시장보고서
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2030848

실리콘 카바이드(SIC) 시장(2026-2030년)

Global Silicon Carbide (SIC) Market 2026-2030

발행일: | 리서치사: 구분자 TechNavio | 페이지 정보: 영문 324 Pages | 배송안내 : 즉시배송

    
    
    




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※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 실리콘 카바이드(SIC) 시장은 2025년부터 2030년까지 180억 6,990만 달러 증가하고, 예측 기간 동안 CAGR은 42.2%에 달할 것으로 예측됩니다.

세계의 실리콘 카바이드(SiC) 시장에 대해 조사 분석했으며, 시장 규모와 예측, 동향, 성장 촉진요인, 과제, 약 25개 벤더 분석 등의 정보를 전해드립니다.

이 보고서는 현재 시장 상황, 최신 동향 및 촉진요인, 그리고 전체 시장 환경에 대한 최신 분석을 제공합니다. 이 시장은 규모의 경제를 달성하기 위한 8인치 웨이퍼 제조로의 전환, 전기자동차의 고전압 아키텍처 채택 확대, AI 데이터센터의 고밀도 전력에 대한 수요에 의해 주도되고 있습니다.

본 조사는 업계 주요 관계자들의 정보를 포함한 1차 정보와 2차 정보를 객관적으로 조합하여 실시되었습니다. 이 보고서에는 주요 기업 분석과 함께 종합적인 시장 규모 데이터, 지역별 분석과 함께 부문 및 공급업체 현황이 포함되어 있습니다. 보고서에는 과거 데이터와 예측 데이터가 수록되어 있습니다.

시장 범위
기준 연도 2025년
종료 연도 2030년
조사 대상 기간 2026-2030년
성장 모멘텀 가속
2026년 전년 대비 30.8%
CAGR 42.2%
증가액 180억 6,990만 달러

이 보고서는 AI 데이터센터의 전력 아키텍처의 급격한 증가가 향후 몇 년 동안 세계 실리콘 카바이드(SiC) 시장의 성장을 주도할 주요 요인 중 하나로 꼽았습니다. 또한, 중공업 및 광업용 기계의 전동화 및 대규모 200mm 웨이퍼 제조로의 전환도 시장에서 상당한 수요를 창출할 것으로 예상됩니다.

목차

제1장 주요 요약

제2장 Technavio 분석

제3장 시장 구도

제4장 시장 규모

제5장 시장 규모 실적

제6장 정성 분석

제7장 Five Forces 분석

제8장 시장 세분화 : 제품별

제9장 시장 세분화 : 용도별

제10장 시장 세분화 : 디바이스별

제11장 시장 세분화 : 치수별

제12장 고객 상황

제13장 지역별 상황

제14장 촉진요인, 과제, 기회

제15장 경쟁 구도

제16장 경쟁 분석

제17장 부록

KSM 26.05.26

The global silicon carbide (SIC) market is forecasted to grow by USD 18069.9 mn during 2025-2030, accelerating at a CAGR of 42.2% during the forecast period. The report on the global silicon carbide (SIC) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by transition toward eight-inch wafer manufacturing for economies of scale, escalation of high-voltage architecture adoption in electric mobility, demands of ai data centers for high-density power.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Market Scope
Base Year2025
End Year2030
Series Year2026-2030
Growth MomentumAccelerate
YOY 202630.8%
CAGR42.2%
Incremental Value$18069.9 mn

Technavio's global silicon carbide (SIC) market is segmented as below:

By Product

  • Power electronics
  • Optoelectronic devices
  • Frequency devices

By Application

  • Automotive
  • Energy and power
  • Aerospace and defense
  • Data and communication devices
  • Others

By Device

  • SiC discrete device
  • SiC module

By Measurement

  • Up to 150mm
  • Greater than 150mm

Geography

  • APAC
    • China
    • Japan
    • South Korea
    • India
    • Australia
    • Indonesia
  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Spain
    • The Netherlands
  • South America
    • Brazil
    • Argentina
    • Chile
  • Middle East and Africa
    • UAE
    • South Africa
    • Turkey
  • Rest of World (ROW)

This study identifies the surge in ai data center power architectures as one of the prime reasons driving the global silicon carbide (SIC) market growth during the next few years. Also, electrification of heavy industrial and mining machinery and transition to large scale 200mm wafer manufacturing will lead to sizable demand in the market.

