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¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀå º¸°í¼­ : µ¿Çâ, ¿¹Ãø, °æÀï ºÐ¼®(-2031³â)

Semiconductor SaaS Solution Market Report: Trends, Forecast and Competitive Analysis to 2031

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Lucintel | ÆäÀÌÁö Á¤º¸: ¿µ¹® 150 Pages | ¹è¼Û¾È³» : 3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

¼¼°è ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀå Àü¸ÁÀº Ç×°ø¿ìÁÖ ¹× ¹æÀ§, ÀüÀÚ, ¼Ò¸Å, ÀÚµ¿Â÷ ¹× ¿î¼Û, ÀÇ·á ½ÃÀå¿¡ ±âȸ°¡ ÀÖÀ» °ÍÀ¸·Î º¸ÀÔ´Ï´Ù. ¼¼°è ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀº 2025-2031³â ¿¬Æò±Õ 8.4% ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ ½ÃÀåÀÇ ÁÖ¿ä ÃËÁø¿äÀÎÀº Ŭ¶ó¿ìµå ±â¹Ý EDA Åø ¹× ¼³°è ÀÚµ¿È­¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡¿Í ¹ÝµµÃ¼ ¼³°è ÇÁ·Î¼¼½º¿¡¼­ AI ¹× MLÀÇ Ã¤ÅÃÀÌ Áõ°¡Çϰí ÀÖ´Ù´Â Á¡ÀÔ´Ï´Ù.

  • LucintelÀÇ ¿¹Ãø¿¡ µû¸£¸é À¯Çüº°·Î´Â IC Æ÷Àå ¼³°è ¹× Á¦Á¶°¡ ¿¹Ãø ±â°£ Áß °¡Àå ³ôÀº ¼ºÀå¼¼¸¦ º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.
  • ¿ëµµº°·Î´Â Ç×°ø¿ìÁÖ ¹× ±¹¹æ ºÐ¾ß°¡ °¡Àå ³ôÀº ¼ºÀå¼¼¸¦ º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.
  • Áö¿ªº°·Î´Â ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ ¿¹Ãø ±â°£ Áß °¡Àå ³ôÀº ¼ºÀåÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀÇ »õ·Î¿î µ¿Çâ

¹ÝµµÃ¼ »ê¾÷¿¡¼­´Â º¹ÀâÇØÁö´Â Ĩ ¼³°è, Á¦Á¶, Çù¾÷¿¡ ´ëÀÀÇϱâ À§ÇØ SaaS ¼Ö·ç¼ÇÀÇ µµÀÔÀÌ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå ±â¹Ý Ç÷§ÆûÀº È®À强, À¯¿¬¼º, ºñ¿ë È¿À²¼ºÀ» Á¦°øÇϹǷΠ±â¾÷Àº Çõ½Å°ú ½ÃÀå Ãâ½Ã ½Ã°£À» ´ÜÃàÇÒ ¼ö ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ »ê¾÷ °íÀ¯ÀÇ ´ÏÁî¿¡ ¸Â´Â ƯȭµÈ SaaS Åø¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ç÷§ÆûÀº ºü¸£°Ô ÁøÈ­ÇÏ´Â ½ÃÀå¿¡¼­ ¹ÝµµÃ¼ ±â¾÷ÀÇ ¾÷¹«, Çù¾÷, °æÀïÀÇ ¹æ½ÄÀ» ¹Ù²Ù°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ »õ·Î¿î µ¿ÇâÀ» ÀÌÇØÇÏ´Â °ÍÀº ÀÌ·¯ÇÑ ¿ªµ¿ÀûÀÎ »óȲÀ» ±Øº¹ÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÕ´Ï´Ù. ¿©±â¼­´Â ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀ» Çü¼ºÇÏ´Â 5°¡Áö ÁÖ¿ä µ¿ÇâÀ» ¹ßÇ¥ÇÕ´Ï´Ù.

