반도체 조립 및 패키징 장비 시장 규모, 점유율, 동향 분석 보고서 : 제품 유형별, 포장 유형별, 최종 용도별, 지역별, 부문별 예측(2025-2033년)

Semiconductor Assembly & Packaging Equipment Market Summary

The global semiconductor assembly and packaging equipment market size was estimated at USD 4,421.0 million in 2024 and is projected to reach USD 9,209.0 million by 2030, growing at a CAGR of 8.4% from 2025 to 2033. This growth is driven by rising demand for compact, high-performance electronic devices.

As consumer electronics and mobile devices become smaller yet more powerful, the need for advanced packaging technologies continues to grow to meet performance, efficiency, and miniaturization requirements. A significant driver of market growth is the increasing trend of outsourcing by fabless semiconductor companies. This shift has resulted in rising demand for assembly and packaging services provided by OSAT (Outsourced Semiconductor Assembly and Test) companies. In response, OSAT providers are heavily investing in advanced assembly and packaging equipment to meet evolving customer needs.

In addition, government initiatives and semiconductor stimulus programs in regions such as the U.S., China, and Europe are further accelerating capital investments in chip production and packaging infrastructure. Collectively, these factors are propelling the robust growth trajectory of the semiconductor assembly and packaging equipment industry.

Global Semiconductor Assembly & Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global semiconductor assembly and packaging equipment market report based on packaging type,end-use, product and region.

• Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
• Flip Chip Packaging Equipment
• Wafer Level Packaging (WLP) Equipment
• Fan-Out Packaging Equipment
• System-in-Package (SiP) Equipment
• 3D/2.5D Packaging Equipment
• Others
• End-use Outlook (Revenue, USD Million, 2021 - 2033)
• IDMs (Integrated Device Manufacturers)
• OSAT (Outsourced Semiconductor Assembly and Test)
• Product Outlook (Revenue, USD Million, 2021 - 2033)
• Dicing Equipment
  • Scriber
  • Dicer
  • Wafer Mounting Equipment
• Bonding Equipment
  • Die Bonder
  • Wire Bonder
  • Others
• Packaging Equipment
  • Molding Equipment
  • Solder Plating Equipment
  • Deflasher
  • Others
• Others
• Regional Outlook (Revenue, USD Million, 2021 - 2033)
• North America
  • U.S.
  • Canada
• Mexico
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • UK
  • Netherlands
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Taiwan
• Latin America
  • Brazil
• Middle East and Africa
  • Israel
  • South Africa

Table of Contents

Chapter 1. Methodology and Scope

• 1.1. Market Segmentation & Scope
• 1.2. Market Definition
• 1.3. Information Procurement
  • 1.3.1. Purchased Database
  • 1.3.2. GVR's Internal Database
  • 1.3.3. Secondary Sources & Third-Party Perspectives
  • 1.3.4. Primary Research
• 1.4. Information Analysis
  • 1.4.1. Data Analysis Models
• 1.5. Market Formulation & Data Visualization
• 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

• 2.1. Market Snapshot
• 2.2. Segment Snapshot
• 2.3. Competitive Landscape Snapshot

Chapter 3. Global Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

• 3.1. Market Concentration & Growth Prospect Mapping
• 3.2. Industry Value Chain Analysis
  • 3.2.1. Raw Material/Component Outlook
  • 3.2.2. Manufacturer Outlook
  • 3.2.3. Distribution Outlook
  • 3.2.4. End User Outlook
• 3.3. Regulatory Framework
• 3.4. Technology Overview
• 3.5. Market Dynamics
  • 3.5.1. Market Driver Analysis
  • 3.5.2. Market Restraint Analysis
  • 3.5.3. Market Challenges Analysis
  • 3.5.4. Market Opportunity Analysis
• 3.6. Economic Mega-Trend Analysis
• 3.7. Industry Analysis Tools
  • 3.7.1. Porter's Five Forces Analysis
  • 3.7.2. Macro-environmental Analysis

Chapter 4. Global Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

• 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
• 4.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
• 4.3. IDMs (Integrated Device Manufacturers)
  • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
  • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Global Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

• 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
• 5.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Packaging Type, 2021 to 2033 (USD Million)
• 5.3. Flip Chip Packaging Equipment
  • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.4. Wafer Level Packaging (WLP) Equipment
  • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.5. Fan-Out Packaging Equipment
  • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.6. System-in-Package (SiP) Equipment
  • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.7. 3D/2.5D Packaging Equipment
  • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.8. Others
  • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Global Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

• 6.1. Product Movement Analysis & Market Share, 2024 & 2033
• 6.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
• 6.3. Dicing Equipment
  • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.2. Scriber
    • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.3. Dicer
    • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.4. Wafer Mounting Equipment
    • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.4. Bonding Equipment
  • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.2. Die Bonder
    • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.3. Wire Bonder
    • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.4. Others
    • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.5. Packaging Equipment
  • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.2. Molding Equipment
    • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.3. Solder Plating Equipment
    • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.4. Deflasher
    • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.5. Others
    • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.6. Others
  • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Global Semiconductor Assembly and Packaging Equipment Market: Regional Estimates & Trend Analysis

• 7.1. Regional Movement Analysis & Market Share, 2024 & 2033
• 7.2. North America
  • 7.2.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
  • 7.2.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
  • 7.2.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
  • 7.2.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.2.5. U.S.
    • 7.2.5.1. Key country dynamics
    • 7.2.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.2.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.2.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.2.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.2.6. Canada
    • 7.2.6.1. Key country dynamics
    • 7.2.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.2.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.2.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.2.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.2.7. Mexico
    • 7.2.7.1. Key country dynamics
    • 7.2.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.2.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.2.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.2.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
• 7.3. Europe
  • 7.3.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
  • 7.3.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
  • 7.3.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
  • 7.3.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.5. Germany
    • 7.3.5.1. Key country dynamics
    • 7.3.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.6. France
    • 7.3.6.1. Key country dynamics
    • 7.3.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.7. UK
    • 7.3.7.1. Key country dynamics
    • 7.3.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.8. Italy
    • 7.3.8.1. Key country dynamics
    • 7.3.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.9. Spain
    • 7.3.9.1. Key country dynamics
    • 7.3.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.3.10. Netherlands
    • 7.3.10.1. Key country dynamics
    • 7.3.10.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.3.10.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.3.10.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.3.10.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
• 7.4. Asia Pacific
  • 7.4.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
  • 7.4.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
  • 7.4.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
  • 7.4.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4.5. China
    • 7.4.5.1. Key country dynamics
    • 7.4.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4.6. India
    • 7.4.6.1. Key country dynamics
    • 7.4.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4.7. Japan
    • 7.4.7.1. Key country dynamics
    • 7.4.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4.8. Taiwan
    • 7.4.8.1. Key country dynamics
    • 7.4.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.4.9. South Korea
    • 7.4.9.1. Key country dynamics
    • 7.4.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.4.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.4.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.4.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
• 7.5. Latin America
  • 7.5.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
  • 7.5.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
  • 7.5.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
  • 7.5.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.5.5. Brazil
    • 7.5.5.1. Key country dynamics
    • 7.5.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.5.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.5.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.5.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
• 7.6. Middle East & Africa
  • 7.6.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
  • 7.6.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
  • 7.6.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
  • 7.6.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.6.5. Israel
    • 7.6.5.1. Key country dynamics
    • 7.6.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.6.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.6.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.6.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
  • 7.6.6. South Africa
    • 7.6.6.1. Key country dynamics
    • 7.6.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
    • 7.6.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
    • 7.6.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
    • 7.6.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)

Chapter 8. Global Semiconductor Assembly and Packaging Equipment Market - Competitive Landscape