The report on the global silicon carbide (SIC) market covers the following areas:

  • Global silicon carbide (SIC) market sizing
  • Global silicon carbide (SIC) market forecast
  • Global silicon carbide (SIC) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global silicon carbide (SIC) market vendors that include AGSCO Corp., Asuzac Fine Ceramics Co Ltd, CeramTec GmbH, Compagnie de Saint Gobain SA, CoorsTek Inc., Dow Chemical Co., ESD SIC bv, ESK SiC GmbH, Hongwu International Group Ltd., Imerys S.A., Infineon Technologies AG, Kyocera Corp., Mersen Corporate Services SAS, Miller and Co., Morgan Advanced Materials, Murugappa Group, ON Semiconductor Corp., SNAM Abrasives Pvt. Ltd., Tokai Carbon Co. Ltd., Xiamen Powerway Co. Ltd.. Also, the global silicon carbide (SIC) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
    • Executive Summary - Chart on Market Overview
    • Executive Summary - Data Table on Market Overview
    • Executive Summary - Chart on Global Market Characteristics
    • Executive Summary - Chart on Market by Geography
    • Executive Summary - Chart on Market Segmentation by Product
    • Executive Summary - Chart on Market Segmentation by Application
    • Executive Summary - Chart on Market Segmentation by Device
    • Executive Summary - Chart on Market Segmentation by Measurement
    • Executive Summary - Chart on Incremental Growth
    • Executive Summary - Data Table on Incremental Growth
    • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

  • 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • 2.2 Criticality of inputs and Factors of differentiation
  • 2.3 Factors of disruption
  • 2.4 Impact of drivers and challenges

3 Market Landscape

  • 3.1 Market ecosystem
  • 3.2 Market characteristics
  • 3.3 Value chain analysis

4 Market Sizing

  • 4.1 Market definition
  • 4.2 Market segment analysis
    • Market segments
  • 4.3 Market size 2025
  • 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

  • 5.1 Global Silicon Carbide (SiC) Market 2020 - 2024
    • Historic Market Size - Data Table on Global Silicon Carbide (SiC) Market 2020 - 2024 ($ million)
  • 5.2 Product segment analysis 2020 - 2024
    • Historic Market Size - Product Segment 2020 - 2024 ($ million)
  • 5.3 Application segment analysis 2020 - 2024
    • Historic Market Size - Application Segment 2020 - 2024 ($ million)
  • 5.4 Device segment analysis 2020 - 2024
    • Historic Market Size - Device Segment 2020 - 2024 ($ million)
  • 5.5 Measurement segment analysis 2020 - 2024
    • Historic Market Size - Measurement Segment 2020 - 2024 ($ million)
  • 5.6 Geography segment analysis 2020 - 2024
    • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
  • 5.7 Country segment analysis 2020 - 2024
    • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

  • 6.1 Impact of AI in global silicon carbide (SiC) market
  • 6.2 Impact of geopolitical conflict on global silicon carbide (SiC) market

7 Five Forces Analysis

  • 7.1 Five forces summary
    • Five forces analysis - Comparison between 2025 and 2030
  • 7.2 Bargaining power of buyers
    • Bargaining power of buyers - Impact of key factors 2025 and 2030
  • 7.3 Bargaining power of suppliers
    • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
  • 7.4 Threat of new entrants
    • Threat of new entrants - Impact of key factors in 2025 and 2030
  • 7.5 Threat of substitutes
    • Threat of substitutes - Impact of key factors in 2025 and 2030
  • 7.6 Threat of rivalry
    • Threat of rivalry - Impact of key factors in 2025 and 2030
  • 7.7 Market condition

8 Market Segmentation by Product

  • 8.1 Market segments
  • 8.2 Comparison by Product
  • 8.3 Power electronics - Market size and forecast 2025-2030
  • 8.4 Optoelectronic devices - Market size and forecast 2025-2030
  • 8.5 Frequency devices - Market size and forecast 2025-2030
  • 8.6 Market opportunity by Product
    • Market opportunity by Product ($ million)

9 Market Segmentation by Application

  • 9.1 Market segments
  • 9.2 Comparison by Application
  • 9.3 Automotive - Market size and forecast 2025-2030
  • 9.4 Energy and power - Market size and forecast 2025-2030
  • 9.5 Aerospace and defense - Market size and forecast 2025-2030
  • 9.6 Data and communication devices - Market size and forecast 2025-2030
  • 9.7 Others - Market size and forecast 2025-2030
  • 9.8 Market opportunity by Application
    • Market opportunity by Application ($ million)

10 Market Segmentation by Device

  • 10.1 Market segments
  • 10.2 Comparison by Device
  • 10.3 SiC discrete device - Market size and forecast 2025-2030
  • 10.4 SiC module - Market size and forecast 2025-2030
  • 10.5 Market opportunity by Device
    • Market opportunity by Device ($ million)

11 Market Segmentation by Measurement

  • 11.1 Market segments
  • 11.2 Comparison by Measurement
  • 11.3 Up to 150mm - Market size and forecast 2025-2030
  • 11.4 Greater than 150mm - Market size and forecast 2025-2030
  • 11.5 Market opportunity by Measurement
    • Market opportunity by Measurement ($ million)

12 Customer Landscape

  • 12.1 Customer landscape overview
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

13 Geographic Landscape

  • 13.1 Geographic segmentation
  • 13.2 Geographic comparison
  • 13.3 APAC - Market size and forecast 2025-2030
    • 13.3.1 China - Market size and forecast 2025-2030
    • 13.3.2 Japan - Market size and forecast 2025-2030
    • 13.3.3 South Korea - Market size and forecast 2025-2030
    • 13.3.4 India - Market size and forecast 2025-2030
    • 13.3.5 Australia - Market size and forecast 2025-2030
    • 13.3.6 Indonesia - Market size and forecast 2025-2030
  • 13.4 North America - Market size and forecast 2025-2030
    • 13.4.1 US - Market size and forecast 2025-2030
    • 13.4.2 Canada - Market size and forecast 2025-2030
    • 13.4.3 Mexico - Market size and forecast 2025-2030
  • 13.5 Europe - Market size and forecast 2025-2030
    • 13.5.1 Germany - Market size and forecast 2025-2030
    • 13.5.2 France - Market size and forecast 2025-2030
    • 13.5.3 UK - Market size and forecast 2025-2030
    • 13.5.4 Italy - Market size and forecast 2025-2030
    • 13.5.5 Spain - Market size and forecast 2025-2030
    • 13.5.6 The Netherlands - Market size and forecast 2025-2030
  • 13.6 South America - Market size and forecast 2025-2030
    • 13.6.1 Brazil - Market size and forecast 2025-2030
    • 13.6.2 Argentina - Market size and forecast 2025-2030
    • 13.6.3 Chile - Market size and forecast 2025-2030
  • 13.7 Middle East and Africa - Market size and forecast 2025-2030
    • 13.7.1 Saudi Arabia - Market size and forecast 2025-2030
    • 13.7.2 UAE - Market size and forecast 2025-2030
    • 13.7.3 South Africa - Market size and forecast 2025-2030
    • 13.7.4 Turkey - Market size and forecast 2025-2030
    • 13.7.5 Israel - Market size and forecast 2025-2030
  • 13.8 Market opportunity by geography
    • Market opportunity by geography ($ million)
    • Data Tables on Market opportunity by geography ($ million)

14 Drivers, Challenges, and Opportunity

  • 14.1 Market drivers
    • Transition toward eight-inch wafer manufacturing for economies of scale
    • Escalation of high-voltage architecture adoption in electric mobility
    • Demands of AI data centers for high-density power
  • 14.2 Market challenges
    • Manufacturing complexity and yield limitations in large-diameter wafers
    • Structural vulnerabilities and geographic concentration of raw feedstocks
    • Lengthy qualification cycles and evolving global regulatory frameworks
  • 14.3 Impact of drivers and challenges
    • Impact of drivers and challenges in 2025 and 2030
  • 14.4 Market opportunities
    • Surge in AI data center power architectures
    • Electrification of heavy industrial and mining machinery
    • Transition to large scale 200mm wafer manufacturing

15 Competitive Landscape

  • 15.1 Overview
  • 15.2 Competitive Landscape
    • Overview on criticality of inputs and factors of differentiation
  • 15.3 Landscape disruption
    • Overview on factors of disruption
  • 15.4 Industry risks
    • Impact of key risks on business

