TPM(Trusted Platform Module) : 시장 점유율 분석, 산업 동향 및 통계 데이터, 성장 예측(2026-2031년)

According to Mordor Intelligence, the trusted platform module (TPM) market size was valued at USD 3.28 billion in 2025 and estimated to grow from USD 3.63 billion in 2026 to reach USD 6.00 billion by 2031, at a CAGR of 10.60% during the forecast period (2026-2031).

This report is Segmented by TPM Type (Discrete TPM (dTPM), and More), Host-Interface (SPI/ESPI, I2C/I3C, LPC, and More), End-Use Device (PCs and Laptops, Servers and Data-Center Platforms, Iot and Embedded Systems, Automotive Electronics, and More), Industry Vertical (IT and Telecom, BFSI, Healthcare and Life Sciences, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Trusted Platform Module (TPM) Market Trends and Insights

Growing Adoption of Hardware-Based Root of Trust in PCs and Servers

Demand in the Trusted Platform Module (TPM) market has strengthened as the hardware root of trust has shifted from an optional upgrade to a required security layer. Microsoft places TPM 2.0 at the center of Windows 11's protections, including BitLocker, Windows Hello for Business, and virtualization-based security.That same trust anchor now extends to newer client platforms that integrate Microsoft Pluton into modern processor families, moving hardware-backed identity deeper into standard device architecture. Network infrastructure is also adopting this pattern, as IETF RFC 9683 formalized remote integrity verification workflows for routers, switches, and firewalls that contain TPMs.This expands the market's serviceable base beyond traditional PCs into servers, networking equipment, and cloud infrastructure.

Mandatory TPM 2.0 Requirement for Windows 11 Upgrade Cycle

The Windows 10 support deadline turned the TPM market into a direct beneficiary of operating system migration. Microsoft continues to treat TPM 2.0 as a non-negotiable security requirement in Windows 11. That baseline forces enterprises to assess their installed fleets earlier than planned, because devices that cannot meet the requirement become harder to keep in place over long service cycles. The same expectation reinforces a broader endpoint security stack that links TPM 2.0 with secure boot, UEFI, device identity, and measured startup processes. The result is that a software transition now behaves like a hardware procurement event across the market.

Supply Chain Volatility for 45 Nm and Older Trusted Foundry Nodes

Supply tightness at mature nodes remains a direct brake on the TPM market. Discrete TPM designs depend on 40-90nm processes where tamper resistance, shielding, and side-channel protection matter more than density gains. Product families in this category are often designed for long life and harsh operating conditions, which limits how quickly vendors can move to new manufacturing paths without affecting qualification and lifecycle commitments. Security certification and platform-level validation also slow down sourcing changes, which favors incumbents with deep manufacturing and compliance experience. As a result, supply disruptions at qualified nodes can limit near-term market expansion even when demand remains firm.

Other drivers and restraints analyzed in the detailed report include:

1. Rising Cyber-Insurance Premiums Driving Demand for Certified Secure Elements
2. Automotive UNECE R155/R156 Compliance Accelerating Secure ECU Rollouts
3. Cost-Sensitive IoT Nodes Opting for Lightweight Crypto Alternatives

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Discrete TPM held 48.8% of the trusted platform module (TPM) market share in 2025, which shows that enterprise and government buyers still place a premium on physical separation for key storage and trust validation. Its position remains strongest in systems where tamper-resistant packaging, independent power domains, and certification depth directly shape procurement decisions. Integrated TPM and firmware TPM solutions continue to gain presence in PCs and mobile platforms because they add security functions without requiring a separate component. This is pushing discrete suppliers to compete less on basic availability and more on certification history, supply-chain provenance, and long-term lifecycle support.

Virtual TPM is projected to grow at a 12.8% CAGR from 2026 to 2031, making it the fastest-growing format in the TPM market. The industry is also seeing vTPM and fTPM gain traction in cloud environments and edge AI systems, where software-managed trust can scale faster than new discrete hardware. Research on ARM-based embedded architectures already points to post-quantum attestation paths that can be implemented within firmware-led trust models. wolfSSL's May 2026 firmware TPM release with ML-DSA and ML-KEM support shows how vendors are responding to that need before native PQC silicon becomes widely available.

SPI/eSPI retained 46.7% of the market in 2025, reflecting its broad installed base across commercial PCs and embedded industrial systems. That footprint keeps the interface relevant even as newer platform designs favor higher-throughput connections. LPC still supports a meaningful legacy base, but its role is narrowing as server and data-center architectures move away from older bus designs. In the Trusted Platform Module (TPM) market, host-interface selection now affects supplier choice, qualification work, and upgrade timing as much as raw security capability.

PCIe/USB is forecast to grow at a 13.7% CAGR from 2026 to 2031, indicating a broader platform shift in modern server and infrastructure designs. This change matters because interface migration often requires system-level requalification and opens procurement windows for vendors aligned with the new architecture. I2C and I3C are also gaining share in automotive and IoT use cases where lower pin counts matter, and I3C offers higher throughput for next-generation control and attestation workloads. STMicroelectronics addresses these needs through its ST33KTPM family with SPI or I2C options, FIPS 140-3 and Common Criteria EAL4+ certification, and industrial variants rated from -40°C to 105°C with a 20-year product lifetime.

Geography Analysis

North America held 38.2% of the trusted platform module (TPM) market share in 2025, which made it the largest regional contributor. The United States remains the anchor because federal procurement expectations, cloud assurance needs, and enterprise security baselines keep certified silicon in steady demand. A dense concentration of hyperscale data centers also supports stronger server-side deployment across the Trusted Platform Module (TPM) market. Canada adds a smaller but meaningful layer through digital government programs and financial-sector security requirements. North America's preference for trusted sourcing helps preserve pricing power for qualified discrete TPM suppliers.

