세계의 본딩 와이어 시장 규모, 점유율, 동향 분석 리포트 : 재료별, 용도별, 지역별, 전망과 예측(2024-2031년)

The Global Bonding Wires Market size is expected to reach $16.4 billion by 2031, rising at a market growth of 3.6% CAGR during the forecast period.

Gold is highly resistant to corrosion and oxidation, ensuring the long-term reliability of bonding wire connections in diverse operating environments. This property is particularly important in high-reliability applications such as aerospace, medical devices, and automotive electronics. Hence, the gold segment captured $2,900.09 million revenue in the market in 2023. The gold bonding wires continues to be a fundamental and widely adopted solution in semiconductor packaging, providing a balance of electrical performance, reliability, and compatibility with industry standards.

Miniaturization often involves adopting three-dimensional (3D) packaging structures, such as stacked dies or through-silicon vias (TSVs). Bonding wires play a crucial role in establishing connections between different layers of 3D packages, requiring specialized bonding techniques to ensure reliable electrical connectivity across multiple levels. Additionally, IoT devices, which include smart home appliances, wearable devices, industrial sensors, and connected vehicles, require reliable and efficient electrical connections to function effectively. Bonding wires are crucial in providing these connections, ensuring IoT devices can communicate seamlessly with each other and the cloud. Bonding wires enable the miniaturization of IoT devices, allowing them to be smaller and more discreet while still providing the necessary functionality.

However, Raw material prices can be volatile due to supply-demand dynamics, geopolitical events, and currency fluctuations. These fluctuations can create uncertainty for manufacturers in the market, challenging predicting and managing production costs. This uncertainty can lead to cautious investment decisions and potentially disrupt supply chains. Manufacturers may hesitate to allocate resources to R&D efforts if they are uncertain about the long-term stability of raw material costs or anticipate continued fluctuations that could affect the viability of new products. Hence, all these factors may hamper the growth of the market.

Material Outlook

Based on material, the market is divided into gold, copper, silver, aluminium, and others. The copper segment acquired 20% revenues share in the market in 2023. Copper has superior thermal conductivity compared to gold and aluminum. This property enables better heat dissipation within semiconductor packages, improving thermal management and reliability, especially in high-power applications or devices operating in elevated temperatures. Copper bonding wires exhibit good mechanical properties, including high ductility and tensile strength.

Application Outlook

On the basis of application, the market is classified into integrated circuits, transistors, sensors, and others. The integrated circuits segment recorded 40% revenue share in the market in 2023. Within an integrated circuit, bonding wires connect the active components, such as transistors and diodes, to the bonding pads on the chip's surface. They also connect different chip layers, facilitating interconnectivity between circuit elements. These wires facilitate the transmission of electrical signals between the chip and the external world, enabling the functionality of the integrated circuit.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment garnered a 43% revenue share in the market in 2023. The region is a global manufacturing hub for various industries, including semiconductors and electronics. Bonding wires are essential components used in semiconductor packaging and assembly processes. The region's strong manufacturing base and extensive supply chain infrastructure contribute to its significant presence in the market.

List of Key Companies Profiled

• Tatsuta Electric Wire & Cable Co., Ltd.
• Tanaka Denshi Kogyo K.K.
• Heraeus Holding GmbH
• Ametek, Inc.
• Sumitomo Electric Industries, Ltd.
• MK Electron Co., Ltd.
• ASMPT Limited
• California Fine Wire Co.
• Berkenhoff GmbH (Bedra)

Global Bonding Wires Market Report Segmentation

By Material

• Aluminium
• Gold
• Copper
• Silver
• Others

By Application

• Integrated Circuits
• Transistors
• Sensors
• Others

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1.Market Scope & Methodology

• 1.1Market Definition
• 1.2Objectives
• 1.3Market Scope
• 1.4Segmentation
  • 1.4.1Global Bonding Wires Market, by Material
  • 1.4.2Global Bonding Wires Market, by Application
  • 1.4.3Global Bonding Wires Market, by Geography
• 1.5Methodology for the research

Chapter 2.Market at a Glance

• 2.1Key Highlights

Chapter 3.Market Overview

• 3.1Introduction
  • 3.1.1Overview
    • 3.1.1.1Market Composition and Scenario
• 3.2Key Factors Impacting the Market
  • 3.2.1Market Drivers
  • 3.2.2Market Restraints
  • 3.2.3Market Opportunities
  • 3.2.4Market Challenges
• 3.3Porter's Five Forces Analysis

Chapter 4.Global Bonding Wires Market by Material

• 4.1Global Aluminium Market by Region
• 4.2Global Gold Market by Region
• 4.3Global Copper Market by Region
• 4.4Global Silver Market by Region
• 4.5Global Others Market by Region

Chapter 5.Global Bonding Wires Market by Application

• 5.1Global Integrated Circuits Market by Region
• 5.2Global Transistors Market by Region
• 5.3Global Sensors Market by Region
• 5.4Global Others Market by Region

Chapter 6.Global Bonding Wires Market by Region

• 6.1North America Bonding Wires Market
  • 6.1.1North America Bonding Wires Market by Material
    • 6.1.1.1North America Aluminium Market by Country
    • 6.1.1.2North America Gold Market by Country
    • 6.1.1.3North America Copper Market by Country
    • 6.1.1.4North America Silver Market by Country
    • 6.1.1.5North America Others Market by Country
  • 6.1.2North America Bonding Wires Market by Application
    • 6.1.2.1North America Integrated Circuits Market by Country
    • 6.1.2.2North America Transistors Market by Country
    • 6.1.2.3North America Sensors Market by Country
    • 6.1.2.4North America Others Market by Country
  • 6.1.3North America Bonding Wires Market by Country
    • 6.1.3.1US Bonding Wires Market
      • 6.1.3.1.1US Bonding Wires Market by Material
      • 6.1.3.1.2US Bonding Wires Market by Application
    • 6.1.3.2Canada Bonding Wires Market
      • 6.1.3.2.1Canada Bonding Wires Market by Material
      • 6.1.3.2.2Canada Bonding Wires Market by Application
    • 6.1.3.3Mexico Bonding Wires Market
      • 6.1.3.3.1Mexico Bonding Wires Market by Material
      • 6.1.3.3.2Mexico Bonding Wires Market by Application
    • 6.1.3.4Rest of North America Bonding Wires Market
      • 6.1.3.4.1Rest of North America Bonding Wires Market by Material
      • 6.1.3.4.2Rest of North America Bonding Wires Market by Application
• 6.2Europe Bonding Wires Market
  • 6.2.1Europe Bonding Wires Market by Material
    • 6.2.1.1Europe Aluminium Market by Country
    • 6.2.1.2Europe Gold Market by Country
    • 6.2.1.3Europe Copper Market by Country
    • 6.2.1.4Europe Silver Market by Country
    • 6.2.1.5Europe Others Market by Country
  • 6.2.2Europe Bonding Wires Market by Application
    • 6.2.2.1Europe Integrated Circuits Market by Country
    • 6.2.2.2Europe Transistors Market by Country
    • 6.2.2.3Europe Sensors Market by Country
    • 6.2.2.4Europe Others Market by Country
  • 6.2.3Europe Bonding Wires Market by Country
    • 6.2.3.1Germany Bonding Wires Market
      • 6.2.3.1.1Germany Bonding Wires Market by Material
      • 6.2.3.1.2Germany Bonding Wires Market by Application
    • 6.2.3.2UK Bonding Wires Market
      • 6.2.3.2.1UK Bonding Wires Market by Material
      • 6.2.3.2.2UK Bonding Wires Market by Application
    • 6.2.3.3France Bonding Wires Market
      • 6.2.3.3.1France Bonding Wires Market by Material
      • 6.2.3.3.2France Bonding Wires Market by Application
    • 6.2.3.4Russia Bonding Wires Market
      • 6.2.3.4.1Russia Bonding Wires Market by Material
      • 6.2.3.4.2Russia Bonding Wires Market by Application
    • 6.2.3.5Spain Bonding Wires Market
      • 6.2.3.5.1Spain Bonding Wires Market by Material
      • 6.2.3.5.2Spain Bonding Wires Market by Application
    • 6.2.3.6Italy Bonding Wires Market
      • 6.2.3.6.1Italy Bonding Wires Market by Material
      • 6.2.3.6.2Italy Bonding Wires Market by Application
    • 6.2.3.7Rest of Europe Bonding Wires Market
      • 6.2.3.7.1Rest of Europe Bonding Wires Market by Material
      • 6.2.3.7.2Rest of Europe Bonding Wires Market by Application
• 6.3Asia Pacific Bonding Wires Market
  • 6.3.1Asia Pacific Bonding Wires Market by Material
    • 6.3.1.1Asia Pacific Aluminium Market by Country
    • 6.3.1.2Asia Pacific Gold Market by Country
    • 6.3.1.3Asia Pacific Copper Market by Country
    • 6.3.1.4Asia Pacific Silver Market by Country
    • 6.3.1.5Asia Pacific Others Market by Country
  • 6.3.2Asia Pacific Bonding Wires Market by Application
    • 6.3.2.1Asia Pacific Integrated Circuits Market by Country
    • 6.3.2.2Asia Pacific Transistors Market by Country
    • 6.3.2.3Asia Pacific Sensors Market by Country
    • 6.3.2.4Asia Pacific Others Market by Country
  • 6.3.3Asia Pacific Bonding Wires Market by Country
    • 6.3.3.1China Bonding Wires Market
      • 6.3.3.1.1China Bonding Wires Market by Material
      • 6.3.3.1.2China Bonding Wires Market by Application
    • 6.3.3.2Japan Bonding Wires Market
      • 6.3.3.2.1Japan Bonding Wires Market by Material
      • 6.3.3.2.2Japan Bonding Wires Market by Application
    • 6.3.3.3India Bonding Wires Market
      • 6.3.3.3.1India Bonding Wires Market by Material
      • 6.3.3.3.2India Bonding Wires Market by Application
    • 6.3.3.4South Korea Bonding Wires Market
      • 6.3.3.4.1South Korea Bonding Wires Market by Material
      • 6.3.3.4.2South Korea Bonding Wires Market by Application
    • 6.3.3.5Singapore Bonding Wires Market
      • 6.3.3.5.1Singapore Bonding Wires Market by Material
      • 6.3.3.5.2Singapore Bonding Wires Market by Application
    • 6.3.3.6Taiwan Bonding Wires Market
      • 6.3.3.6.1Taiwan Bonding Wires Market by Material
      • 6.3.3.6.2Taiwan Bonding Wires Market by Application
    • 6.3.3.7Rest of Asia Pacific Bonding Wires Market
      • 6.3.3.7.1Rest of Asia Pacific Bonding Wires Market by Material
      • 6.3.3.7.2Rest of Asia Pacific Bonding Wires Market by Application
• 6.4LAMEA Bonding Wires Market
  • 6.4.1LAMEA Bonding Wires Market by Material
    • 6.4.1.1LAMEA Aluminium Market by Country
    • 6.4.1.2LAMEA Gold Market by Country
    • 6.4.1.3LAMEA Copper Market by Country
    • 6.4.1.4LAMEA Silver Market by Country
    • 6.4.1.5LAMEA Others Market by Country
  • 6.4.2LAMEA Bonding Wires Market by Application
    • 6.4.2.1LAMEA Integrated Circuits Market by Country
    • 6.4.2.2LAMEA Transistors Market by Country
    • 6.4.2.3LAMEA Sensors Market by Country
    • 6.4.2.4LAMEA Others Market by Country
  • 6.4.3LAMEA Bonding Wires Market by Country
    • 6.4.3.1Brazil Bonding Wires Market
      • 6.4.3.1.1Brazil Bonding Wires Market by Material
      • 6.4.3.1.2Brazil Bonding Wires Market by Application
    • 6.4.3.2Argentina Bonding Wires Market
      • 6.4.3.2.1Argentina Bonding Wires Market by Material
      • 6.4.3.2.2Argentina Bonding Wires Market by Application
    • 6.4.3.3UAE Bonding Wires Market
      • 6.4.3.3.1UAE Bonding Wires Market by Material
      • 6.4.3.3.2UAE Bonding Wires Market by Application
    • 6.4.3.4Saudi Arabia Bonding Wires Market
      • 6.4.3.4.1Saudi Arabia Bonding Wires Market by Material
      • 6.4.3.4.2Saudi Arabia Bonding Wires Market by Application
    • 6.4.3.5South Africa Bonding Wires Market
      • 6.4.3.5.1South Africa Bonding Wires Market by Material
      • 6.4.3.5.2South Africa Bonding Wires Market by Application
    • 6.4.3.6Nigeria Bonding Wires Market
      • 6.4.3.6.1Nigeria Bonding Wires Market by Material
      • 6.4.3.6.2Nigeria Bonding Wires Market by Application
    • 6.4.3.7Rest of LAMEA Bonding Wires Market
      • 6.4.3.7.1Rest of LAMEA Bonding Wires Market by Material
      • 6.4.3.7.2Rest of LAMEA Bonding Wires Market by Application

Chapter 7.Company Profiles

• 7.1Tatsuta Electric Wire & Cable Co., Ltd.
  • 7.1.1Company Overview
  • 7.1.2Financial Analysis
  • 7.1.3Segmental and Regional Analysis
  • 7.1.4SWOT Analysis
• 7.2Tanaka Denshi Kogyo K.K.
  • 7.2.1Company Overview
  • 7.2.2Financial Analysis
• 7.3Heraeus Holding GmbH (Heraeus Electronics)
  • 7.3.1Company Overview
  • 7.3.2SWOT Analysis
• 7.4Ametek, Inc.
  • 7.4.1Company Overview
  • 7.4.2Financial Analysis
  • 7.4.3Segmental and Regional Analysis
  • 7.4.4Research & Development Expenses
  • 7.4.5SWOT Analysis
• 7.5Sumitomo Electric Industries, Ltd.
  • 7.5.1Company Overview
  • 7.5.2Financial Analysis
  • 7.5.3Segmental and Regional Analysis
  • 7.5.4Research & Development Expenses
  • 7.5.5SWOT Analysis
• 7.6MK Electron Co., Ltd.
  • 7.6.1Company Overview
• 7.7ASMPT Limited
  • 7.7.1Company Overview
  • 7.7.2Financial Analysis
  • 7.7.3Segmental and Regional Analysis
  • 7.7.4Research & Development Expenses
  • 7.7.5SWOT Analysis
• 7.8California Fine Wire Co.
  • 7.8.1Company Overview
• 7.9Berkenhoff GmbH (Bedra)
  • 7.9.1Company Overview

Chapter 8.Winning Imperatives of Bonding Wires Market