GPU 기판 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the GPU substrate market size is expected to increase from USD 3.42 billion in 2025 to USD 4.48 billion in 2026 and reach USD 13.33 billion by 2031, growing at a CAGR of 24.37% over 2026-2031.

This report is Segmented by Substrate Construction Type (ABF-Based Organic, Glass-Core Substrates, and More), Package Architecture (FC-BGA Substrates, and More), GPU Application (Data Center AI GPUs, Automotive GPUs, and More), End-Use Industry (Hyperscale Cloud and AI Infrastructure, Enterprise and Colocation Data Centers, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Substrate Market Trends and Insights

Rising AI GPU Shipments And High-Density Packaging Demand

The GPU substrate market is growing faster than shipment counts alone would suggest, because current AI accelerators use much larger packages and much heavier build-up requirements than earlier GPU platforms. In the GPU substrate market, this change lifts substrate area consumption per finished device as memory integration, power delivery, and signal routing all become more demanding within the same package envelope. The commercial effect is already visible in supplier strategy, since leading companies are directing expansion toward high-performance IC package substrates tied to AI server programs rather than broad exposure to lower-value printed circuit categories. Ibiden said in February 2026 that its electronics investment plan is focused on high-performance IC package substrates, with mass production at new plants expected from fiscal 2027. Samsung Electro-Mechanics also said its high-value FC-BGA portfolio for servers, AI, automotive, and network applications is set to account for more than 50% of its substrate revenue by 2026. As a result, the GPU substrate market is being shaped by platforms that demand high yield at advanced specifications, which gives experienced suppliers a stronger position in pricing, allocation, and customer qualification.

Shift To Chiplet-Based GPU Architectures

The GPU substrate market is also being lifted by the move toward chiplet-based designs, because multi-die layouts place logic, memory, and I/O elements on the same package and raise both substrate complexity and usable area. In the GPU substrate market, this matters because advanced package formats must support finer routing, tighter warpage control, and more demanding thermal behavior than monolithic layouts. A peer-reviewed paper presented at IEEE ECTC 2025 showed that advanced 2.5D liquid-cooled packages with embedded thermal structures can handle thermal design powers above 400 watts while keeping die temperatures within acceptable limits, which reflects the engineering load created by denser multi-die assemblies. That evidence helps explain why the GPU substrate market is placing greater value on process control, flatness, and yield consistency as package complexity rises. It also clarifies why glass-core development, hybrid bonding readiness, and ultra-flat large-panel processing are receiving more attention across advanced packaging ecosystems. The result is that the GPU substrate market is moving toward a technology ladder where each new architecture raises qualification difficulty for suppliers that are not already embedded in advanced GPU programs.

High Capital Intensity And Long Ramp-Up Cycles

The GPU substrate market faces a clear constraint in the form of high capital intensity, because advanced facilities require large upfront investment and long qualification periods before revenue can scale. In the GPU substrate market, that makes customer-backed expansion more common than independent capacity bets, especially for the highest layer counts and the most demanding package formats. Ibiden approved an investment plan of JPY 500 billion, or USD 3.33 billion, for fiscal 2026 to 2028, with new mass production expected from fiscal 2027. AT&S said in June 2026 that expanding high-end IC substrate capacity at Kulim required EUR 1.5 billion to EUR 2.0 billion, or USD 1.68 billion to USD 2.24 billion, fully financed by long-term customer commitments. Those commitments show that supply growth in the GPU substrate market is often gated by the willingness of a narrow customer group to underwrite capacity before output is available. That lag keeps the market tight even when investment announcements are large, because building, qualifying, and ramping a new plant takes longer than current demand growth.

Other drivers and restraints analyzed in the detailed report include:

1. Expansion Of Hyperscale Data Centers And AI Clusters
2. Supply Localization Incentives For Advanced Packaging Capacity
3. Yield Losses At Very High Layer Counts

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

ABF-based organic substrates held 90.28% of the GPU substrate market share in 2025, while glass-core substrates are projected to expand at a 24.99% CAGR through 2031. That spread shows how firmly ABF remains embedded in current GPU and AI accelerator packaging, especially where high-layer counts, signal integrity, and production yield matter more than experimentation with new materials. The draft also makes clear that this leadership is not just a matter of installed base, because the supply chain around ABF is already aligned to the strict performance requirements of present advanced compute programs. BT and epoxy-based organic substrates continue to serve lower-layer-count GPU uses, mainly in gaming and professional visualization, where cost and established process flows remain important. Coreless organic substrates are drawing interest for thinner edge AI designs, but the draft indicates that mechanical fragility at larger panel sizes still limits broad use in data center-class products.