Asia-Pacific is projected to grow at a 12.4% CAGR from 2026 to 2031, making it the fastest-growing regional segment of the trusted platform module (TPM) market. Japan, South Korea, China, and India are all contributing to this acceleration through stronger automotive, semiconductor, and connected-device activity. China's GB 44495 rollout is widening the compliance pull for secure vehicle electronics across the region. South Korea shows the depth of this movement, with Rambus security IP integrated into BOS Semiconductors' Eagle-N automotive AI accelerator on Samsung's 5nm process for authenticated startup and protected over-the-air updates. The Trusted Computing Group's Japan Regional Forum also shows that standards engagement in Asia-Pacific is mature enough to support broader deployment across the ecosystem.

Europe is the second-largest regional market, with Germany, the United Kingdom, and France as principal demand centers. Windows 11 migration requirements and the EU Cyber Resilience Act are reinforcing the case for certified hardware roots of trust across enterprise and product-security use cases. South America, the Middle East, and Africa remain earlier-stage regions where adoption is concentrated in government, defense, and telecom projects rather than mass enterprise refresh cycles. These regions are still smaller today, but infrastructure digitization and sovereign cybersecurity investment should support a broader role for the Trusted Platform Module (TPM) market over time.

1. Infineon Technologies AG
2. Nuvoton Technology Corp.
3. STMicroelectronics N.V.
4. Microchip Technology Inc.
5. Samsung Electronics Co. Ltd.
6. Renesas Electronics Corp.
7. Texas Instruments Inc.
8. Intel Corp.
9. Advanced Micro Devices Inc.
10. Marvell Technology Inc.
11. Broadcom Inc.
12. Winbond Electronics Corp.
13. IBM Corp.
14. Cisco Systems Inc.
15. Dell Technologies Inc.
16. Hewlett Packard Enterprise Co.
17. Lenovo Group Ltd.
18. Google LLC
19. Microsoft Corp.
20. Huawei Technologies Co. Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing Adoption of Hardware-Based Root of Trust in PCs and Servers
  • 4.2.2 Mandatory TPM 2.0 Requirement for Windows 11 Upgrade Cycle
  • 4.2.3 Rising Cyber-Insurance Premiums Driving Demand for Certified Secure Elements
  • 4.2.4 Automotive UNECE R155/R156 Compliance Accelerating Secure ECU Rollouts
  • 4.2.5 Edge AI Inference Platforms Requiring Hardware Security for Model IP Protection
  • 4.2.6 Quantum-Resistant Firmware Initiatives Boosting Next-Gen TPM Refresh
• 4.3 Market Restraints
  • 4.3.1 Supply Chain Volatility for 45 nm and Older Trusted Foundry Nodes
  • 4.3.2 Cost-Sensitive IoT Nodes Opting for Lightweight Crypto Alternatives
  • 4.3.3 Fragmented Attestation Standards Across Cloud, Edge, and Automotive Domains
  • 4.3.4 Emerging Zero-Trust Architectures Reducing Reliance on Local TPMs
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Degree of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS

• 5.1 By TPM Type
  • 5.1.1 Discrete TPM (dTPM)
  • 5.1.2 Integrated TPM (iTPM/Platform Trust Tech)
  • 5.1.3 Firmware TPM (fTPM)
  • 5.1.4 Virtual TPM (vTPM/Software)
• 5.2 By Host-Interface
  • 5.2.1 SPI/eSPI
  • 5.2.2 I2C/I3C
  • 5.2.3 LPC
  • 5.2.4 PCIe/USB
• 5.3 By End-Use Device Category
  • 5.3.1 PCs and Laptops
  • 5.3.2 Servers and Data-Center Platforms
  • 5.3.3 IoT and Embedded Systems
  • 5.3.4 Automotive Electronics
  • 5.3.5 Industrial Control and Automation
  • 5.3.6 Mobile and Consumer Devices
  • 5.3.7 Other End-Use Device Categories
• 5.4 By Industry Vertical
  • 5.4.1 IT and Telecom
  • 5.4.2 BFSI
  • 5.4.3 Healthcare and Life Sciences
  • 5.4.4 Government and Defense
  • 5.4.5 Retail and Commerce
  • 5.4.6 Other Industry Verticals
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Rest of North America
  • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
  • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Rest of Europe
  • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 South Korea
    • 5.5.4.4 India
    • 5.5.4.5 Rest of Asia-Pacific
  • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Rest of Middle East
  • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Nigeria
    • 5.5.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Infineon Technologies AG
  • 6.4.2 Nuvoton Technology Corp.
  • 6.4.3 STMicroelectronics N.V.
  • 6.4.4 Microchip Technology Inc.
  • 6.4.5 Samsung Electronics Co. Ltd.
  • 6.4.6 Renesas Electronics Corp.
  • 6.4.7 Texas Instruments Inc.
  • 6.4.8 Intel Corp.
  • 6.4.9 Advanced Micro Devices Inc.
  • 6.4.10 Marvell Technology Inc.
  • 6.4.11 Broadcom Inc.
  • 6.4.12 Winbond Electronics Corp.
  • 6.4.13 IBM Corp.
  • 6.4.14 Cisco Systems Inc.
  • 6.4.15 Dell Technologies Inc.
  • 6.4.16 Hewlett Packard Enterprise Co.
  • 6.4.17 Lenovo Group Ltd.
  • 6.4.18 Google LLC
  • 6.4.19 Microsoft Corp.
  • 6.4.20 Huawei Technologies Co. Ltd.

7 MARKET OPPORTUNITIES and FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment