시장보고서
상품코드
1754169

마이크로컴퓨터용 소켓 시장 보고서 : 제품·용도·지역별(2025-2033년)

Microcontroller Socket Market Report by Product (DIP, BGA, QFP, SOP, SOIC), Application (Automotive, Consumer Electronics, Industrial, Medical Devices, Military and Defense), and Region 2025-2033

발행일: | 리서치사: IMARC | 페이지 정보: 영문 145 Pages | 배송안내 : 2-3일 (영업일 기준)

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 마이크로컴퓨터용 소켓 시장 규모는 2024년에 13억 달러에 달했습니다. 향후 IMARC Group은 2033년에는 19억 달러에 달하며, 2025-2033년의 성장률(CAGR)은 4.54%에 달할 것으로 예측하고 있습니다 사물인터넷(IoT) 용도의 대폭적인 성장, 소비자 전자제품에 대한 수요 증가, 자동차용 일렉트로닉스의 급속한 발전, 스마트홈 기기 채택 증가, 산업 자동화 확대, 마이크로컨트롤러의 기술 발전 등이 시장을 주도하는 요인 중 일부입니다. 시장을 주도하는 요인 중 일부입니다.

마이크로컴퓨터용 소켓 시장 분석 :

  • 주요 시장 성장 촉진요인 : IoT 기기의 채택 확대가 마이크로컴퓨터용 소켓 수요를 크게 견인하고 있습니다. 또한 가전제품 및 스마트홈 디바이스 증가가 시장 성장을 가속하고 있습니다.
  • 주요 시장 동향 : 마이크로컨트롤러 설계의 소형화 및 고효율화 추세가 강화되고 있습니다. 또 다른 주요 동향은 AI 및 머신러닝 기능과 같은 고급 기능을 마이크로컨트롤러에 통합하는 것입니다.
  • 지역적 동향 : 아시아태평양은 주요 전자제품 제조 거점이 존재하므로 큰 폭으로 성장하고 있습니다. 북미 역시 자동차 및 산업 자동화 분야의 발전에 힘입어 중요한 시장으로 부상하고 있습니다.
  • 경쟁 구도 : 주요 시장 참여 기업에는 Advanced Interconnections, Andon Electronics, Aries Electronics Inc., Johnstech International Corporation, Loranger International Corporation, Microchip Technology 등이 있습니다.
  • 과제와 기회: 주요 과제 중 하나는 고급 마이크로컨트롤러용 소켓과 관련된 높은 비용입니다. 그러나 고급 마이크로컨트롤러 솔루션을 필요로 하는 IoT 및 스마트 기술 성장 분야에는 큰 비즈니스 기회가 있습니다.

마이컴용 소켓 시장 동향 :

비용 절감의 진전

비용 절감은 시장 성장의 주요 촉진요인입니다. 기술의 발전은 최첨단 전자 시스템의 요구를 충족시키는 데 도움이 됩니다. 그럼에도 불구하고 IC 제조업체가 비용을 줄이면서 최첨단 기술을 사용해야 할 경우, 이 선택은 주로 비용 최소화에 초점을 맞추었습니다. 이 선택은 마이크로컴퓨터 소켓 시장과 마찬가지로 비용 최소화에 초점을 맞추었습니다. 많은 주문자상표부착생산(OEM), 파운드리, 시스템 개발업체, 테스트 하청업체, 포장 업체, 칩 제조업체들은 차세대 포장 솔루션 개발에 많은 투자를 하고 있습니다. 이러한 차세대 포장 방법은 비용 효율적이며, 보다 빠른 결과를 가져다 줄 수 있습니다. 따라서 마이크로컴퓨터 소켓 시장 예측 기간 중 이러한 요인으로 인해 마이크로컴퓨터 소켓 시장 점유율이 상승할 가능성이 높습니다.

급속한 기술 발전

연료 소비를 줄이기 위한 첨단 기술에 대한 수요가 증가함에 따라 저전력 임베디드 시스템에 대한 수요가 증가하고 있습니다. 이러한 전망을 활용하기 위해 제조업체들은 파워트레인 용도를 생산하기 위해 노력하고 있습니다. 소형화 설계는 저전력 소비와 경량화가 특징입니다. 마이크로컨트롤러 소켓 시장의 이러한 발전은 고출력, 고입력, 칩당 기능성을 향상시키는 데 도움이 되고 있습니다. 또한 이러한 칩은 소형화된 포장 크기로 제공되고 있습니다. 또한 구리 와이어의 사용이 증가하여 효율성을 유지하면서 포장 비용을 절감할 수 있게 되었습니다. 이는 마이크로컴퓨터용 소켓 시장 조사 보고서에서 볼 수 있듯이 시장 확대에 기여하고 있습니다.

IC 포장의 진보성

마이크로컴퓨터용 소켓 시장은 최근 IC 포장의 발전으로 인해 저전력, 저전력 설계로 우수한 성능을 저렴하게 제공할 수 있는 IC 포장의 발전으로 인해 수혜를 받을 것으로 예측됩니다. 이러한 발전은 시스템 개발자들을 매료시키고 큰 잠재력을 보여주고 있으며, OEM, 포장 및 테스트 하청업체, 주조, 팹리스 칩 회사, 칩 제조업체들은 모두 차세대 포장 솔루션에 높은 가치를 부여하고 있습니다. 제조업체들이 더 좋고, 더 빠르고, 더 저렴한 결과를 추구함에 따라 IC 포장의 사용은 마이크로컴퓨터용 소켓 시장을 확대하고 있습니다. 마이크로컴퓨터용 소켓 시장 보고서는 이것이 마이크로컴퓨터용 소켓에 대한 수요를 증가시키고 시장 확대로 이어질 것이 및 분석합니다.

목차

제1장 서문

제2장 조사 범위와 조사 방법

  • 조사의 목적
  • 이해관계자
  • 데이터 소스
    • 1차 정보
    • 2차 정보
  • 시장 추정
    • 보텀업 어프로치
    • 톱다운 어프로치
  • 조사 방법

제3장 개요

제4장 서론

  • 개요
  • 주요 업계 동향

제5장 세계의 마이크로컴퓨터용 소켓 시장

  • 시장 개요
  • 시장 실적
  • COVID-19의 영향
  • 시장 예측

제6장 시장 내역 : 제품별

  • DIP
  • BGA
  • QFP
  • SOP
  • SOIC

제7장 시장 내역 : 용도별

  • 자동차
  • CE(Consumer Electronics)
  • 산업
  • 의료기기
  • 군과 방위

제8장 시장 내역 : 지역별

  • 북미
    • 미국
    • 캐나다
  • 아시아태평양
    • 중국
    • 일본
    • 인도
    • 한국
    • 호주
    • 인도네시아
    • 기타
  • 유럽
    • 독일
    • 프랑스
    • 영국
    • 이탈리아
    • 스페인
    • 러시아
    • 기타
  • 라틴아메리카
    • 브라질
    • 멕시코
    • 기타
  • 중동 및 아프리카
    • 시장 내역 : 국가별

제9장 SWOT 분석

  • 개요
  • 강점
  • 약점
  • 기회
  • 위협

제10장 밸류체인 분석

제11장 Porter's Five Forces 분석

  • 개요
  • 바이어의 교섭력
  • 공급 기업의 교섭력
  • 경쟁의 정도
  • 신규 진출업체의 위협
  • 대체품의 위협

제12장 가격 분석

제13장 경쟁 구도

  • 시장 구조
  • 주요 기업
  • 주요 기업의 개요
    • Advanced Interconnections
    • Andon Electronics
    • Aries Electronics Inc.
    • Johnstech International Corporation
    • Loranger International Corporation
    • Microchip Technology
    • Mill-Max Mfg. Corp.
    • PRECI-DIP SA
    • TE Connectivity
    • Texas Instruments Inc.
KSA 25.06.30

The global microcontroller socket market size reached USD 1.3 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 1.9 Billion by 2033, exhibiting a growth rate (CAGR) of 4.54% during 2025-2033. Considerable growth in the Internet of Things (IoT) applications, the increasing demand for consumer electronics, rapid advancements in automotive electronics, the rising adoption of smart home devices, the expansion of industrial automation, and technological advancements in microcontrollers are some of the factors propelling the market.