  • Ŭ¶ó¿ìµå ±â¹Ý ¼³°è ¹× ½Ã¹Ä·¹À̼Ç: Ŭ¶ó¿ìµå ±â¹Ý ¼³°è ¹× ½Ã¹Ä·¹À̼Ç: ¹ÝµµÃ¼ ¼³°è ¹× ½Ã¹Ä·¹À̼ÇÀº Ŭ¶ó¿ìµå·Î À̵¿Çϰí ÀÖÀ¸¸ç, È®Àå °¡´ÉÇÑ ÄÄÇ»ÆÃ ¸®¼Ò½º¿Í Çù¾÷ ¼³°è ȯ°æ¿¡ ¾×¼¼½ºÇÒ ¼ö ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå ±â¹Ý Ç÷§ÆûÀº °ªºñ½Ñ On-Premise ÀÎÇÁ¶ó¸¦ ¾ø¾Ö°í, ¿£Áö´Ï¾îµéÀÌ ¾îµð¼­µç ¿øÈ°ÇÏ°Ô Çù¾÷ÇÒ ¼ö ÀÖµµ·Ï Áö¿øÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Ãß¼¼´Â ¼³°è Áֱ⸦ ´ÜÃàÇϰí, ºñ¿ëÀ» Àý°¨Çϸç, »õ·Î¿î Ĩ ½ÃÀå Ãâ½Ã ½Ã°£À» °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù.
  • AI¿Í ¸Ó½Å·¯´×ÀÇ ÅëÇÕ: AI¿Í ¸Ó½Å·¯´×ÀÌ ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç¿¡ ÅëÇÕµÇ¾î ¼³°è ÀÛ¾÷ ÀÚµ¿È­, Ĩ ¼º´É ÃÖÀûÈ­, Á¦Á¶ °øÁ¤ °³¼±¿¡ Ȱ¿ëµÇ°í ÀÖ½À´Ï´Ù. AI ±â¹Ý ÅøÀº ¹æ´ëÇÑ ¾çÀÇ µ¥ÀÌÅ͸¦ ºÐ¼®ÇÏ¿© ÆÐÅÏÀ» ½Äº°ÇÏ°í °á°ú¸¦ ¿¹ÃøÇÏ¿© ÃÖÀûÈ­µÈ µðÀÚÀÎÀ» »ý¼ºÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÅëÇÕÀ» ÅëÇØ ¼³°è È¿À²À» ³ôÀ̰í, °³¹ß ½Ã°£À» ´ÜÃàÇϸç, Ĩ ¼º´ÉÀ» Çâ»ó½Ãų ¼ö ÀÖ½À´Ï´Ù.
  • µ¥ÀÌÅÍ ºÐ¼® ¹× Çù¾÷ Ç÷§Æû: ¹ÝµµÃ¼ SaaS ¼Ö·ç¼ÇÀº ÀÇ»ç°áÁ¤À» °³¼±ÇÏ°í ¿öÅ©Ç÷ο츦 °£¼ÒÈ­Çϱâ À§ÇØ °í±Þ µ¥ÀÌÅÍ ºÐ¼® ¹× Çù¾÷ ±â´ÉÀ» ³»ÀåÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ç÷§ÆûÀº ¼³°è ¹× Á¦Á¶ µ¥ÀÌÅ͸¦ ½Ç½Ã°£À¸·Î ½Ã°¢È­ÇÏ¿© ÆÀÀÌ È¿°úÀûÀ¸·Î Çù¾÷ÇÏ°í º´¸ñÇö»óÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù. µ¥ÀÌÅÍ¿¡ ±â¹ÝÇÑ ÀλçÀÌÆ®¸¦ ÅëÇØ ÇÁ·Î¼¼½º ÃÖÀûÈ­¸¦ °³¼±ÇÏ°í ½ÃÀå Ãâ½Ã ½Ã°£À» ´ÜÃàÇÒ ¼ö ÀÖ½À´Ï´Ù.
  • ¾ÈÀüÇϰí È®Àå °¡´ÉÇÑ ÀÎÇÁ¶ó: ¹ÝµµÃ¼ SaaS ¼Ö·ç¼ÇÀº º¸¾È°ú È®À强ÀÌ °¡Àå Áß¿äÇÕ´Ï´Ù. °ø±ÞÀÚ´Â ¹Î°¨ÇÑ ¼³°è µ¥ÀÌÅ͸¦ º¸È£ÇÏ°í »ê¾÷ ±ÔÁ¤À» ÁؼöÇϱâ À§ÇØ °­·ÂÇÑ º¸¾È Á¶Ä¡¿¡ ÅõÀÚÇϰí ÀÖ½À´Ï´Ù. Ĩ ¼³°è ¹× Á¦Á¶¿Í °ü·ÃµÈ ¹æ´ëÇÑ µ¥ÀÌÅͼ¼Æ®¿Í º¹ÀâÇÑ ½Ã¹Ä·¹À̼ÇÀ» ó¸®Çϱâ À§Çؼ­´Â È®Àå °¡´ÉÇÑ ÀÎÇÁ¶ó°¡ ÇʼöÀûÀÔ´Ï´Ù. º¸¾È°ú È®À强Àº ½Å·Ú¸¦ ±¸ÃàÇϰí SaaS ¼Ö·ç¼ÇÀÇ º¸±ÞÀ» °¡´ÉÇÏ°Ô ÇÏ´Â µ¥ ÀÖÀ¸¸ç, ¸Å¿ì Áß¿äÇÕ´Ï´Ù.
  • Àü¹®È­µÈ SaaS Á¦°ø: ¹ÝµµÃ¼ »ê¾÷¿¡¼­´Â IP °ü¸®, °ËÁõ, Á¦Á¶ ½ÇÇà, °ø±Þ¸Á Çù¾÷ µî ƯÁ¤ ´ÏÁî¿¡ ¸ÂÃá Àü¹®È­µÈ SaaS ¼Ö·ç¼ÇÀÌ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ´»õ ¼Ö·ç¼ÇÀº ƯÁ¤ °úÁ¦¿¡ ´ëÀÀÇϰí Ÿ°ÙÆÃµÈ ±â´ÉÀ» ´ã°í ÀÖ½À´Ï´Ù. Àü¹®È­µÈ SaaS´Â ¹ÝµµÃ¼ ¿öÅ©Ç÷οìÀÇ Æ¯Á¤ ºÎ¹®¿¡¼­ ´õ Å« °¡Ä¡¸¦ Á¦°øÇϰí È¿À²¼ºÀ» Çâ»ó½Ãŵ´Ï´Ù.

