한 첨단 패키징 연구개발에 투자하고 있습니다. 일본, 독일, 미국 장비 제조사들은 하이브리드 본딩, 팬아웃, AI 최적화 어셈블리 등 새로운 수요에 대응하기 위해 제품 라인업을 확대하고 있습니다.

후공정 장비 시장의 성장을 촉진하는 요인은 무엇일까?

반도체 후공정 장비 시장의 성장은 패키징 아키텍처의 복잡성 증가, 첨단 패키징 채택 증가, 전체 애플리케이션에서 고성능 및 저지연 칩에 대한 수요 증가 등 여러 가지 요인에 의해 이루어지고 있습니다. 프론트엔드 노드가 물리적, 경제적 한계에 가까워짐에 따라 혁신적인 백엔드 패키징에서 더 많은 가치를 끌어낼 수 있게 되었습니다. 이 때문에 2.5D 인터포저, 3D IC 스태킹, 이종 집적화를 가능하게 하는 툴에 대한 강한 수요가 발생했습니다. 방열과 데이터 전송을 최대화하면서 디바이스를 소형화해야 하는 필요성은 OSAT 및 IDM 패키징 라인의 자본 확대로 이어지고 있습니다.

또한, 모놀리식 칩에서 모듈형 칩렛 기반 SoC로의 전환은 다이-투-다이 본딩 장비, 재분배층(RDL) 처리, 고처리 다이 분류에 대한 수요를 창출하고 있습니다. 자동차 및 산업용 사용 사례에서는 엄격한 품질, 신뢰성, 추적성 기준이 적용되기 때문에 인라인 검사, 분석, 스마트 팩토리 플랫폼에 대한 투자를 촉진하고 있습니다. 미국, EU, 인도에서 국내 칩 생산을 지원하는 정부 지원 프로그램도 백엔드 툴세트에 대한 새로운 수요를 창출하고 있습니다. 반도체 기업들이 보다 통합된 설계, 제조, 조립 워크플로우를 채택함에 따라 후공정 장비의 중요성과 투자는 앞으로도 크게 증가할 것입니다.

부문

유형(웨이퍼 테스트, 다이싱, 본딩, 계측, 어셈블리 및 패키징), 디멘션(2차원, 2.5차원, 3차원), 공급망(집적 디바이스 제조업체 공급망, 가전제품 공급망, 주조 공급망)

조사 대상 기업 사례

  • Advantest Corporation
  • Amkor Technology, Inc.
  • Applied Materials
  • ASM International N.V.
  • ASM Pacific Technology Ltd.
  • ASML Holding N.V.
  • BESI(BE Semiconductor)
  • Brooks Automation, Inc.
  • Cohu, Inc.
  • DISCO Corporation
  • Kulicke & Soffa Industries
  • KLA Corporation
  • Lam Research Corporation
  • MKS Instruments, Inc.
  • Nanometrics Incorporated
  • Onto Innovation Inc.
  • Rudolph Technologies(Onto)
  • Screen Holdings(SCREEN)
  • SPTS Technologies(KLA)
  • Teradyne, Inc.
  • Tokyo Electron Limited(TEL)

AI 통합

우리는 검증된 전문가 컨텐츠와 AI 툴을 통해 시장 정보와 경쟁 정보를 혁신하고 있습니다.

Global Industry Analysts는 LLM 및 업계 고유의 SLM을 조회하는 일반적인 규범을 따르는 대신 비디오 기록, 블로그, 검색 엔진 조사, 방대한 양의 기업, 제품/서비스, 시장 데이터 등 세계 전문가로부터 수집한 컨텐츠 리포지토리를 구축했습니다.

관세 영향 계수

Global Industry Analysts는 본사 소재지, 제조거점, 수출입(완제품 및 OEM)을 기준으로 기업의 경쟁력 변화를 예측하고 있습니다. 이러한 복잡하고 다면적인 시장 역학은 매출원가(COGS) 증가, 수익성 하락, 공급망 재편 등 미시적, 거시적 시장 역학 중에서도 특히 경쟁사들에게 영향을 미칠 것으로 예상됩니다.

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 기타 지역

제4장 경쟁

KSM 25.08.28

Global Semiconductor Manufacturing Back-End Equipment Market to Reach US$118.4 Billion by 2030

The global market for Semiconductor Manufacturing Back-End Equipment estimated at US$69.2 Billion in the year 2024, is expected to reach US$118.4 Billion by 2030, growing at a CAGR of 9.4% over the analysis period 2024-2030. Wafer Testing, one of the segments analyzed in the report, is expected to record a 11.4% CAGR and reach US$49.7 Billion by the end of the analysis period. Growth in the Dicing segment is estimated at 6.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$18.2 Billion While China is Forecast to Grow at 8.9% CAGR

The Semiconductor Manufacturing Back-End Equipment market in the U.S. is estimated at US$18.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$18.7 Billion by the year 2030 trailing a CAGR of 8.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.8% and 7.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.3% CAGR.