• 8.1. Recent Developments & Impact Analysis, By Key Market Participants
• 8.2. Company Categorization
• 8.3. Company Dashboard Analysis
• 8.4. Vendor Landscape
  • 8.4.1. List of Key Raw Material/Component Providers
  • 8.4.2. List of Key Manufacturers
  • 8.4.3. List of Key Distributors
• 8.5. Company Market Share Analysis, 2024
• 8.6. Company Positioning Analysis, 2024
• 8.7. Company Heat Map Analysis, 2024
• 8.8. Strategy Mapping
• 8.9. Company Profiles
  • 8.9.1. Applied Materials
    • 8.9.1.1. Participant's overview
    • 8.9.1.2. Financial performance
    • 8.9.1.3. Product benchmarking
    • 8.9.1.4. Recent developments
  • 8.9.2. ASM Pacific Technology
    • 8.9.2.1. Participant's overview
    • 8.9.2.2. Financial performance
    • 8.9.2.3. Product benchmarking
    • 8.9.2.4. Recent developments
  • 8.9.3. Veeco Instruments Inc.
    • 8.9.3.1. Participant's overview
    • 8.9.3.2. Financial performance
    • 8.9.3.3. Product benchmarking
    • 8.9.3.4. Recent developments
  • 8.9.4. Besi
    • 8.9.4.1. Participant's overview
    • 8.9.4.2. Financial performance
    • 8.9.4.3. Product benchmarking
    • 8.9.4.4. Recent developments
  • 8.9.5. Disco Corporation
    • 8.9.5.1. Participant's overview
    • 8.9.5.2. Financial performance
    • 8.9.5.3. Product benchmarking
    • 8.9.5.4. Recent developments
  • 8.9.6. Kulicke & Soffa Industries, Inc. (K&S)
    • 8.9.6.1. Participant's overview
    • 8.9.6.2. Financial performance
    • 8.9.6.3. Product benchmarking
    • 8.9.6.4. Recent developments
  • 8.9.7. Lam Research Corporation
    • 8.9.7.1. Participant's overview
    • 8.9.7.2. Financial performance
    • 8.9.7.3. Product benchmarking
    • 8.9.7.4. Recent developments
  • 8.9.8. Nikon Corporation
    • 8.9.8.1. Participant's overview
    • 8.9.8.2. Financial performance
    • 8.9.8.3. Product benchmarking
    • 8.9.8.4. Recent developments
  • 8.9.9. Plasma-Therm
    • 8.9.9.1. Participant's overview
    • 8.9.9.2. Financial performance
    • 8.9.9.3. Product benchmarking
    • 8.9.9.4. Recent developments
  • 8.9.10. Rudolph Technologies, Inc.
    • 8.9.10.1. Participant's overview
    • 8.9.10.2. Financial performance
    • 8.9.10.3. Product benchmarking
    • 8.9.10.4. Recent developments
  • 8.9.11. SCREEN Semiconductor Solutions Co., Ltd.
    • 8.9.11.1. Participant's overview
    • 8.9.11.2. Financial performance
    • 8.9.11.3. Product benchmarking
    • 8.9.11.4. Recent developments
  • 8.9.12. SUSS MicroTec SE
    • 8.9.12.1. Participant's overview
    • 8.9.12.2. Financial performance
    • 8.9.12.3. Product benchmarking
    • 8.9.12.4. Recent developments
  • 8.9.13. Teradyne, Inc.
    • 8.9.13.1. Participant's overview
    • 8.9.13.2. Financial performance
    • 8.9.13.3. Product benchmarking
    • 8.9.13.4. Recent developments
  • 8.9.14. Tokyo Electron Limited (TEL)
    • 8.9.14.1. Participant's overview
    • 8.9.14.2. Financial performance
    • 8.9.14.3. Product benchmarking
    • 8.9.14.4. Recent developments
  • 8.9.15. Ultratech, Inc.
    • 8.9.15.1. Participant's overview
    • 8.9.15.2. Financial performance
    • 8.9.15.3. Product benchmarking
    • 8.9.15.4. Recent developments