ÀÌ·¯ÇÑ Ãß¼¼´Â Çõ½Å ÃËÁø, Çù¾÷ °³¼±, È¿À²¼º Çâ»óÀ» ÅëÇØ ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀ» ÀçÆíÇϰí ÀÖ½À´Ï´Ù. ÀÌ´Â º¸´Ù °­·ÂÇϰí Àü¹®ÀûÀÎ SaaS Ç÷§ÆûÀÇ °³¹ß·Î À̾îÁ® ¹ÝµµÃ¼ ±â¾÷ÀÌ Ä¨À» ¼³°è, Á¦Á¶ ¹× ½ÃÀå¿¡ Ãâ½ÃÇÏ´Â ¹æ½ÄÀ» º¯È­½Ã۰í ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ »ê¾÷ÀÇ ¹Ì·¡´Â ÀÌ·¯ÇÑ Å¬¶ó¿ìµå ±â¹Ý ¼Ö·ç¼ÇÀÇ Áö¼ÓÀûÀÎ ¹ßÀü°ú äÅÿ¡ ´Þ·ÁÀÖ½À´Ï´Ù.

¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀÇ ÃÖ±Ù µ¿Çâ

¹ÝµµÃ¼ »ê¾÷Àº Ĩ ¼³°è ¹× Á¦Á¶ÀÇ º¹À⼺¿¡ Á÷¸éÇÏ¿© SaaS ¼Ö·ç¼ÇÀÇ Ã¤ÅÃÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå ±â¹Ý Ç÷§ÆûÀº È®À强, À¯¿¬¼º, ºñ¿ë È¿À²¼ºÀ» Á¦°øÇÏ¿© Çõ½Å°ú ½ÃÀå Ãâ½Ã ½Ã°£À» °¡¼ÓÈ­ÇÕ´Ï´Ù. ¹ÝµµÃ¼ »ê¾÷ ƯÀ¯ÀÇ ´ÏÁî¿¡ ¸ÂÃá Æ¯È­Çü SaaS Åøµµ µîÀåÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ç÷§ÆûÀº ¹ÝµµÃ¼ ±â¾÷ÀÇ »ç¾÷ ¿î¿µ°ú °æÀï ¹æ½ÄÀ» ¹Ù²Ù°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÅÈï ½ÃÀåÀ» ÀÌÇØÇÏ´Â °ÍÀº ÀÌ ¿ªµ¿ÀûÀÎ ½ÃÀåÀ» ÇìÃijª°¡´Â µ¥ ÀÖÀ¸¸ç, ¸Å¿ì Áß¿äÇÕ´Ï´Ù. ¿©±â¼­´Â ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀå¿¡ ¿µÇâÀ» ¹ÌÄ¡´Â 5°¡Áö ÁÖ¿ä °³¹ß »çÇ×À» ¹ßÇ¥ÇÕ´Ï´Ù.

  • Ŭ¶ó¿ìµå ±â¹Ý EDA Åø ÀüÀÚ¼³°èÀÚµ¿È­(EDA) ÅøÀÇ Å¬¶ó¿ìµåÈ­°¡ ÁøÇàµÇ°í ÀÖ½À´Ï´Ù. À̸¦ ÅëÇØ ¹ÝµµÃ¼ ±â¾÷Àº ¿Âµð¸Çµå ¹æ½ÄÀ¸·Î È®Àå °¡´ÉÇÑ ÄÄÇ»ÆÃ ¸®¼Ò½º¿¡ Á¢±ÙÇÒ ¼ö ÀÖÀ¸¸ç, Çϵå¿þ¾î¿¡ ´ëÇÑ ´ë±Ô¸ð ¼±ÅõÀÚÀÇ Çʿ伺À» ÁÙÀÏ ¼ö ÀÖ½À´Ï´Ù. Ŭ¶ó¿ìµå ±â¹Ý EDA´Â Çù¾÷ ¼³°è ¿öÅ©Ç÷ο츦 °¡´ÉÇÏ°Ô Çϰí, ¸®¼Ò½º Ȱ¿ëµµ¸¦ ³ôÀ̸ç, ¼³°è Áֱ⸦ °¡¼ÓÈ­ÇÏ¿© »õ·Î¿î Ĩ ½ÃÀå Ãâ½Ã ½Ã°£À» ´ÜÃàÇÕ´Ï´Ù.
  • AI ±â¹Ý Ĩ ¼³°è: Ĩ ¼³°èÀÇ ´Ù¾çÇÑ Ãø¸éÀ» ÀÚµ¿È­Çϱâ À§ÇØ ÀΰøÁö´É°ú ¸Ó½Å·¯´×ÀÌ ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç¿¡ ÅëÇյǰí ÀÖ½À´Ï´Ù. AI°¡ žÀçµÈ ÅøÀº Ĩ ·¹À̾ƿô ÃÖÀûÈ­, ¼º´É º´¸ñ Çö»ó ¿¹Ãø, ¼³°è ºí·Ï »ý¼º±îÁö ÇÒ ¼ö ÀÖ½À´Ï´Ù. À̸¦ ÅëÇØ ¼³°è È¿À²¼ºÀÌ Å©°Ô Çâ»óµÇ°í °³¹ß ½Ã°£ÀÌ ´ÜÃàµÇ¾î ¿£Áö´Ï¾î°¡ ´õ º¹ÀâÇÑ ÀÛ¾÷¿¡ ÁýÁßÇÒ ¼ö ÀÖ½À´Ï´Ù.
  • Á¦Á¶¸¦ À§ÇÑ µðÁöÅÐ Æ®À©: ¹ÝµµÃ¼ Á¦Á¶¾÷üµéÀº SaaS Ç÷§ÆûÀ¸·Î ¹°¸®Àû °øÀåÀ» °¡»óÈ­ÇÑ µðÁöÅÐ Æ®À©À» Ȱ¿ëÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µðÁöÅÐ Æ®À©À» ÅëÇØ ±â¾÷Àº Á¦Á¶ °øÁ¤À» ½Ã¹Ä·¹À̼ÇÇϰí, ¼³ºñ Ȱ¿ëÀ» ÃÖÀûÈ­Çϸç, ÀáÀçÀûÀÎ ¹®Á¦¸¦ »çÀü¿¡ ¿¹ÃøÇÒ ¼ö ÀÖ½À´Ï´Ù. À̸¦ ÅëÇØ »ý»ê È¿À²ÀÌ Çâ»óµÇ°í, ´Ù¿îŸÀÓÀÌ °¨¼ÒÇϸç, Àüü »ý»ê·®ÀÌ Áõ°¡ÇÕ´Ï´Ù.
  • Ŭ¶ó¿ìµå¸¦ ÅëÇÑ ¾ÈÀüÇÑ IP °ü¸®: ÁöÀûÀç»ê±Ç(IP) °ü¸®´Â ¹ÝµµÃ¼ ±â¾÷¿¡°Ô ¸Å¿ì Áß¿äÇÕ´Ï´Ù. SaaS ¼Ö·ç¼ÇÀº ÇöÀç IP¸¦ ÀúÀå, °ü¸®, °øÀ¯ÇÒ ¼ö ÀÖ´Â ¾ÈÀüÇÑ Å¬¶ó¿ìµå ±â¹Ý Ç÷§ÆûÀ» Á¦°øÇÕ´Ï´Ù. À̸¦ ÅëÇØ IP¸¦ º¸È£Çϰí, µðÀÚÀÎ ÆÀ °£ÀÇ Çù¾÷À» ÃËÁøÇϸç, IP Àç»ç¿ëÀ» °£¼ÒÈ­ÇÏ¿© °³¹ß ºñ¿ë°ú ½Ã°£À» Àý°¨ÇÒ ¼ö ÀÖ½À´Ï´Ù.
  • °ø±Þ¸Á Çù¾÷ Ç÷§Æû: ¹ÝµµÃ¼ °ø±Þ¸ÁÀº º¹ÀâÇÏ°í ¼ö¸¹Àº ÀÌÇØ°ü°èÀÚ°¡ °ü¿©Çϰí ÀÖ½À´Ï´Ù. SaaS ¼Ö·ç¼ÇÀº °ø±Þ¸Á Àü¹Ý¿¡ °ÉÃÄ ´õ ³ªÀº Çù¾÷°ú Ä¿¹Â´ÏÄÉÀ̼ÇÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Ç÷§ÆûÀº Àç°í ¼öÁØ, »ý»ê ÀÏÁ¤, ¹°·ù¿¡ ´ëÇÑ ½Ç½Ã°£ °¡½Ã¼ºÀ» Á¦°øÇÏ¿© °ø±Þ¸ÁÀÇ È¿À²¼ºÀ» ³ôÀ̰í Áö¿¬À» ÁÙÀÔ´Ï´Ù.

ÀÌ·¯ÇÑ ¹ßÀüÀº Çõ½Å ÃËÁø, È¿À²¼º Çâ»ó, Çù¾÷ °­È­¸¦ ÅëÇØ ¹ÝµµÃ¼ SaaS ¼Ö·ç¼Ç ½ÃÀåÀ» ÀçÆíÇϰí ÀÖ½À´Ï´Ù. ÀÌ´Â º¸´Ù °­·ÂÇϰí Àü¹®ÀûÀÎ SaaS Ç÷§ÆûÀÇ °³¹ß·Î À̾îÁ® ¹ÝµµÃ¼ ±â¾÷ÀÌ Ä¨À» ¼³°è, Á¦Á¶ ¹× ½ÃÀå¿¡ Ãâ½ÃÇÏ´Â ¹æ½ÄÀ» º¯È­½Ã۰í ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ »ê¾÷ÀÇ ¹Ì·¡´Â ÀÌ·¯ÇÑ Å¬¶ó¿ìµå ±â¹Ý ¼Ö·ç¼ÇÀÇ Áö¼ÓÀûÀÎ ¹ßÀü°ú äÅÿ¡ ´Þ·ÁÀÖ½À´Ï´Ù.

