세계의 EUV 노광 시장 예측(-2029년) : 컴포넌트별, 최종사용자별

The EUV lithography market is expected to reach USD 22.69 billion by 2029 from USD 12.18 billion in 2024, at a CAGR of 13.2% during the 2024-2029 period.

Continuing advances in consumer electronics increase demand for extreme ultraviolet lithography markets. With an increase in thinner, more powerful, energy-efficient devices, the usage of extreme ultraviolet lithography also increases. Advanced functionality with high performance is achieved using a smaller semiconductor chip in modern smartphones, smartwatch, laptops, and also a whole smart home device. EUVL has the ability to etch extremely intricate patterns down at nanometer scales, making it absolutely necessary to produce next-generation chips.

The increasing deployment of technologies such as 5G, artificial intelligence (AI), and augmented reality/virtual reality rises the demand for high-performance processors, memory chips, and other semiconductor components, which in turn increases the need for EUV systems. Consumer expectations for longer battery life, faster processing speeds, and sleek designs also reinforce the trend towards miniaturization, which EUV lithography facilitates. Also, in the quest for technological superiority among leading consumer electronics brands, investments in advanced semiconductor manufacturing processes fuel the growth of the EUV lithography market. In this interaction between innovation in consumer electronics and semiconductor fabrication, the EUV lithography stands out as a key to future technologies.

"South Korea is projected to grow at the highest CAGR during the forecast period from 2024-2029"

The South Korean region is expected to have the highest compound annual growth rate (CAGR) for the EUV lithography market over the forecast period due to the country's leadership in semiconductor manufacturing and aggressive investments in advanced lithography technologies. South Korea is also the home of some of the world's largest makers of semiconductors, notably Samsung and SK Hynix, key adopters of EUV for producing high-performance chips at such advanced nodes as 5nm and lower.

The government of South Korea considers the development of a robust ecosystem of semiconductors with considerable support in terms of finance and with policy incentives to reduce imports and thus establish a stronger position in markets around the world. Moreover, South Korean manufacturers are under rising pressure from the increasing demands of AI, 5G, IoT, and automotive applications in both home and international markets.

Continuous collaborations with EUV equipment vendors, such as ASML, will provide South Korean fabs with the most advanced lithography tools. The strategic move of South Korea to scale up EUV lithography, in addition to the semiconductor industry's push toward smaller, more energy-efficient, and powerful chips, drives the market to the robust CAGR in the region.

In-depth interviews have been conducted with chief executive officers (CEOs), Directors, and other executives from various key organizations operating in the EUV lithography market.

The break-up of the profile of primary participants in the EUV lithography market-

• By Company Type: Tier 1 - 30%, Tier 2 - 50%, Tier 3 - 20%
• By Designation Type: C Level Executive - 25%, Directors - 35%, Others - 40%
• By Region Type: Americas - 25%, Europe -35 %, Asia Pacific- 40%

The major players in the EUV lithography market are ASML (Netherlands), Carl Zeiss AG (Germany), NTT Advanced Technology Corporation (Japan), KLA Corporation (US), ADVANTEST CORPORATION (Japan), Ushio Inc. (Japan), SUSS MicroTec SE (Germany), AGC Inc. (Japan), Lasertec Corporation (Japan), TOPPAN Inc. (Japan), Energetiq Technology, Inc. (Japan), NuFlare Technology Inc. (US), Photronics, Inc. (Japan), HOYA Corporation (Japan), TRUMPF (Germany), Rigaku Holdings Corporation (Japan), Edmund Optics Inc. (US), Imagine Optic (France), Applied Materials, Inc. (US), Park Systems (South Koria), EUV Tech (US), Mloptic Crop. (China), MKS Instruments (US), Brooks Automation (US), and Pfeiffer Vacuum GmbH (Germany).

Research Coverage

The report segments the EUV lithography market and forecasts its size by region. It also comprehensively reviews drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.

This report has categorized the EUV lithography market by component (light sources, optics, masks, others), end user (integrated device manufacturers, foundries), and region (Americas, Europe, and Asia Pacific)

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall EUV lithography market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the objectives of the market and provides information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

• Analysis of key drivers (adoption of EUV lithography for advanced semiconductor nodes), restraint (significant upfront capital investment in EUV lithography), opportunity (rising investments in advanced EUV lithography and semiconductor devices), and challenges (competition from alternative lithography techniques)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the EUV lithography market
• Market Development: Comprehensive information about lucrative markets - the report analyses the EUV lithography market across varied regions.
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the EUV lithography market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players like KLA Corporation (US), Carl Zeiss AG (Germany), TRUMPF (Germany), TOPPAN Inc. (Japan), and AGC Inc. (Japan).

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 Key data from secondary sources
    • 2.1.1.2 Key secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 Key data from primary sources
    • 2.1.2.2 Key participants in primary interviews
    • 2.1.2.3 Breakdown of primary interviews
    • 2.1.2.4 Key industry insights
  • 2.1.3 SECONDARY AND PRIMARY RESEARCH
• 2.2 MARKET SIZE ESTIMATION
  • 2.2.1 BOTTOM-UP APPROACH
    • 2.2.1.1 Approach to arrive at market size using bottom-up analysis (Demand side)
  • 2.2.2 TOP-DOWN APPROACH
    • 2.2.2.1 Approach to arrive at market size using top-down analysis (Supply side)
• 2.3 DATA TRIANGULATION
• 2.4 RISK ASSESSMENT
• 2.5 RESEARCH ASSUMPTIONS AND LIMITATIONS
  • 2.5.1 RESEARCH ASSUMPTIONS
  • 2.5.2 RESEARCH LIMITATIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN EUV LITHOGRAPHY MARKET
• 4.2 EUV LITHOGRAPHY MARKET, BY END USER
• 4.3 EUV LITHOGRAPHY MARKET, BY COMPONENT
• 4.4 EUV LITHOGRAPHY MARKET, BY REGION

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Adoption of EUV lithography for advanced semiconductor nodes
    • 5.2.1.2 Rising demand for high-performance computing
    • 5.2.1.3 Increasing complexity of integrated circuits
    • 5.2.1.4 Advancements in consumer electronics
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Need for significant upfront capital investment
    • 5.2.2.2 Requirement for advanced infrastructure and skilled workforce
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Increasing investments in advanced EUV lithography and semiconductor devices
    • 5.2.3.2 Expanding deployment of EUV lithography in emerging applications
    • 5.2.3.3 Advancement in memory module and chip development for next-generation devices
    • 5.2.3.4 Commercialization of advanced displays for enhanced visual experiences
    • 5.2.3.5 Application of advanced patterning technologies in photonics and optics production
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Competition from alternative lithography techniques
    • 5.2.4.2 Difficulty in sustaining high source power and productivity
    • 5.2.4.3 Detecting and addressing mask defects and yield challenges
• 5.3 VALUE CHAIN ANALYSIS
  • 5.3.1 R&D ENGINEERS
  • 5.3.2 COMPONENT MANUFACTURERS
  • 5.3.3 SYSTEM INTEGRATORS
  • 5.3.4 MARKETING & SALES SERVICES PROVIDERS
  • 5.3.5 END USERS
• 5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.5 ECOSYSTEM ANALYSIS
• 5.6 TECHNOLOGY ANALYSIS
  • 5.6.1 KEY TECHNOLOGIES
    • 5.6.1.1 Light source
    • 5.6.1.2 EUV masks
  • 5.6.2 COMPLEMENTARY TECHNOLOGIES
    • 5.6.2.1 Mask pellicles
    • 5.6.2.2 Plasma generation
  • 5.6.3 ADJACENT TECHNOLOGIES
    • 5.6.3.1 Extreme ultraviolet reflectometry (EUVR)
    • 5.6.3.2 Atomic layer deposition (ALD)
• 5.7 INVESTMENT AND FUNDING SCENARIO
• 5.8 PRICING ANALYSIS
  • 5.8.1 AVERAGE SELLING PRICE OF EUV LITHOGRAPHY SYSTEM
  • 5.8.2 AVERAGE SELLING PRICE TREND, BY REGION, 2020-2023
• 5.9 CASE STUDY ANALYSIS
  • 5.9.1 INTEL SECURES EXCLUSIVE HIGH-NA EUV MACHINES
  • 5.9.2 LAM COLLABORATED WITH ASML TO DEVELOP DRY RESIST TECHNOLOGY THAT ADVANCES EUV LITHOGRAPHY
  • 5.9.3 TSMC ACQUIRED EUV SYSTEMS TO BOOST PRODUCTION CAPACITY
• 5.10 PATENT ANALYSIS
• 5.11 TRADE ANALYSIS
  • 5.11.1 IMPORT SCENARIO (HS CODE 8442)
  • 5.11.2 EXPORT SCENARIO (HS CODE 8442)
• 5.12 PORTER'S FIVE FORCES ANALYSIS
  • 5.12.1 INTENSITY OF COMPETITIVE RIVALRY
  • 5.12.2 THREAT OF NEW ENTRANTS
  • 5.12.3 THREAT OF SUBSTITUTES
  • 5.12.4 BARGAINING POWER OF BUYERS
  • 5.12.5 BARGAINING POWER OF SUPPLIERS
• 5.13 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 5.13.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 5.13.2 BUYING CRITERIA
• 5.14 TARIFF AND REGULATORY LANDSCAPE
  • 5.14.1 TARIFF ANALYSIS
  • 5.14.2 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 5.14.3 REGULATIONS
• 5.15 KEY CONFERENCES AND EVENTS, 2024-2025
• 5.16 IMPACT OF GEN AI/AI ON EUV LITHOGRAPHY MARKET
  • 5.16.1 INTRODUCTION

