첨단 패키징 시장(2024-2031년) : 시장 규모, 점유율 및 동향 분석(유형별, 최종 사용자별, 최종 용도별), 지역별 전망 및 예측

The Global Advanced Packaging Market size is expected to reach $73.16 billion by 2031, rising at a market growth of 9.2% CAGR during the forecast period.

Wafer level chip scale package (WLCSP) is unique because it involves packaging the semiconductor die at the wafer level, eliminating the need for a separate substrate. This reduces package size and height while maintaining excellent electrical and thermal performance. WLCSP is highly suitable for miniaturized devices such as sensors, MEMS, and compact consumer electronics like earbuds and fitness trackers. Hence, the wafer level CSP segment acquired 14% revenue share in the market in 2023. Its simplicity in manufacturing and the ability to produce ultra-thin, lightweight packages have made it a preferred choice for applications requiring high reliability and compact form factors. As IoT and wearable technologies expand, the demand for WLCSP will increase.

The semiconductor industry also relies on advanced packaging to support ongoing miniaturization trends. As transistor sizes continue to shrink, conventional packaging methods are insufficient to maintain connectivity and reliability. Innovative approaches, such as heterogeneous integration, which combines different types of chips into a single package, have become vital for achieving the high-density, high-performance designs required by modern devices. Additionally, the interplay between IoT and 5G further amplifies the need for innovative packaging solutions. IoT devices generate enormous volumes of data, while 5G networks facilitate their transmission with unprecedented speed and reliability. This synergy necessitates packaging technologies that provide enhanced thermal performance, signal integrity, and energy efficiency, enabling the seamless functioning of interconnected ecosystems. Therefore, the demand for advanced packaging will grow as the semiconductor industry expands and evolves.

However, the complexity of these manufacturing processes can present significant challenges to the industry. Longer production cycles are common, as advanced packaging requires multiple steps, including wafer-level packaging, die stacking, and advanced interconnect technologies. Each step must meet exacting standards, increasing the risk of defects during production. Even minor inaccuracies can lead to substantial losses, as flawed components may undermine the operational integrity of high-value electronic devices. These challenges may impede adoption, particularly for organizations that lack the requisite resources or expertise to navigate such complex processes. Moreover, the time and costs associated with troubleshooting and ensuring quality control further contribute to the overall burden. Thus, such issues may hamper the expansion of the market.

Type Outlook

Based on type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. The flip chip CSP segment procured 18% revenue share in the market in 2023. Flip chip chip scale package (CSP) integrates the chip and substrates in a small form factor, offering improved electrical performance compared to traditional wire-bonded packages. This technology is extensively employed in consumer electronics, particularly in smartphones, wearable devices, and Internet of Things (IoT) devices, where considerations of spatial limitations and cost-effectiveness are paramount.

End User Outlook

On the basis of end user, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. The consumer electronics segment recorded 36% revenue share in the market in 2023. The ever-growing demand for compact, high-performance devices such as smartphones, tablets, laptops, and wearable technology drives this dominance. The proliferation of IoT-enabled devices and the transition to 5G technology further accelerate the demand for advanced semiconductor solutions. In addition, consumer expectations for slimmer, lightweight devices with enhanced processing power and battery life fuel innovation in this segment. As consumer electronics evolve rapidly, the demand for advanced packaging solutions will remain robust.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment procured 46% revenue share in the market in 2023. This leadership is primarily attributed to the region's robust semiconductor manufacturing ecosystem, driven by countries like China, Taiwan, South Korea, and Japan. These nations are home to some of the largest semiconductor foundries and packaging companies, such as TSMC, Samsung, and ASE Technology, which significantly contribute to market growth. The region's adoption of cutting-edge packaging technologies has been spurred by the rising demand for consumer electronics, including laptops, cell phones, and wearable technology.