Microcontroller Socket Market Analysis:

  • Major Market Drivers: The increasing adoption of IoT devices is significantly driving the demand for microcontroller sockets. Additionally, the rise in consumer electronics and smart home devices is propelling market growth.
  • Key Market Trends: There is a growing trend towards miniaturization and higher efficiency in microcontroller designs. Another key trend is the integration of advanced features like AI and machine learning capabilities within microcontrollers.
  • Geographical Trends: The Asia-Pacific region is witnessing substantial growth due to the presence of major electronics manufacturing hubs. North America is also a significant market, driven by advancements in automotive and industrial automation sectors.
  • Competitive Landscape: Some of the key market players include Advanced Interconnections, Andon Electronics, Aries Electronics Inc., Johnstech International Corporation, Loranger International Corporation, Microchip Technology, etc.
  • Challenges and Opportunities: One of the main challenges is the high cost associated with advanced microcontroller sockets. However, there are significant opportunities in the growing fields of IoT and smart technologies, which require advanced microcontroller solutions.

Microcontroller Socket Market Trends:

Increasing cost reduction

Cost reduction is the primary driving factor of the market growth. Technological advancements assist in meeting the needs of cutting-edge electronic systems. Nonetheless, when an IC manufacturer is given the choice of keeping costs under control and using the most advanced technology. This alternative is primarily focused on cost minimization, as is the microcontroller socket market. Many original equipment manufacturers (OEMs), foundries, system developers, test subcontractors, packaging companies, and chip makers are spending extensively in developing next-generation packaging solutions. These next-generation packaging methods are more cost-effective and give speedier results. Thus, these factors are likely to increase the microcontroller socket market share throughout the microcontroller socket market forecast period.

Rapid technological advancements

The growing demand for advanced technologies to reduce fuel consumption is driving up the demand for low-power embedded systems. To take advantage of these prospects, manufacturers have begun manufacturing powertrain applications. Miniaturized designs are characterized by low power consumption and weight. Such advancements in the microcontroller socket market have helped to increase functionality per chip with high output and input. Furthermore, these chips are accessible in reduced packaging sizes. Besides, the utilization of copper wire has grown, reducing packaging costs while maintaining efficiency. This, in turn, is aiding the market expansion as shown in the microcontroller socket market research report.

Advances in IC Packaging

The microcontroller socket market is also expected to benefit from recent advances in IC packaging, which allow it to provide great performance at a cheap cost in a low-profile, low-power design. These developments demonstrate great promise, enticing system developers. OEMs, packaging and testing subcontractors, foundries, fabless chip firms, and chip makers all place a high value on next-generation packaging solutions. As manufacturers seek to produce better, faster, and cheaper results, the use of IC packaging is expanding the microcontroller socket market. This, in turn, will bolster demand for the microcontroller socket, thereby expanding the market according to microcontroller socket market report.

Microcontroller Socket Market Segmentation:

Breakup by Product:

  • DIP
  • BGA
  • QFP
  • SOP
  • SOIC

DIP dominates the market

The microcontroller socket market outlook is experiencing a boost from dual in line package (DIP) technology due to its enhanced compatibility and user friendly features. DIPs simple design, with two rows of pins arranged in parallel makes it easy to plug into sockets and breadboards making prototyping and testing quick and straightforward. This seamless integration plays a role in microcontroller applications facilitating the development and deployment of various electronic devices. DIP packages are cost effective and well supported by existing socket and circuit board setups reducing the need, for investments. As microcontroller applications continue to expand into consumer electronics, automotive and industrial sectors, the reliability and user friendliness of DIP technology drive its adoption fueling the growth of the microcontroller socket demand.

Breakup by Application:

  • Automotive
  • Consumer Electronics
  • Industrial
  • Medical Devices
  • Military and Defense

Automotive holds the largest share in the market

The automotive industry plays a role, in driving the market by using microcontrollers for functions in vehicles. Modern cars incorporate microcontrollers to oversee systems such as engine control, entertainment, safety features, and driver assistance technologies. This increase in parts calls for flexible microcontroller sockets to ensure smooth integration and upkeep. The growing popularity of self driving cars further boosts the need, for control systems and sensors. Car manufacturers emphasize the importance of high performance microcontroller sockets that can endure conditions and guarantee system durability. As a result the sectors focus on innovation and improved vehicle intelligence is significantly fueling the advancement and transformation of the microcontroller socket market growth to meet the industry expanding needs.

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Asia Pacific leads the market, accounting for the largest microcontroller socket market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific represents the largest regional market for microcontroller socket.

Asia Pacific microcontroller socket market size is expected to grow significantly over the forecast period due to the increasing demand for the product in various countries such as Japan and China. The rising demand for sockets in the microelectronics industry in various applications has led to the growth of the industry and accelerated product demand. The market is also expected to grow steadily over the forecast period due to the increasing development in the smart energy sector and wireless communications sector.

Competitive Landscape:

The market research report has provided a comprehensive analysis of the competitive landscape. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

  • Advanced Interconnections
  • Andon Electronics
  • Aries Electronics Inc.
  • Johnstech International Corporation
  • Loranger International Corporation
  • Microchip Technology
  • Mill-Max Mfg. Corp.
  • PRECI-DIP SA
  • TE Connectivity
  • Texas Instruments Inc.

The primary industry participants are focused on product development and innovation, thereby expanding the microcontroller socket market share. Vendors are pursuing mergers and acquisitions and strategic alliances to maintain their market dominance and develop their businesses. Socket makers are developing upgraded designs for linking solutions for high I/O, fine pitch, low profile applications while adhering to stringent performance and reliability criteria. Furthermore, the growing demand for advanced technologies to reduce fuel consumption is driving up the demand for low-power embedded systems. To take advantage of these prospects, manufacturers have begun manufacturing powertrain applications. Miniaturized designs are characterized by low power consumption and weight. Such advancements in the microcontroller socket industry have helped to increase functionality per chip with high output and input, thereby creating a positive microcontroller socket market overview.

Key Questions Answered in This Report

  • 1.What was the size of the global microcontroller socket market in 2024?
  • 2.What is the expected growth rate of the global microcontroller socket market during 2025-2033?
  • 3.What are the key factors driving the global microcontroller socket market?
  • 4.What has been the impact of COVID-19 on the global microcontroller socket market?
  • 5.What is the breakup of the global microcontroller socket market based on the product?
  • 6. What is the breakup of the global microcontroller socket market based on the application?
  • 7.What are the key regions in the global microcontroller socket market?
  • 8.Who are the key players/companies in the global microcontroller socket market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Microcontroller Socket Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Product

  • 6.1 DIP
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 BGA
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 QFP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 SOP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 SOIC
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast

7 Market Breakup by Application

  • 7.1 Automotive
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Consumer Electronics
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Industrial
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Medical Devices
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Military and Defense
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Advanced Interconnections
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Andon Electronics
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
    • 13.3.3 Aries Electronics Inc.
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 Johnstech International Corporation
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Loranger International Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
    • 13.3.6 Microchip Technology
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
      • 13.3.6.4 SWOT Analysis
    • 13.3.7 Mill-Max Mfg. Corp.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
    • 13.3.8 PRECI-DIP SA
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 TE Connectivity
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Texas Instruments Inc.
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
      • 13.3.10.4 SWOT Analysis
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