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KSA 25.09.01

The future of the global semiconductor SaaS solution market looks promising with opportunities in the aerospace and defense, electronics, retail, automotive and transportation, and medical markets. The global semiconductor SaaS solution market is expected to grow with a CAGR of 8.4% from 2025 to 2031. The major drivers for this market are the increasing demand for cloud-based EDA tools & design automation and the rising adoption of AI & ML in semiconductor design processes.

  • Lucintel forecasts that, within the type category, IC packaging design and manufacturing is expected to witness the highest growth over the forecast period.
  • Within the application category, aerospace and defense are expected to witness the highest growth.
  • In terms of region, APAC is expected to witness the highest growth over the forecast period.

Emerging Trends in the Semiconductor SaaS Solution Market

The semiconductor industry is increasingly adopting SaaS solutions to address the growing complexity of chip design, manufacturing, and collaboration. Cloud-based platforms offer scalability, flexibility, and cost-effectiveness, enabling companies to accelerate innovation and time-to-market. The demand for specialized SaaS tools tailored to the semiconductor industry's unique needs is rising. These platforms are transforming how semiconductor companies operate, collaborate, and compete in a rapidly evolving market. Understanding these emerging trends is crucial for navigating this dynamic landscape. Here are five key trends shaping the semiconductor SaaS solution market:

  • Cloud-Based Design and Simulation: Semiconductor design and simulation are moving to the cloud, enabling access to scalable computing resources and collaborative design environments. Cloud-based platforms eliminate the need for expensive on-premise infrastructure and allow engineers to collaborate seamlessly from anywhere. This trend accelerates design cycles, reduces costs, and improves time-to-market for new chips.
  • AI and Machine Learning Integration: AI and machine learning are being integrated into semiconductor SaaS solutions to automate design tasks, optimize chip performance, and improve manufacturing processes. AI-powered tools can analyze vast amounts of data to identify patterns, predict outcomes, and generate optimized designs. This integration enhances design efficiency, reduces development time, and improves chip performance.
  • Data Analytics and Collaboration Platforms: Semiconductor SaaS solutions are incorporating advanced data analytics and collaboration features to improve decision-making and streamline workflows. These platforms provide real-time visibility into design and manufacturing data, enabling teams to collaborate effectively and identify bottlenecks. Data-driven insights improve process optimization and accelerate time-to-market.
  • Secure and Scalable Infrastructure: Security and scalability are paramount for semiconductor SaaS solutions. Providers are investing in robust security measures to protect sensitive design data and ensure compliance with industry regulations. Scalable infrastructure is essential to handle the massive datasets and complex simulations involved in chip design and manufacturing. Security and scalability are crucial for building trust and enabling the widespread adoption of SaaS solutions.
  • Specialized SaaS Offerings: The semiconductor industry is seeing a rise in specialized SaaS solutions tailored to specific needs, such as IP management, verification, manufacturing execution, and supply chain collaboration. These niche solutions address specific challenges and offer targeted functionalities. Specialized SaaS offerings provide greater value and improve efficiency in specific areas of the semiconductor workflow.

These trends are collectively reshaping the semiconductor SaaS solution market by driving innovation, improving collaboration, and enhancing efficiency. They are leading to the development of more powerful and specialized SaaS platforms, transforming how semiconductor companies design, manufacture, and bring chips to market. The future of the semiconductor industry relies on the continued evolution and adoption of these cloud-based solutions.

Recent Developments in the Semiconductor SaaS Solution Market

The semiconductor industry faces increasing complexity in chip design and manufacturing, driving the adoption of SaaS solutions. Cloud-based platforms offer scalability, flexibility, and cost-effectiveness, accelerating innovation and time-to-market. Specialized SaaS tools tailored to the semiconductor industry's unique needs are emerging. These platforms are transforming how semiconductor companies operate and compete. Understanding these developments is crucial for navigating this dynamic market. Here are five significant developments impacting the semiconductor SaaS solution market:

  • Cloud-Based EDA Tools: Electronic Design Automation (EDA) tools are increasingly moving to the cloud. This allows semiconductor companies to access scalable computing resources on demand, reducing the need for large upfront investments in hardware. Cloud-based EDA enables collaborative design workflows, improves resource utilization, and accelerates design cycles, leading to faster time-to-market for new chips.
  • AI-Driven Chip Design: Artificial intelligence and machine learning are being integrated into semiconductor SaaS solutions to automate various aspects of chip design. AI-powered tools can optimize chip layouts, predict performance bottlenecks, and even generate design blocks. This significantly improves design efficiency, reduces development time, and allows engineers to focus on more complex tasks.
  • Digital Twins for Manufacturing: Semiconductor manufacturers are utilizing digital twins, virtual representations of their physical fabs powered by SaaS platforms. These digital twins allow companies to simulate manufacturing processes, optimize equipment utilization, and predict potential issues before they occur. This improves manufacturing efficiency, reduces downtime, and enhances overall production yield.
  • Secure IP Management in the Cloud: Intellectual Property (IP) management is critical for semiconductor companies. SaaS solutions are now offering secure cloud-based platforms for storing, managing, and sharing IP. This ensures IP protection, facilitates collaboration among design teams, and streamlines IP reuse, reducing development costs and time.
  • Supply Chain Collaboration Platforms: Semiconductor supply chains are complex and involve numerous stakeholders. SaaS solutions are enabling better collaboration and communication across the supply chain. These platforms provide real-time visibility into inventory levels, production schedules, and logistics, improving supply chain efficiency and reducing delays.

These developments are collectively reshaping the semiconductor SaaS solution market by driving innovation, improving efficiency, and enhancing collaboration. They are leading to the development of more powerful and specialized SaaS platforms, transforming how semiconductor companies design, manufacture, and bring chips to market. The future of the semiconductor industry relies on the continued evolution and adoption of these cloud-based solutions.

Strategic Growth Opportunities in the Semiconductor SaaS Solution Market

The semiconductor SaaS solution market is experiencing significant growth, driven by the increasing complexity of chip design and manufacturing, coupled with the need for faster time-to-market. Cloud-based platforms offer scalability, flexibility, and cost-effectiveness, creating numerous strategic growth opportunities. Capitalizing on these opportunities requires a deep understanding of market trends, technological advancements, and customer needs. By focusing on innovation and delivering valuable solutions, SaaS providers can achieve significant growth in this dynamic market. Here are five key growth opportunities:

  • AI-Powered Design Automation: Developing and enhancing AI-powered tools within SaaS platforms to automate various aspects of chip design, from layout optimization to performance prediction. AI can significantly reduce design time and improve chip performance, offering a competitive advantage to semiconductor companies. This presents a substantial growth opportunity for SaaS providers who can deliver effective AI-driven solutions.
  • Cloud-Based Verification and Simulation: Expanding cloud-based verification and simulation capabilities to handle the increasing complexity of chip designs. This includes offering scalable computing resources and advanced simulation tools that can be accessed on demand. Cloud-based verification and simulation can accelerate design cycles and reduce the need for expensive on-premise infrastructure.
  • Digital Twin Solutions for Manufacturing: Developing and offering digital twin solutions that allow semiconductor manufacturers to create virtual representations of their fabs and simulate manufacturing processes. Digital twins can be used to optimize equipment utilization, predict maintenance needs, and improve overall manufacturing efficiency. This offers a significant growth opportunity for SaaS providers who can deliver robust and reliable digital twin platforms.
  • Secure IP Management and Collaboration: Providing secure cloud-based platforms for managing and collaborating on intellectual property (IP). This includes features for version control, access control, and secure sharing of design data. Secure IP management is crucial for protecting sensitive design information and fostering collaboration among geographically dispersed teams, presenting a valuable growth opportunity.
  • Supply Chain Optimization and Collaboration: Developing SaaS solutions that improve collaboration and communication across the semiconductor supply chain. This includes platforms for real-time visibility into inventory levels, production schedules, and logistics. Optimized supply chains can reduce delays, improve efficiency, and reduce costs, creating a strong demand for effective SaaS solutions in this area.

These growth opportunities are collectively shaping the semiconductor SaaS solution market by driving innovation, improving efficiency, and enhancing collaboration. They are leading to the development of more powerful and specialized SaaS platforms, transforming how semiconductor companies design, manufacture, and bring chips to market. The future of the semiconductor industry relies on the continued evolution and adoption of these cloud-based solutions.

Semiconductor SaaS Solution Market Driver and Challenges

The semiconductor SaaS solution market is experiencing rapid growth, driven by the increasing complexity and cost of chip design and manufacturing. Cloud-based platforms offer scalability, flexibility, and cost-effectiveness, attracting semiconductor companies seeking to accelerate innovation and time-to-market. However, the market also faces challenges related to security, data privacy, and integration with existing systems. Understanding these drivers and challenges is crucial for navigating this evolving landscape. Here's an analysis of the major factors impacting the semiconductor SaaS solution market:

The factors responsible for driving the semiconductor SaaS solution market include:

1. Increasing Complexity of Chip Design: Modern chip designs are incredibly complex, requiring vast computing resources and collaborative design environments. SaaS solutions provide access to scalable computing power and facilitate collaboration among geographically dispersed teams, addressing the challenges posed by complex chip design. This allows engineers to work on increasingly sophisticated projects without being limited by on-premise infrastructure.

2. Rising Cost of Chip Development: The cost of developing advanced chips is escalating rapidly, making it essential for semiconductor companies to find ways to reduce expenses. SaaS solutions offer a cost-effective alternative to investing in and maintaining expensive hardware and software infrastructure. This allows companies to shift capital expenditure to operational expenditure, improving cash flow and financial flexibility.

3. Need for Faster Time-to-Market: In the fast-paced semiconductor industry, time-to-market is critical. SaaS solutions can accelerate design cycles by providing access to scalable computing resources, automating design tasks, and streamlining collaboration. This allows companies to bring new chips to market faster, gaining a competitive edge.

4. Growing Adoption of Cloud Technologies: The increasing acceptance and adoption of cloud technologies across various industries is also driving the growth of the semiconductor SaaS solution market. Semiconductor companies are becoming more comfortable with storing and processing sensitive data in the cloud, opening up opportunities for SaaS providers.

5. Demand for Collaboration and Data Sharing: Semiconductor design and manufacturing often involve collaboration among multiple teams and partners. SaaS platforms facilitate secure data sharing and collaboration, enabling seamless workflows and improving communication. This streamlined collaboration improves efficiency and reduces the risk of errors.

Challenges in the semiconductor SaaS solution market are:

1. Data Security and Privacy Concerns: Semiconductor design data is highly sensitive and confidential. Companies are concerned about the security of their data in the cloud and the potential for data breaches. SaaS providers must address these concerns by implementing robust security measures and complying with industry regulations.

2. Integration with Existing Systems: Semiconductor companies often have existing legacy systems that need to be integrated with SaaS solutions. Seamless integration is crucial for ensuring smooth workflows and avoiding data silos. However, integrating with legacy systems can be complex and challenging.

3. Vendor Lock-in and Dependence: Migrating to a SaaS platform can create vendor lock-in, making it difficult to switch providers in the future. Companies are also concerned about their dependence on SaaS providers for critical design and manufacturing tools. This requires careful evaluation of SaaS providers and their long-term viability.

The interplay of these drivers and challenges is shaping the semiconductor SaaS solution market. While the increasing complexity of chip design, rising costs, and the need for faster time-to-market are fueling growth, data security concerns, integration challenges, and vendor lock-in require careful consideration. Successfully navigating this dynamic landscape requires a strategic approach that balances the benefits of SaaS with the need for security, integration, and long-term flexibility.

List of Semiconductor SaaS Solution Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, semiconductor SaaS solution companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor SaaS solution companies profiled in this report include-

  • Empyrean
  • Entasys
  • Excellicon
  • Xpeedic
  • KLA
  • Hongxin Micro Nano
  • IC Manage

Semiconductor SaaS Solution Market by Segment

The study includes a forecast for the global semiconductor SaaS solution market by type, application, and region.

Semiconductor SaaS Solution Market by Type [Value from 2019 to 2031]:

  • IC Packaging Design and Manufacturing
  • Semiconductor Intellectual Property (SIP)
  • Printed Circuit Board (PCB) & Multi-Chip Modules (MCM)
  • EDA Services

Semiconductor SaaS Solution Market by Application [Value from 2019 to 2031]:

  • Aerospace and Defense
  • Electronic
  • Retail
  • Automotive and Transportation
  • Medical
  • Others

Semiconductor SaaS Solution Market by Region [Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Semiconductor SaaS Solution Market

The semiconductor industry is increasingly adopting SaaS solutions to streamline operations, improve collaboration, and accelerate innovation. These cloud-based platforms offer a range of functionalities, from design and simulation to manufacturing execution and supply chain management. The growing complexity of chip design and manufacturing, coupled with the need for faster time-to-market, is driving the adoption of SaaS solutions. Semiconductor companies are leveraging these tools to improve efficiency, reduce costs, and enhance collaboration across geographically dispersed teams. The semiconductor SaaS solution market is witnessing a surge in specialized SaaS offerings tailored to the unique needs of the semiconductor industry. Here's a look at recent developments in key markets:

  • United States: The US market is characterized by a strong presence of established EDA vendors and cloud service providers. Key trends include the development of cloud-based design and simulation platforms, the increasing use of AI and machine learning in chip design, and the adoption of SaaS solutions for supply chain management and collaboration. US companies are also focusing on enhancing the security and scalability of their SaaS offerings.
  • China: China is rapidly expanding its semiconductor industry, leading to a surge in demand for SaaS solutions. Chinese vendors are focusing on developing cost-effective and localized SaaS platforms to compete with international players. The market is also witnessing a growing emphasis on data security and compliance with local regulations. Chinese companies are also investing in AI-driven design tools and cloud-based manufacturing execution systems.
  • Germany: The German market is characterized by a strong focus on industrial automation and manufacturing excellence. German companies are adopting SaaS solutions for manufacturing execution systems (MES), quality control, and predictive maintenance. There's a growing emphasis on integrating SaaS platforms with existing manufacturing infrastructure and ensuring data security and compliance with European regulations.
  • India: The Indian semiconductor industry is at a nascent stage but is expected to grow rapidly. Indian companies are exploring SaaS solutions for chip design, verification, and embedded software development. The market is also seeing a growing interest in cloud-based training and collaboration platforms for semiconductor engineers. Cost-effectiveness and accessibility are key considerations for Indian companies.
  • Japan: Japan has a long history in semiconductor manufacturing and is focusing on leveraging SaaS solutions to improve efficiency and competitiveness. Japanese companies are adopting SaaS platforms for design optimization, manufacturing planning, and supply chain collaboration. There's a growing emphasis on data security, reliability, and integration with existing legacy systems. Japanese companies are also exploring AI-driven design tools and cloud-based simulation platforms.

Features of the Global Semiconductor SaaS Solution Market

  • Market Size Estimates: Semiconductor SaaS solution market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
  • Segmentation Analysis: Semiconductor SaaS solution market size by type, application, and region in terms of value ($B).
  • Regional Analysis: Semiconductor SaaS solution market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the semiconductor SaaS solution market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor SaaS solution market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers the following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor SaaS solution market by type (IC packaging design and manufacturing, semiconductor intellectual property (SIP), printed circuit board (PCB) & multi-chip modules (MCM), and EDA services), application (aerospace and defense, electronic, retail, automotive and transportation, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

  • 2.1 Background and Classifications
  • 2.2 Supply Chain

3. Market Trends & Forecast Analysis

  • 3.1 Macroeconomic Trends and Forecasts
  • 3.2 Industry Drivers and Challenges
  • 3.3 PESTLE Analysis
  • 3.4 Patent Analysis
  • 3.5 Regulatory Environment

4. Global Semiconductor SaaS Solution Market by Type

  • 4.1 Overview
  • 4.2 Attractiveness Analysis by Type
  • 4.3 IC Packaging Design and Manufacturing: Trends and Forecast (2019-2031)
  • 4.4 Semiconductor Intellectual Property (SIP): Trends and Forecast (2019-2031)
  • 4.5 Printed Circuit Board (PCB) & Multi-Chip Modules (MCM): Trends and Forecast (2019-2031)
  • 4.6 EDA Services: Trends and Forecast (2019-2031)

5. Global Semiconductor SaaS Solution Market by Application

  • 5.1 Overview
  • 5.2 Attractiveness Analysis by Application
  • 5.3 Aerospace and Defense: Trends and Forecast (2019-2031)
  • 5.4 Electronic: Trends and Forecast (2019-2031)
  • 5.5 Retail: Trends and Forecast (2019-2031)
  • 5.6 Automotive and Transportation: Trends and Forecast (2019-2031)
  • 5.7 Medical: Trends and Forecast (2019-2031)
  • 5.8 Others: Trends and Forecast (2019-2031)

6. Regional Analysis

  • 6.1 Overview
  • 6.2 Global Semiconductor SaaS Solution Market by Region

7. North American Semiconductor SaaS Solution Market

  • 7.1 Overview
  • 7.2 North American Semiconductor SaaS Solution Market by Type
  • 7.3 North American Semiconductor SaaS Solution Market by Application
  • 7.4 United States Semiconductor SaaS Solution Market
  • 7.5 Mexican Semiconductor SaaS Solution Market
  • 7.6 Canadian Semiconductor SaaS Solution Market

8. European Semiconductor SaaS Solution Market

  • 8.1 Overview
  • 8.2 European Semiconductor SaaS Solution Market by Type
  • 8.3 European Semiconductor SaaS Solution Market by Application
  • 8.4 German Semiconductor SaaS Solution Market
  • 8.5 French Semiconductor SaaS Solution Market
  • 8.6 Spanish Semiconductor SaaS Solution Market
  • 8.7 Italian Semiconductor SaaS Solution Market
  • 8.8 United Kingdom Semiconductor SaaS Solution Market

9. APAC Semiconductor SaaS Solution Market

  • 9.1 Overview
  • 9.2 APAC Semiconductor SaaS Solution Market by Type
  • 9.3 APAC Semiconductor SaaS Solution Market by Application
  • 9.4 Japanese Semiconductor SaaS Solution Market
  • 9.5 Indian Semiconductor SaaS Solution Market
  • 9.6 Chinese Semiconductor SaaS Solution Market
  • 9.7 South Korean Semiconductor SaaS Solution Market
  • 9.8 Indonesian Semiconductor SaaS Solution Market

10. ROW Semiconductor SaaS Solution Market

  • 10.1 Overview
  • 10.2 ROW Semiconductor SaaS Solution Market by Type
  • 10.3 ROW Semiconductor SaaS Solution Market by Application
  • 10.4 Middle Eastern Semiconductor SaaS Solution Market
  • 10.5 South American Semiconductor SaaS Solution Market
  • 10.6 African Semiconductor SaaS Solution Market

11. Competitor Analysis

  • 11.1 Product Portfolio Analysis
  • 11.2 Operational Integration
  • 11.3 Porter's Five Forces Analysis
    • Competitive Rivalry
    • Bargaining Power of Buyers
    • Bargaining Power of Suppliers
    • Threat of Substitutes
    • Threat of New Entrants
  • 11.4 Market Share Analysis

12. Opportunities & Strategic Analysis

  • 12.1 Value Chain Analysis
  • 12.2 Growth Opportunity Analysis
    • 12.2.1 Growth Opportunities by Type
    • 12.2.2 Growth Opportunities by Application
  • 12.3 Emerging Trends in the Global Semiconductor SaaS Solution Market
  • 12.4 Strategic Analysis
    • 12.4.1 New Product Development
    • 12.4.2 Certification and Licensing
    • 12.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

13. Company Profiles of the Leading Players Across the Value Chain

  • 13.1 Competitive Analysis
  • 13.2 Empyrean
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.3 Entasys
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.4 Excellicon
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.5 Xpeedic
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.6 KLA
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.7 Hongxin Micro Nano
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.8 IC Manage
    • Company Overview
    • Semiconductor SaaS Solution Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing

14. Appendix

  • 14.1 List of Figures
  • 14.2 List of Tables
  • 14.3 Research Methodology
  • 14.4 Disclaimer
  • 14.5 Copyright
  • 14.6 Abbreviations and Technical Units
  • 14.7 About Us
  • 14.8 Contact Us
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