Recent Strategies Deployed in the Market

• Dec-2024: IBM introduced co-packaged optics to improve energy efficiency and bandwidth in AI computing. By integrating optical links onto chips and within data centers, this innovation reduces energy consumption by over 80%, boosting chip-to-chip communication and speeding up model training.
• Jun-2024: IBM Corporation and Rapidus have expanded their partnership to develop mass production technologies for chiplet packaging, focusing on 2nm-generation semiconductors. The collaboration aims to advance semiconductor packaging for high-performance systems, with research and manufacturing taking place at IBM's North American facilities.
• Apr-2024: Qualcomm Incorporated unveiled new AI-ready IoT platforms and the QCC730 Wi-Fi SoC at Embedded World 2024, emphasizing low-power, high-performance processing for industrial and consumer applications. These innovations enhance on-device AI, connectivity, and efficiency, supporting next-generation IoT solutions and digital transformation.
• Feb-2024: Intel Corporation and Cadence have teamed up to develop an advanced packaging flow using Intel's EMIB technology. This collaboration streamlines the design process for multi-chiplet architectures, enhancing HPC, AI, and mobile computing, reducing design cycles, and ensuring efficient signoff.
• Dec-2023: Samsung Electronics Co., Ltd. (Samsung Semiconductor) has expanded its product offerings with advanced packaging solutions, including I-Cube and X-Cube technologies. These innovations integrate logic and memory semiconductors in 2.5D and 3D packages, enhancing performance, power efficiency, and cost-effectiveness, advancing beyond Moore's Law.

List of Key Companies Profiled

• Qualcomm Incorporated (Qualcomm Technologies, Inc.)
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Microchip Technology Incorporated
• Infineon Technologies AG
• Samsung Electronics Co., Ltd. (Samsung Group)
• Renesas Electronics Corporation
• VMware, Inc. (Broadcom Inc.)

Global Advanced Packaging Market Report Segmentation

By Type

• Flip-Chip Ball Grid Array
• Fan-out WLP
• Flip chip CSP
• Wafer level CSP
• 2.5D/3D
• Other Type

By End User

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End User

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1. Market Scope & Methodology

• 1.1 Market Definition
• 1.2 Objectives
• 1.3 Market Scope
• 1.4 Segmentation
  • 1.4.1 Global Advanced Packaging Market, by Type
  • 1.4.2 Global Advanced Packaging Market, by End User
  • 1.4.3 Global Advanced Packaging Market, by Geography
• 1.5 Methodology for the research

Chapter 2. Market at a Glance

• 2.1 Key Highlights

Chapter 3. Market Overview

• 3.1 Introduction
  • 3.1.1 Overview
    • 3.1.1.1 Market Composition and Scenario
• 3.2 Key Factors Impacting the Market
  • 3.2.1 Market Drivers
  • 3.2.2 Market Restraints
  • 3.2.3 Market Opportunities
  • 3.2.4 Market Challenges

Chapter 4. Competition Analysis - Global

• 4.1 Market Share Analysis, 2023
• 4.2 Strategies Deployed in Advanced Packaging Market
• 4.3 Porter Five Forces Analysis

Chapter 5. Global Advanced Packaging Market by Type

• 5.1 Global Flip-Chip Ball Grid Array Market by Region
• 5.2 Global Fan-out WLP Market by Region
• 5.3 Global Flip chip CSP Market by Region
• 5.4 Global Wafer level CSP Market by Region
• 5.5 Global 2.5D/3D Market by Region
• 5.6 Global Other Type Market by Region

Chapter 6. Global Advanced Packaging Market by End User

• 6.1 Global Consumer Electronics Market by Region
• 6.2 Global Automotive Market by Region
• 6.3 Global Industrial Market by Region
• 6.4 Global Healthcare Market by Region
• 6.5 Global Aerospace & Defense Market by Region
• 6.6 Global Other End User Market by Region

Chapter 7. Global Advanced Packaging Market by Region

• 7.1 North America Advanced Packaging Market
  • 7.1.1 North America Advanced Packaging Market by Type
    • 7.1.1.1 North America Flip-Chip Ball Grid Array Market by Country
    • 7.1.1.2 North America Fan-out WLP Market by Country
    • 7.1.1.3 North America Flip chip CSP Market by Country
    • 7.1.1.4 North America Wafer level CSP Market by Country
    • 7.1.1.5 North America 2.5D/3D Market by Country
    • 7.1.1.6 North America Other Type Market by Country
  • 7.1.2 North America Advanced Packaging Market by End User
    • 7.1.2.1 North America Consumer Electronics Market by Country
    • 7.1.2.2 North America Automotive Market by Country
    • 7.1.2.3 North America Industrial Market by Country
    • 7.1.2.4 North America Healthcare Market by Country
    • 7.1.2.5 North America Aerospace & Defense Market by Country
    • 7.1.2.6 North America Other End User Market by Country
  • 7.1.3 North America Advanced Packaging Market by Country
    • 7.1.3.1 US Advanced Packaging Market
      • 7.1.3.1.1 US Advanced Packaging Market by Type
      • 7.1.3.1.2 US Advanced Packaging Market by End User
    • 7.1.3.2 Canada Advanced Packaging Market
      • 7.1.3.2.1 Canada Advanced Packaging Market by Type
      • 7.1.3.2.2 Canada Advanced Packaging Market by End User
    • 7.1.3.3 Mexico Advanced Packaging Market
      • 7.1.3.3.1 Mexico Advanced Packaging Market by Type
      • 7.1.3.3.2 Mexico Advanced Packaging Market by End User
    • 7.1.3.4 Rest of North America Advanced Packaging Market
      • 7.1.3.4.1 Rest of North America Advanced Packaging Market by Type
      • 7.1.3.4.2 Rest of North America Advanced Packaging Market by End User
• 7.2 Europe Advanced Packaging Market
  • 7.2.1 Europe Advanced Packaging Market by Type
    • 7.2.1.1 Europe Flip-Chip Ball Grid Array Market by Country
    • 7.2.1.2 Europe Fan-out WLP Market by Country
    • 7.2.1.3 Europe Flip chip CSP Market by Country
    • 7.2.1.4 Europe Wafer level CSP Market by Country
    • 7.2.1.5 Europe 2.5D/3D Market by Country
    • 7.2.1.6 Europe Other Type Market by Country
  • 7.2.2 Europe Advanced Packaging Market by End User
    • 7.2.2.1 Europe Consumer Electronics Market by Country
    • 7.2.2.2 Europe Automotive Market by Country
    • 7.2.2.3 Europe Industrial Market by Country
    • 7.2.2.4 Europe Healthcare Market by Country
    • 7.2.2.5 Europe Aerospace & Defense Market by Country
    • 7.2.2.6 Europe Other End User Market by Country
  • 7.2.3 Europe Advanced Packaging Market by Country
    • 7.2.3.1 Germany Advanced Packaging Market
      • 7.2.3.1.1 Germany Advanced Packaging Market by Type
      • 7.2.3.1.2 Germany Advanced Packaging Market by End User
    • 7.2.3.2 UK Advanced Packaging Market
      • 7.2.3.2.1 UK Advanced Packaging Market by Type
      • 7.2.3.2.2 UK Advanced Packaging Market by End User
    • 7.2.3.3 France Advanced Packaging Market
      • 7.2.3.3.1 France Advanced Packaging Market by Type
      • 7.2.3.3.2 France Advanced Packaging Market by End User
    • 7.2.3.4 Russia Advanced Packaging Market
      • 7.2.3.4.1 Russia Advanced Packaging Market by Type
      • 7.2.3.4.2 Russia Advanced Packaging Market by End User
    • 7.2.3.5 Spain Advanced Packaging Market
      • 7.2.3.5.1 Spain Advanced Packaging Market by Type
      • 7.2.3.5.2 Spain Advanced Packaging Market by End User
    • 7.2.3.6 Italy Advanced Packaging Market
      • 7.2.3.6.1 Italy Advanced Packaging Market by Type
      • 7.2.3.6.2 Italy Advanced Packaging Market by End User
    • 7.2.3.7 Rest of Europe Advanced Packaging Market
      • 7.2.3.7.1 Rest of Europe Advanced Packaging Market by Type
      • 7.2.3.7.2 Rest of Europe Advanced Packaging Market by End User
• 7.3 Asia Pacific Advanced Packaging Market
  • 7.3.1 Asia Pacific Advanced Packaging Market by Type
    • 7.3.1.1 Asia Pacific Flip-Chip Ball Grid Array Market by Country
    • 7.3.1.2 Asia Pacific Fan-out WLP Market by Country
    • 7.3.1.3 Asia Pacific Flip chip CSP Market by Country
    • 7.3.1.4 Asia Pacific Wafer level CSP Market by Country
    • 7.3.1.5 Asia Pacific 2.5D/3D Market by Country
    • 7.3.1.6 Asia Pacific Other Type Market by Country
  • 7.3.2 Asia Pacific Advanced Packaging Market by End User
    • 7.3.2.1 Asia Pacific Consumer Electronics Market by Country
    • 7.3.2.2 Asia Pacific Automotive Market by Country
    • 7.3.2.3 Asia Pacific Industrial Market by Country
    • 7.3.2.4 Asia Pacific Healthcare Market by Country
    • 7.3.2.5 Asia Pacific Aerospace & Defense Market by Country
    • 7.3.2.6 Asia Pacific Other End User Market by Country
  • 7.3.3 Asia Pacific Advanced Packaging Market by Country
    • 7.3.3.1 China Advanced Packaging Market
      • 7.3.3.1.1 China Advanced Packaging Market by Type
      • 7.3.3.1.2 China Advanced Packaging Market by End User
    • 7.3.3.2 Japan Advanced Packaging Market
      • 7.3.3.2.1 Japan Advanced Packaging Market by Type
      • 7.3.3.2.2 Japan Advanced Packaging Market by End User
    • 7.3.3.3 India Advanced Packaging Market
      • 7.3.3.3.1 India Advanced Packaging Market by Type
      • 7.3.3.3.2 India Advanced Packaging Market by End User
    • 7.3.3.4 South Korea Advanced Packaging Market
      • 7.3.3.4.1 South Korea Advanced Packaging Market by Type
      • 7.3.3.4.2 South Korea Advanced Packaging Market by End User
    • 7.3.3.5 Singapore Advanced Packaging Market
      • 7.3.3.5.1 Singapore Advanced Packaging Market by Type
      • 7.3.3.5.2 Singapore Advanced Packaging Market by End User
    • 7.3.3.6 Malaysia Advanced Packaging Market
      • 7.3.3.6.1 Malaysia Advanced Packaging Market by Type
      • 7.3.3.6.2 Malaysia Advanced Packaging Market by End User
    • 7.3.3.7 Rest of Asia Pacific Advanced Packaging Market
      • 7.3.3.7.1 Rest of Asia Pacific Advanced Packaging Market by Type
      • 7.3.3.7.2 Rest of Asia Pacific Advanced Packaging Market by End User
• 7.4 LAMEA Advanced Packaging Market
  • 7.4.1 LAMEA Advanced Packaging Market by Type
    • 7.4.1.1 LAMEA Flip-Chip Ball Grid Array Market by Country
    • 7.4.1.2 LAMEA Fan-out WLP Market by Country
    • 7.4.1.3 LAMEA Flip chip CSP Market by Country
    • 7.4.1.4 LAMEA Wafer level CSP Market by Country
    • 7.4.1.5 LAMEA 2.5D/3D Market by Country
    • 7.4.1.6 LAMEA Other Type Market by Country
  • 7.4.2 LAMEA Advanced Packaging Market by End User
    • 7.4.2.1 LAMEA Consumer Electronics Market by Country
    • 7.4.2.2 LAMEA Automotive Market by Country
    • 7.4.2.3 LAMEA Industrial Market by Country
    • 7.4.2.4 LAMEA Healthcare Market by Country
    • 7.4.2.5 LAMEA Aerospace & Defense Market by Country
    • 7.4.2.6 LAMEA Other End User Market by Country
  • 7.4.3 LAMEA Advanced Packaging Market by Country
    • 7.4.3.1 Brazil Advanced Packaging Market
      • 7.4.3.1.1 Brazil Advanced Packaging Market by Type
      • 7.4.3.1.2 Brazil Advanced Packaging Market by End User
    • 7.4.3.2 Argentina Advanced Packaging Market
      • 7.4.3.2.1 Argentina Advanced Packaging Market by Type
      • 7.4.3.2.2 Argentina Advanced Packaging Market by End User
    • 7.4.3.3 UAE Advanced Packaging Market
      • 7.4.3.3.1 UAE Advanced Packaging Market by Type
      • 7.4.3.3.2 UAE Advanced Packaging Market by End User
    • 7.4.3.4 Saudi Arabia Advanced Packaging Market
      • 7.4.3.4.1 Saudi Arabia Advanced Packaging Market by Type
      • 7.4.3.4.2 Saudi Arabia Advanced Packaging Market by End User
    • 7.4.3.5 South Africa Advanced Packaging Market
      • 7.4.3.5.1 South Africa Advanced Packaging Market by Type
      • 7.4.3.5.2 South Africa Advanced Packaging Market by End User
    • 7.4.3.6 Nigeria Advanced Packaging Market
      • 7.4.3.6.1 Nigeria Advanced Packaging Market by Type
      • 7.4.3.6.2 Nigeria Advanced Packaging Market by End User
    • 7.4.3.7 Rest of LAMEA Advanced Packaging Market
      • 7.4.3.7.1 Rest of LAMEA Advanced Packaging Market by Type
      • 7.4.3.7.2 Rest of LAMEA Advanced Packaging Market by End User

Chapter 8. Company Profiles

• 8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
  • 8.1.1 Company Overview
  • 8.1.2 Financial Analysis
  • 8.1.3 Segmental and Regional Analysis
  • 8.1.4 Research & Development Expense
  • 8.1.5 Recent strategies and developments:
    • 8.1.5.1 Product Launches and Product Expansions:
  • 8.1.6 SWOT Analysis
• 8.2 Intel Corporation
  • 8.2.1 Company Overview
  • 8.2.2 Financial Analysis
  • 8.2.3 Segmental and Regional Analysis
  • 8.2.4 Research & Development Expenses
  • 8.2.5 Recent strategies and developments:
    • 8.2.5.1 Partnerships, Collaborations, and Agreements:
    • 8.2.5.2 Acquisition and Mergers:
  • 8.2.6 SWOT Analysis
• 8.3 IBM Corporation
  • 8.3.1 Company Overview
  • 8.3.2 Financial Analysis
  • 8.3.3 Regional & Segmental Analysis
  • 8.3.4 Research & Development Expenses
  • 8.3.5 Recent strategies and developments:
    • 8.3.5.1 Partnerships, Collaborations, and Agreements:
    • 8.3.5.2 Product Launches and Product Expansions:
  • 8.3.6 SWOT Analysis
• 8.4 Texas Instruments, Inc.
  • 8.4.1 Company Overview
  • 8.4.2 Financial Analysis
  • 8.4.3 Segmental and Regional Analysis
  • 8.4.4 Research & Development Expense
  • 8.4.5 SWOT Analysis
• 8.5 Analog Devices, Inc.
  • 8.5.1 Company Overview
  • 8.5.2 Financial Analysis
  • 8.5.3 Regional Analysis
  • 8.5.4 Research & Development Expenses
  • 8.5.5 SWOT Analysis
• 8.6 Microchip Technology Incorporated
  • 8.6.1 Company Overview
  • 8.6.2 Financial Analysis
  • 8.6.3 Segmental and Regional Analysis
  • 8.6.4 Research & Development Expenses
  • 8.6.5 SWOT Analysis
• 8.7 Infineon Technologies AG
  • 8.7.1 Company Overview
  • 8.7.2 Financial Analysis
  • 8.7.3 Segmental and Regional Analysis
  • 8.7.4 Research & Development Expense
  • 8.7.5 SWOT Analysis
• 8.8 Samsung Electronics Co., Ltd. (Samsung Group)
  • 8.8.1 Company Overview
  • 8.8.2 Financial Analysis
  • 8.8.3 Segmental and Regional Analysis
  • 8.8.4 Research & Development Expenses
  • 8.8.5 SWOT Analysis
• 8.9 Renesas Electronics Corporation
  • 8.9.1 Company Overview
  • 8.9.2 Financial Analysis
  • 8.9.3 Segmental and Regional Analysis
  • 8.9.4 Research & Development Expense
  • 8.9.5 SWOT Analysis
• 8.10. VMware, Inc. (Broadcom Inc.)
  • 8.10.1 Company Overview
  • 8.10.2 Financial Analysis
  • 8.10.3 Segmental and Regional Analysis
  • 8.10.4 Research & Development Expense
  • 8.10.5 SWOT Analysis

Chapter 9. Winning Imperatives of Advanced Packaging Market