16 Competitive Analysis

  • 16.1 Companies profiled
    • Companies covered
  • 16.2 Company ranking index
    • Company ranking index
  • 16.3 Market positioning of companies
    • Matrix on companies position and classification
  • 16.4 AGSCO Corp.
    • AGSCO Corp. - Overview
    • AGSCO Corp. - Product / Service
    • AGSCO Corp. - Key offerings
    • SWOT
  • 16.5 Asuzac Fine Ceramics Co Ltd
    • Asuzac Fine Ceramics Co Ltd - Overview
    • Asuzac Fine Ceramics Co Ltd - Product / Service
    • Asuzac Fine Ceramics Co Ltd - Key offerings
    • SWOT
  • 16.6 CeramTec GmbH
    • CeramTec GmbH - Overview
    • CeramTec GmbH - Business segments
    • CeramTec GmbH - Key offerings
    • CeramTec GmbH - Segment focus
    • SWOT
  • 16.7 Compagnie de Saint Gobain SA
    • Compagnie de Saint Gobain SA - Overview
    • Compagnie de Saint Gobain SA - Business segments
    • Compagnie de Saint Gobain SA - Key offerings
    • Compagnie de Saint Gobain SA - Segment focus
    • SWOT
  • 16.8 CoorsTek Inc.
    • CoorsTek Inc. - Overview
    • CoorsTek Inc. - Product / Service
    • CoorsTek Inc. - Key offerings
    • SWOT
  • 16.9 Dow Chemical Co.
    • Dow Chemical Co. - Overview
    • Dow Chemical Co. - Business segments
    • Dow Chemical Co. - Key offerings
    • Dow Chemical Co. - Segment focus
    • SWOT
  • 16.10 Hongwu International Group Ltd.
    • Hongwu International Group Ltd. - Overview
    • Hongwu International Group Ltd. - Product / Service
    • Hongwu International Group Ltd. - Key offerings
    • SWOT
  • 16.11 Imerys S.A.
    • Imerys S.A. - Overview
    • Imerys S.A. - Business segments
    • Imerys S.A. - Key news
    • Imerys S.A. - Key offerings
    • Imerys S.A. - Segment focus
    • SWOT
  • 16.12 Infineon Technologies AG
    • Infineon Technologies AG - Overview
    • Infineon Technologies AG - Business segments
    • Infineon Technologies AG - Key news
    • Infineon Technologies AG - Key offerings
    • Infineon Technologies AG - Segment focus
    • SWOT
  • 16.13 Mersen Corporate Services SAS
    • Mersen Corporate Services SAS - Overview
    • Mersen Corporate Services SAS - Business segments
    • Mersen Corporate Services SAS - Key offerings
    • Mersen Corporate Services SAS - Segment focus
    • SWOT
  • 16.14 Miller and Co.
    • Miller and Co. - Overview
    • Miller and Co. - Product / Service
    • Miller and Co. - Key offerings
    • SWOT
  • 16.15 Morgan Advanced Materials
    • Morgan Advanced Materials - Overview
    • Morgan Advanced Materials - Business segments
    • Morgan Advanced Materials - Key offerings
    • Morgan Advanced Materials - Segment focus
    • SWOT
  • 16.16 Murugappa Group
    • Murugappa Group - Overview
    • Murugappa Group - Product / Service
    • Murugappa Group - Key offerings
    • SWOT
  • 16.17 ON Semiconductor Corp.
    • ON Semiconductor Corp. - Overview
    • ON Semiconductor Corp. - Business segments
    • ON Semiconductor Corp. - Key news
    • ON Semiconductor Corp. - Key offerings
    • ON Semiconductor Corp. - Segment focus
    • SWOT
  • 16.18 Tokai Carbon Co. Ltd.
    • Tokai Carbon Co. Ltd. - Overview
    • Tokai Carbon Co. Ltd. - Product / Service
    • Tokai Carbon Co. Ltd. - Key offerings
    • SWOT

17 Appendix

  • 17.1 Scope of the report
    • Market definition
    • Objectives
    • Notes and caveats
  • 17.2 Inclusions and exclusions checklist
    • Inclusions checklist
    • Exclusions checklist
  • 17.3 Currency conversion rates for US$
    • Currency conversion rates for US$
  • 17.4 Research methodology
    • Research methodology
  • 17.5 Data procurement
    • Information sources
  • 17.6 Data validation
    • Data validation
  • 17.7 Validation techniques employed for market sizing
    • Validation techniques employed for market sizing
  • 17.8 Data synthesis
    • Data synthesis
  • 17.9 360 degree market analysis
    • 360 degree market analysis
  • 17.10 List of abbreviations
    • List of abbreviations
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