무선 충전 IC : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the wireless charging IC market size was valued at USD 5.02 billion in 2025 and estimated to grow from USD 6.18 billion in 2026 to reach USD 12.05 billion by 2031, at a CAGR of 14.29% during the forecast period (2026-2031).

This report is Segmented by IC Type (Receiver ICs, and Transmitter ICs), Power Rating (Low Power (Less Than 20W), Medium Power 20-100W, and High Power (More Than 100W)), Charging Standard (Qi Standard, Airfuel PMA/Resonant, and More), Application (Smartphones/Tablets, Automotive In-Cabin, Industrial and IoT Devices, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Wireless Charging IC Market Trends and Insights

Expanding Attach-Rates of Wireless Charging in Flagship and Mid-Tier Smartphones

The Wireless Power Consortium certified more than 1,200 Qi2 products in 2025, enabling magnetic alignment that reduces misposition losses to under 5% and allows receiver ICs to shrink without thermal penalties. Samsung, Google, and Apple each committed to Qi2 across their 2026 portfolios, normalizing feature sets and moving competition toward software-defined power profiles and foreign-object detection. China's Xiaomi, OPPO, and vivo are pushing 50 W pads into devices priced below USD 500, multiplying receiver volumes while compressing average selling prices. Silicon Source's 2.0 mm-square GY5502 enables boards to power batteries from true wireless stereo earbuds to tablets without redesign, reinforcing economies of scale. As attach-rates percolate through mid-tier lines, shipment elasticity more than offsets unit price erosion, sustaining revenue momentum for the wireless charging IC market.

Regulatory Push for Port-Less Devices, EU Common Charger Directive and China IPX8 Compliance

Mandate M/607 sets a March 2027 deadline for interoperable cordless charging across the European Union, driving transmitter IC vendors to prioritize Qi2 certification over proprietary extensions. Ecodesign Regulation 2025/2052 further caps standby power at 0.80 W, compelling integrated controllers with sub-µA quiescent current and dynamic load detection. China's updated EMC project 20240568-T-339 tightens emission limits and accelerates the shift to sealed, IPX8-rated enclosures that can only recharge wirelessly. These converging statutes raise barriers for legacy wired connectors and fix wireless power as the default energy pathway for next-generation portable electronics. Vendors with multi-protocol negotiation stacks gain leverage because OEMs now require single-chip solutions that span Qi1.x, Qi2, and emerging AirFuel extensions without redesign.

EMI Compliance Failures Above 65 W Limiting Notebook Design Wins

Thin-profile laptops that target 65 W cordless fast-charge struggle to meet FCC Part 15 and CISPR 32 Class B harmonics because metal chassis amplify 80-300 kHz coil switching energies. Spread-spectrum and active-cancellation silicon pushes die size up to 20%, lifting transmitter IC cost curves while still failing to pass radiated immunity on the first attempt. Certification cycles can double to 20 weeks, eroding OEM release calendars and tilting preference back toward USB-C Power Delivery. Transmitter suppliers that master embedded shielding and intelligent phase dithering will secure early wins, yet most road maps now defer 100 W inductive notebooks until at least 2028, trimming near-term growth for the wireless charging IC market.

Other drivers and restraints analyzed in the detailed report include:

1. Automakers Adopting In-Cabin Inductive Pads as a Standard Comfort Feature
2. Rapid adoption of 15 W-50 W wireless charging in industrial handhelds and AMRs
3. Fragmented Proprietary Standards Leading to OEM Supply-Chain Lock-Ins

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Receiver ICs accounted for 62.52% of the wireless charging IC market share in 2025 and are set to grow at a 15.4% CAGR through 2031. That trajectory stems from billions of smartphones, smartwatches, and in-cabin modules that refresh every 18-24 months, compared with five-year cycles for pads and docks. Receiver miniaturization now extends to 2.0 X 2.0 mm chip-scale packages, allowing designers to embed power management into smart rings without enlarging the enclosure. Epson's 0.1 W wafer-level die extends the reach to energy-harvesting sensors. Transmitter ICs command premium prices because they integrate gallium-nitride drivers, metal-oxide sensors for foreign-object detection, and sometimes Bluetooth Low Energy links for pad-to-phone authentication, but their numbers scale with furniture and automotive production, not handset volumes. Gallium-nitride devices boost efficiency from 88% to 95% while requiring smaller heat sinks, yet they expose OEMs to GaN wafer price swings that test hedging strategies.

A small pool of automotive-qualified suppliers limits choice for cabin transmitters, raising margins but increasing qualification lead times. In wearables, designers must comply with IEEE C95.1-specific absorption limits, putting pressure on receiver firmware to throttle current gracefully during near-field exposure. These contrasting design constraints keep the wireless charging IC market balanced: transmitter vendors pursue value over volume, while receiver vendors chase scale and wafer cost reductions. The asymmetry should persist until road-embedded inductive infrastructure deploys widely, at which point high-power transmitters may overtake hand-held receivers in revenue terms.

Low-power sub-20 W devices accounted for 46.56% of the wireless charging IC market in 2025, driven by smartphones and earbuds that charge daily on bedroom pads. Medium-power systems between 20 W and 100 W cater to tablets and automotive consoles and benefit from mature thermal stacks. High-power classes above 100 W will post the fastest 18.6% CAGR through 2031, as industrial robots and electric buses demand kilowatt-scale top-ups. Delta Electronics' 30 kW MOOVair dock sustained 95% efficiency in 2025 trials, matching cable benchmarks. Infineon's WLC1150 transmitter integrates active EMI cancellation, reducing radiated noise by 10 dB, and meets automotive EMC requirements without external shields. Yet thermal runaway events in 30-60 W smartphone stacks forced redesigns that delayed several 2025 flagships, proving that heat density remains a gating factor.

Notebook programs aiming for 65 W pads still fail FCC radiated tests half the time, provoking an industry-wide pivot toward 45 W "safe-harbor" modes. Vendors are combining power negotiation, foreign-object detection, and temperature telemetry in a single microcontroller to shorten validation loops, but silicon real estate increases by 15% as a result. Succeeding in high-power categories, therefore, depends on multidisciplinary expertise thermals, EMC, and firmware not just silicon scaling, a barrier that consolidates opportunity among diversified semiconductor houses.

Complete Report Scope:

• By IC Type
  • Receiver (Rx) ICs
  • Transmitter (Tx) ICs
• By Power Rating
  • Low Power (Less than 20 W)
  • Medium Power (20-100 W)
  • High Power (More than 100 W)
• By Charging Standard
  • Qi Standard
  • AirFuel (PMA / Resonant)
  • Other Charging Standards
• By Application
  • Smartphones and Tablets
  • Wearables and Hearables
  • Automotive (In-cabin)
  • Industrial and IoT Devices
  • Medical Devices
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • Middle East and Africa
  • South America

Geography Analysis

Asia-Pacific dominated the wireless charging IC market with 47.81% share in 2025, underpinned by China's handset assembly clusters, Japan's tier-one automotive suppliers, and South Korea's vertically integrated electronics champions. Xiaomi, OPPO, and vivo keep pushing 50 W standards into sub-USD 500 phones, multiplying receiver demand while squeezing gross margins. Panasonic Automotive, headquartered in Japan, has shipped more than 10 million moving-coil units and stands to scale further as Qi2 permeates 2026 automotive refresh cycles. Samsung's pledge for full-portfolio Qi2 adoption reorganizes the supply base toward software-centric power management. Raw-copper volatility, however, can swing Litz-wire coil costs by double-digit percentages each quarter, prompting Asian suppliers to secure multi-year contracts and explore aluminum-clad alternatives.

Asia-Pacific is projected to register the fastest CAGR of 15.30% through 2031, supported by the region's dominant smartphone manufacturing ecosystem, expanding electric vehicle production, and increasing adoption of Qi-enabled consumer devices. China, South Korea, Taiwan, and Japan continue to strengthen demand for wireless charging ICs through investments in semiconductor manufacturing, premium consumer electronics, and automotive electronics. Additionally, the growing deployment of wireless charging in wearables, industrial IoT devices, and smart home products is reinforcing Asia-Pacific's position as the largest and fastest-growing regional market.

Europe accelerates cordless adoption through the Common Charger Directive and the 0.80 W Ecodesign standby cap, yet repeated EMI failures above 65 W delay notebook launches. Mandate M/607 forces chipmakers to prove multi-standard interoperability, lifting research and development intensity and favoring firms with large compliance budgets. Infineon's silicon-carbide modules powering Electreon's 200 kW road strips in Sweden exemplify the region's ambition to bring inductive charging to fleet infrastructure. While the Middle East and Africa grow from a smaller base at a significant CAGR, smart-city pilots in Dubai and Riyadh include cord-free bus stops and street furniture. Latin America gains from automotive manufacturing in Brazil and Mexico, where crossover SUVs now list Qi2 pads as standard; nonetheless, currency swings temper consumer electronics penetration.

1. Renesas Electronics Corporation
2. NXP Semiconductors N.V.
3. Texas Instruments Incorporated
4. Infineon Technologies AG
5. Qualcomm Incorporated
6. Rohm Co., Ltd.
7. STMicroelectronics N.V.
8. Onsemi Corporation
9. Semtech Corporation
10. Dialog Semiconductor GmbH (a Renesas Company)
11. Torex Semiconductor Ltd.
12. NuVolta Technologies (Shanghai) Co., Ltd.
13. Efficient Power Conversion Corporation
14. Powercast Corporation
15. Energous Corporation
16. HaloMicro Electronics Co., Ltd.
17. iWatt Inc. (a Dialog/Renesas subsidiary)
18. Shenzhen Injoinic Technology Co., Ltd.
19. Chip Sea Technologies (Shenzhen) Corp.
20. BQ Telecommunication AB (BQloud)

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Expanding Attach-rates of Wireless Charging in Flagship and Mid-tier Smartphones
  • 4.2.2 Regulatory Push For Port-Less Devices (EU Common Charger Directive and China Ipx8 Compliance)
  • 4.2.3 Automakers Adopting In-Cabin Inductive Pads as a Standard Comfort Feature
  • 4.2.4 Rapid Adoption of 15-50 W Wireless Charging in Industrial Handhelds and AMRs
  • 4.2.5 Miniaturised Rx ICs Enabling Sub-1 W Trickle Charging for Wearables And Hearables
  • 4.2.6 Venture Funding into Mm-Wave Far-Field Power Beaming Start-Ups
• 4.3 Market Restraints
  • 4.3.1 Emi Compliance Failures Above 65 W Limiting Notebook Design Wins
  • 4.3.2 Fragmented Proprietary Standards Leading to OEM Supply-Chain Lock-Ins
  • 4.3.3 Thermal Runaway Incidents in High-Density Coil/IC Stacks Above 30 W
  • 4.3.4 Raw-Material Price Volatility for Gan and Litz-Wire Substrates
• 4.4 Industry Value Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Suppliers
  • 4.7.3 Bargaining Power of Buyers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By IC Type
  • 5.1.1 Receiver (Rx) ICs
  • 5.1.2 Transmitter (Tx) ICs
• 5.2 By Power Rating
  • 5.2.1 Low Power (Less than 20 W)
  • 5.2.2 Medium Power (20-100 W)
  • 5.2.3 High Power (More than 100 W)
• 5.3 By Charging Standard
  • 5.3.1 Qi Standard
  • 5.3.2 AirFuel (PMA / Resonant)
  • 5.3.3 Other Charging Standards
• 5.4 By Application
  • 5.4.1 Smartphones and Tablets
  • 5.4.2 Wearables and Hearables
  • 5.4.3 Automotive (In-cabin)
  • 5.4.4 Industrial and IoT Devices
  • 5.4.5 Medical Devices
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 India
    • 5.5.3.4 South Korea
    • 5.5.3.5 Rest of Asia-Pacific
  • 5.5.4 Middle East and Africa
  • 5.5.5 South America

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Vendor Positioning Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Products and Services, and Recent Developments)
  • 6.4.1 Renesas Electronics Corporation
  • 6.4.2 NXP Semiconductors N.V.
  • 6.4.3 Texas Instruments Incorporated
  • 6.4.4 Infineon Technologies AG
  • 6.4.5 Qualcomm Incorporated
  • 6.4.6 Rohm Co., Ltd.
  • 6.4.7 STMicroelectronics N.V.
  • 6.4.8 Onsemi Corporation
  • 6.4.9 Semtech Corporation
  • 6.4.10 Dialog Semiconductor GmbH (a Renesas Company)
  • 6.4.11 Torex Semiconductor Ltd.
  • 6.4.12 NuVolta Technologies (Shanghai) Co., Ltd.
  • 6.4.13 Efficient Power Conversion Corporation
  • 6.4.14 Powercast Corporation
  • 6.4.15 Energous Corporation
  • 6.4.16 HaloMicro Electronics Co., Ltd.
  • 6.4.17 iWatt Inc. (a Dialog/Renesas subsidiary)
  • 6.4.18 Shenzhen Injoinic Technology Co., Ltd.
  • 6.4.19 Chip Sea Technologies (Shenzhen) Corp.
  • 6.4.20 BQ Telecommunication AB (BQloud)

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment