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¼¼°èÀÇ ¿þÀÌÆÛ ÇÁ·Î¹ö ½ÃÀå : ¿¹Ãø(2023-2028³â)Wafer Prober Market - Forecasts from 2023 to 2028 |
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ÁÖ¿ä ½ÃÀå ÁøÃâ±â¾÷Àº Advantest Corporation, Teradyne Inc., FormFactor Inc., Tokyo Electron Corporation(TEL), MPI Corporation µîÀÔ´Ï´Ù. ¾îµå¹ê Å×½ºÆ® ¹× Å×¶ó´ÙÀÎ À×Å©´Â ÀÚµ¿ÈµÈ Å×½ºÆ® Àåºñ(ATE) ¹× ¿þÀÌÆÛ ÇÁ·Îºù ¼Ö·ç¼ÇÀÇ ¼¼°è ¼±µµÀûÀÎ °ø±Þ¾÷üÀÔ´Ï´Ù. µ¿½Ã¿¡ FormFactor Inc.´Â ÇÁ·Îºê Ä«µå¿Í ÇÁ·Îºê ½ºÅ×À̼ǿ¡¼ À¯¸íÇÑ ÁøÃâ±â¾÷ÀÔ´Ï´Ù.
Wafer prober is a system used in the semiconductor development and manufacturing process for the electrical testing of wafers. Although the semiconductor sector growth rate is expected to decline due to weak consumer demand amidst uncertain economic conditions, affecting the wafer prober market.
In electronic measurement, the signal from the measuring instrument or measuring device is sent with a probe or probe card to a special device on the wafer, and the signal is sent back. Wafer probes are used to manipulate the wafer so that it can touch the intended surface of the device.
In addition, wafer probes are used to test prototype ICs' properties, reliability testing, and defect detection in semiconductor development. Device and process evaluation involves high-precision measurement and assessment of the Test Element Group (TEG), including transistors, interconnects, and other IC component elements for ICs.
Moreover, the market is segmented into fully automatic, semi-automatic, and manual. Each type caters to the different needs of the semiconductor industry. Fully Automatic wafer probers are known for their high precision, accuracy, and speed, making them ideal for mass-production environments. In contrast, semi-automatic wafer probers balance precision and flexibility and are more accurate than manual probers. Manual wafer probers are suitable for low-volume production, research and development, and academic institutions.
The rise of information and communication technologies and the ongoing transition to a digital society will increase demand for semiconductors in the short term. As a result, the technological requirements for semiconductor manufacturing equipment are becoming increasingly sophisticated and difficult to meet. In addition to process scaling, 3D stacking is gaining popularity in the industry as it enables advanced packaging that includes many devices and heterogeneous components.
This is because these devices are heavily reliant on semiconductor chips. Wafer probers test and verify the performance and functionality of semiconductor chips before they are integrated into electronic devices, ensuring that they meet the required standards for quality and reliability. Manufacturers are investing in more advanced wafer prober technologies to keep up with the growing demand for high-performance chips.
The Asia Pacific has been a pioneer in semiconductor technology, with manufacturing units located in Taiwan, China, Japan, and South Korea, known for their advanced semiconductor fabrication facilities. The region has the presence of several key companies like Taiwan Semiconductor Manufacturing Co, Samsung Electronics, SK Hynix, and HI Silicon, among others. The Asia Pacific region is further analyzed into China, Japan, South Korea, Taiwan, and others.
Major market players include Advantest Corporation, Teradyne Inc., FormFactor Inc., Tokyo Electron Limited (TEL), and MPI Corporation. Advantest Corporation and Teradyne Inc. are leading global providers of automatic test equipment (ATE) and wafer probing solutions. At the same time, FormFactor Inc. is a prominent player in probe cards and probe stations.