Global Semiconductor Manufacturing Back-End Equipment Market - Key Trends & Drivers Summarized

Why Is Back-End Equipment Gaining Strategic Significance in Semiconductor Value Chains?

Semiconductor manufacturing is broadly divided into front-end and back-end processes. While front-end involves wafer fabrication and lithography, back-end encompasses wafer testing, dicing, die attach, wire bonding, flip chip, encapsulation, and final testing before packaging and shipping. The back-end segment has gained strategic prominence in recent years as chip complexity increases with system-in-package (SiP), 2.5D/3D packaging, and heterogeneous integration. These packaging innovations place greater demands on precision, cleanliness, and interconnect integrity, raising the bar for back-end equipment performance.

Back-end processes have also become critical in determining chip performance, form factor, and thermal behavior. For example, advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), chiplets, and embedded die require highly specialized assembly and inspection tools. The ability to support complex interconnect architectures and maintain process consistency across high-volume manufacturing environments has made back-end equipment central to semiconductor cost-efficiency and innovation. As device manufacturers race to shrink footprints and boost functionality, capital investments in back-end equipment are rising to ensure time-to-market and yield advantages.

How Are Technological Advancements Reshaping Back-End Manufacturing Toolsets?

The evolution of semiconductor packaging is closely tied to breakthroughs in back-end manufacturing tools. Dicing equipment is now expected to deliver ultra-clean, high-speed separation with minimal damage for ultra-thin wafers. Plasma dicing and stealth laser dicing have emerged as alternatives to traditional mechanical methods, minimizing chipping and contamination. Advanced bonding tools, such as thermocompression bonders and hybrid bonders, are crucial for high-density interconnects and chiplet-based packages, particularly in high-performance computing (HPC), AI, and advanced memory applications.

Wire bonding continues to be relevant in legacy and cost-sensitive applications, but die attach and flip chip technologies are dominating in high-end segments. Equipment manufacturers are focusing on die placement accuracy, throughput, and material compatibility to support new assembly architectures. Meanwhile, encapsulation tools are incorporating molding underfill, wafer-level encapsulation, and conformal coatings to ensure mechanical integrity and thermal reliability. Automated optical inspection (AOI), X-ray inspection, and 3D metrology systems are increasingly integrated into back-end lines for real-time defect detection and adaptive control. As digital twins and AI-assisted defect analytics gain traction, the sophistication of back-end equipment will define future competitiveness in semiconductor assembly.

Which Applications and Regional Trends Are Driving Demand for Back-End Equipment?

Consumer electronics, smartphones, and computing hardware continue to be the largest end-users of back-end equipment, especially in SoC packaging and memory integration. However, demand is rapidly expanding into automotive, data centers, and IoT applications, where multi-chip integration, power efficiency, and reliability are paramount. Advanced driver-assistance systems (ADAS), EV power modules, and vehicle infotainment systems require sophisticated packaging and testing capabilities. The rise of 5G and edge AI devices is also pushing demand for compact, thermally managed multi-die packages.

Geographically, Taiwan, South Korea, and China dominate back-end equipment consumption due to their robust semiconductor manufacturing base. Taiwan’s OSAT (outsourced semiconductor assembly and test) industry, led by ASE Group, continues to scale high-density packaging, while South Korea focuses on memory packaging innovations by companies like Samsung and SK hynix. China, through state-led incentives and local fab construction, is scaling up domestic back-end capacity to reduce import dependency. The U.S., Japan, and Europe are investing in advanced packaging R&D, especially for defense, HPC, and photonics. Equipment manufacturers across Japan, Germany, and the U.S. are expanding offerings to meet emerging demand for hybrid bonding, fan-out, and AI-optimized assembly.

What Factors Are Fueling Growth in the Back-End Equipment Market?

The growth in the semiconductor back-end equipment market is driven by several factors, including the increasing complexity of packaging architectures, rising adoption of advanced packaging, and demand for high-performance, low-latency chips across applications. As front-end nodes approach physical and economic limits, more value is being extracted from innovative back-end packaging. This has created a strong pull for tools that enable 2.5D interposers, 3D IC stacking, and heterogeneous integration. The need to miniaturize devices while maximizing heat dissipation and data transfer is leading to capital expansion in OSATs and IDM packaging lines.

Additionally, the shift from monolithic chips to modular chiplet-based SoCs is creating demand for die-to-die bonding equipment, redistribution layer (RDL) processing, and high-throughput die sorting. Automotive and industrial use cases impose stringent quality, reliability, and traceability standards, prompting investment in inline inspection, analytics, and smart factory platforms. Government-backed programs supporting domestic chip production in the U.S., EU, and India are also translating into new demand for back-end toolsets. As semiconductor companies adopt more integrated design-manufacture-assembly workflows, the importance and investment in back-end equipment will continue to grow significantly.

SCOPE OF STUDY:

The report analyzes the Semiconductor Manufacturing Back-End Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Wafer Testing, Dicing, Bonding, Metrology, Assembly & Packaging); Dimension (2D Dimension, 2.5D Dimension, 3D Dimension); Supply Chain (Integrated Device Manufacturer Supply Chain, Consumer Electronic Supply Chain, Foundry Supply Chain)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

  • Advantest Corporation
  • Amkor Technology, Inc.
  • Applied Materials
  • ASM International N.V.
  • ASM Pacific Technology Ltd.
  • ASML Holding N.V.
  • BESI (BE Semiconductor)
  • Brooks Automation, Inc.
  • Cohu, Inc.
  • DISCO Corporation
  • Kulicke & Soffa Industries
  • KLA Corporation
  • Lam Research Corporation
  • MKS Instruments, Inc.
  • Nanometrics Incorporated
  • Onto Innovation Inc.
  • Rudolph Technologies (Onto)
  • Screen Holdings (SCREEN)
  • SPTS Technologies (KLA)
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Manufacturing Back-End Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Growth in Advanced Packaging Technologies Throws the Spotlight on Back-End Semiconductor Equipment Demand
    • Rising Adoption of Chiplet and 2.5D/3D Architectures Spurs Demand for Precision Die-Attach Tools
    • Proliferation of Heterogeneous Integration Techniques Expands Addressable Market for Advanced Bonding Systems
    • Miniaturization Trends in Consumer Electronics Propel Demand for Fine-Pitch Wire Bonders and Flip-Chip Bonders
    • Increased Outsourcing to OSAT Providers Strengthens Business Case for High-Volume Automated Back-End Lines
    • Emerging Use of Fan-Out Wafer-Level Packaging Drives Innovation in Mold and Singulation Technologies
    • Surging Automotive Semiconductor Demand Spurs Equipment Investments for High-Reliability Back-End Processing
    • Integration of AI and ML in Equipment Control Systems Enhances Throughput and Defect Detection Capabilities
    • Global Capacity Expansion Initiatives Accelerate Equipment Sales Across Emerging Foundry Hubs
    • Focus on Yield Optimization in Advanced Nodes Fuels Growth in Inspection and Metrology Equipment
    • Escalating Demand for Power Semiconductor Devices Drives Adoption of Back-End Equipment for Thick Wafers
    • Advancement in Low-K Dielectric and TSV Technologies Creates New Equipment Requirements
    • Shift Toward Green Manufacturing Practices Encourages Development of Eco-Efficient Equipment Solutions
    • Rise in Government Funding and Semiconductor Subsidies Globally Boosts Capital Equipment Procurement
    • Reliability Requirements in Aerospace and Defense Electronics Create Need for High-Precision Packaging Equipment
    • Integration of IoT in Equipment Monitoring Systems Strengthens Predictive Maintenance Capabilities
    • Convergence of Logic and Memory Packaging Trends Broadens Scope for Hybrid Equipment Tools
    • Increasing Design Complexity in AI and HPC Chips Spurs Demand for Multi-Layer Interconnect Assembly Systems
    • Trade Tensions and Localization Strategies Drive Regional Diversification in Equipment Supply Chains
    • Technological Convergence Between Front-End and Back-End Processes Spurs Cross-Segment Equipment Innovation
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Manufacturing Back-End Equipment Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 4: World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 7: World 16-Year Perspective for Wafer Testing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 10: World 16-Year Perspective for Dicing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 13: World 16-Year Perspective for Bonding by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 16: World 16-Year Perspective for Metrology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 19: World 16-Year Perspective for Assembly & Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 22: World 16-Year Perspective for Consumer Electronic Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 25: World 16-Year Perspective for Foundry Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 28: World 16-Year Perspective for Integrated Device Manufacturer Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 31: World 16-Year Perspective for 2D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 34: World 16-Year Perspective for 2.5D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 37: World 16-Year Perspective for 3D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 40: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 46: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 49: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 52: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 55: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • JAPAN
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 58: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 61: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 64: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CHINA
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 67: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 70: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 73: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • EUROPE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 76: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 79: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 82: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 85: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • FRANCE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 88: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 91: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 94: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • GERMANY
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 97: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 100: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 103: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 106: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 109: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 112: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 115: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 118: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 121: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 142: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 145: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 148: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030

IV. COMPETITION

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