6 EUV LITHOGRAPHY MARKET, BY COMPONENT

• 6.1 INTRODUCTION
• 6.2 LIGHT SOURCES
  • 6.2.1 GROWING ADOPTION OF LPP EUV LIGHT SOURCES IN COMMERCIAL SYSTEMS TO PROPEL MARKET
• 6.3 OPTICS
  • 6.3.1 HIGH PRECISION AND ACCURACY OF EUV OPTICS TO DRIVE ADOPTION
• 6.4 MASKS
  • 6.4.1 GROWING EMPHASIS ON DEVELOPING NEXT-GENERATION SEMICONDUCTOR DEVICES TO PROPEL MARKET
• 6.5 OTHERS

7 EUV LITHOGRAPHY MARKET, BY END USER

• 7.1 INTRODUCTION
• 7.2 INTEGRATED DEVICE MANUFACTURERS
  • 7.2.1 EMPHASIS ON DEVELOPING ADVANCED, ENERGY-EFFICIENT MICROCHIPS AND ICS TO DRIVE GROWTH
• 7.3 FOUNDRIES
  • 7.3.1 INNOVATIONS IN SEMICONDUCTOR NODES TO ACCELERATE ADOPTION OF EUV LITHOGRAPHY BY FOUNDRIES

8 EUV LITHOGRAPHY MARKET, BY REGION

• 8.1 INTRODUCTION
• 8.2 AMERICAS
  • 8.2.1 PRESENCE OF STRONG SEMICONDUCTOR ECOSYSTEM TO PROPEL MARKET GROWTH
  • 8.2.2 MACROECONOMIC OUTLOOK FOR AMERICAS
• 8.3 EUROPE
  • 8.3.1 STRATEGIC INVESTMENTS IN R&D BY GERMANY, NETHERLANDS, AND FRANCE TO STRENGTHEN MARKET GROWTH
  • 8.3.2 MACROECONOMIC OUTLOOK FOR EUROPE
• 8.4 ASIA PACIFIC
  • 8.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
  • 8.4.2 CHINA
    • 8.4.2.1 Advanced semiconductor production capabilities fueling market growth
  • 8.4.3 JAPAN
    • 8.4.3.1 Strong semiconductor ecosystem driving market growth
  • 8.4.4 SOUTH KOREA
    • 8.4.4.1 Advancement in EUV lithography fueling semiconductor innovation
  • 8.4.5 TAIWAN
    • 8.4.5.1 Significant investments in eco-friendly EUV system components to drive growth
  • 8.4.6 REST OF ASIA PACIFIC

9 COMPETITIVE LANDSCAPE

• 9.1 OVERVIEW
• 9.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2023-2024
• 9.3 REVENUE ANALYSIS, 2021-2023
• 9.4 MARKET SHARE ANALYSIS, 2023
• 9.5 COMPANY VALUATION AND FINANCIAL METRICS
• 9.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
  • 9.6.1 STARS
  • 9.6.2 EMERGING LEADERS
  • 9.6.3 PERVASIVE PLAYERS
  • 9.6.4 PARTICIPANTS
  • 9.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
    • 9.6.5.1 Company footprint
    • 9.6.5.2 Region footprint
    • 9.6.5.3 Component footprint
    • 9.6.5.4 End user footprint
• 9.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
  • 9.7.1 PROGRESSIVE COMPANIES
  • 9.7.2 RESPONSIVE COMPANIES
  • 9.7.3 DYNAMIC COMPANIES
  • 9.7.4 STARTING BLOCKS
  • 9.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
    • 9.7.5.1 Detailed list of startups/SMEs
    • 9.7.5.2 Competitive benchmarking of startups/SMEs
• 9.8 COMPETITIVE SCENARIO
  • 9.8.1 PRODUCT LAUNCHES
  • 9.8.2 DEALS

10 COMPANY PROFILES

• 10.1 INTRODUCTION
• 10.2 KEY PLAYERS
  • 10.2.1 ASML
    • 10.2.1.1 Business overview
    • 10.2.1.2 Products/Solutions/Services offered
    • 10.2.1.3 Recent developments
      • 10.2.1.3.1 Deals
    • 10.2.1.4 MnM view
      • 10.2.1.4.1 Key strengths
      • 10.2.1.4.2 Strategic choices
      • 10.2.1.4.3 Weaknesses and competitive threats
• 10.3 KEY COMPONENT MANUFACTURERS
  • 10.3.1 CARL ZEISS AG
    • 10.3.1.1 Carl Zeiss AG: Business overview
    • 10.3.1.2 Products/Solutions/Services offered
    • 10.3.1.3 Recent developments
      • 10.3.1.3.1 Product launches
    • 10.3.1.4 MnM view
      • 10.3.1.4.1 Key strengths
      • 10.3.1.4.2 Strategic choices
      • 10.3.1.4.3 Weaknesses and competitive threats
  • 10.3.2 NTT ADVANCED TECHNOLOGY CORPORATION
    • 10.3.2.1 Business overview
    • 10.3.2.2 Products/Solutions/Services offered
    • 10.3.2.3 MnM view
      • 10.3.2.3.1 Key strengths
      • 10.3.2.3.2 Strategic choices
      • 10.3.2.3.3 Weaknesses and competitive threats
  • 10.3.3 KLA CORPORATION
    • 10.3.3.1 Business overview
    • 10.3.3.2 Products/Solutions/Services offered
    • 10.3.3.3 MnM view
      • 10.3.3.3.1 Key strengths
      • 10.3.3.3.2 Strategic choices
      • 10.3.3.3.3 Weaknesses and competitive threats
  • 10.3.4 ADVANTEST CORPORATION
    • 10.3.4.1 Business overview
    • 10.3.4.2 Products/Solutions/Services offered
    • 10.3.4.3 MnM view
      • 10.3.4.3.1 Key strengths
      • 10.3.4.3.2 Strategic choices
      • 10.3.4.3.3 Weaknesses and competitive threats
  • 10.3.5 USHIO INC.
    • 10.3.5.1 Business overview
    • 10.3.5.2 Products/Solutions/Services offered
  • 10.3.6 SUSS MICROTEC SE
    • 10.3.6.1 Business overview
    • 10.3.6.2 Products/Solutions/Services offered
  • 10.3.7 AGC INC.
    • 10.3.7.1 Business overview
    • 10.3.7.2 Products/Solutions/Services offered
  • 10.3.8 LASERTEC CORPORATION
    • 10.3.8.1 Business overview
    • 10.3.8.2 Products/Solutions/Services offered
  • 10.3.9 TOPPAN INC.
    • 10.3.9.1 Business overview
    • 10.3.9.2 Products/Solutions/Services offered
• 10.4 OTHER PLAYERS
  • 10.4.1 ENERGETIQ TECHNOLOGY, INC.
  • 10.4.2 NUFLARE TECHNOLOGY INC.
  • 10.4.3 PHOTRONICS, INC.
  • 10.4.4 HOYA CORPORATION
  • 10.4.5 TRUMPF
  • 10.4.6 RIGAKU HOLDINGS CORPORATION
  • 10.4.7 EDMUND OPTICS INC.
  • 10.4.8 IMAGINE OPTIC
  • 10.4.9 APPLIED MATERIALS, INC.
  • 10.4.10 PARK SYSTEMS
  • 10.4.11 EUV TECH
  • 10.4.12 MLOPTIC CROP.
  • 10.4.13 MKS INSTRUMENTS
  • 10.4.14 BROOKS AUTOMATION
  • 10.4.15 PFEIFFER VACUUM GMBH

11 APPENDIX

• 11.1 INSIGHTS FROM INDUSTRY EXPERTS
• 11.2 DISCUSSION GUIDE
• 11.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 11.4 CUSTOMIZATION OPTIONS
• 11.5 RELATED REPORTS
• 11.6 AUTHOR DETAILS