The GPU substrate industry still revolves around ABF because no alternative in the draft matches current AI program requirements at the same combination of layer count, yield, and commercial readiness. NIST support for Absolics shows that glass substrate development is moving from research to an industrial buildout path in the United States. Samsung Electro-Mechanics also disclosed that high-value FC-BGA linked to servers, AI, automotive, and network applications is becoming a larger share of its portfolio, which reinforces the push toward higher-performance substrate formats. Within the GPU substrate market, that means glass-core progress matters less as an immediate volume threat and more as a qualification path that could influence the top end of future package roadmaps. The overall mix, therefore, remains stable in the near term, with ABF carrying present revenue and glass-core shaping where the GPU substrate industry may compete next.

The 2.5D interposer-based package substrates segment accounted for 49.79% of the GPU substrate market size in 2025, while 3D die-stacked package substrates are projected to expand at a 25.14% CAGR through 2031. This lead reflects the commercial maturity of 2.5D packaging and its compatibility with high bandwidth memory integration, which has made it the default path for many current AI GPU designs. FC-BGA remains the second-largest architecture by value, because it supports mainstream data center and gaming GPU requirements without the full cost structure of a silicon interposer. FC-CSP continues to address compact edge AI and workstation products, where board space and package thickness influence design decisions more directly than extreme performance targets. Fan-out and RDL-based formats are also present in the draft, but their role remains more relevant for thin and compact products than for the largest data center packages.

The GPU substrate market is now balancing the proven volume role of 2.5D against the longer-term promise of 3D logic and memory stacking, and that balance is defining current packaging roadmaps. A peer-reviewed IEEE ECTC 2025 paper showed that advanced 2.5D packages with embedded cooling structures can manage thermal design powers above 400 watts, which helps explain why 2.5D still has room to scale before a full architectural shift is required. That finding matters because thermal performance and package flatness are now moving alongside electrical requirements as key success factors for the GPU substrate market. The draft also shows that 3D die-stacked formats are gaining momentum as logic-under-memory concepts and hybrid bonding move closer to wider commercialization. For suppliers, the main implication is that architectural growth is no longer just a matter of routing density, because cooling, warpage control, and large-format process stability now shape competitiveness across the GPU substrate market.

Complete Report Scope:

• By Substrate Construction Type
  • ABF-Based Organic Substrates
  • BT/Epoxy-Based Organic Substrates
  • Coreless Organic Substrates
  • Glass-Core Substrates
  • Ceramic and Other Specialty Substrates
• By Package Architecture
  • FC-BGA Substrates
  • FC-CSP Substrates
  • 2.5D Interposer-Based Package Substrates
  • 3D Die-Stacked Package Substrates
  • Fan-Out / RDL-Based Package Substrates
• By GPU Application
  • Data Center AI GPUs
  • HPC and Scientific Computing GPUs
  • Gaming and Consumer GPUs
  • Professional Visualization and Workstation GPUs
  • Edge AI and Embedded GPUs
  • Automotive GPUs
• By End-Use Industry
  • Hyperscale Cloud and AI Infrastructure
  • Enterprise and Colocation Data Centers
  • HPC, Government, and Defense
  • Consumer Electronics and Gaming
  • Automotive and Mobility
  • Industrial, Telecom, and Edge Computing
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

North America held 48.44% of the GPU substrate market share in 2025, and that lead reflected its concentration of GPU designers and hyperscaler customers. The region's position was driven by demand ownership rather than manufacturing scale, since many leading substrate panels are still produced in Asia and shipped into U.S.-centered design and server ecosystems. The GPU substrate market in North America is also being supported by localization programs that are expanding advanced packaging and substrate capability closer to end customers. NIST finalized USD 300 million in January 2025 awards for advanced substrate and substrate materials R&D, which helped lay institutional groundwork for domestic development. Ibiden's Arizona investment and the U.S. Department of Commerce support framework for Amkor show that North America is trying to reduce structural dependence on overseas advanced packaging capacity.

Asia-Pacific is projected to expand at a 25.33% CAGR through 2031, making it the fastest-growing regional block in the GPU substrate market. Japan remains the deepest production base in the draft, because it combines major substrate manufacturers with the upstream ABF material ecosystem that supports leading GPU programs. Taiwan continues to hold a central role through suppliers that serve advanced FC-BGA and AI package demand, and that entrenched manufacturing position keeps the region critical to near-term supply continuity. South Korea is also moving into more advanced substrate categories, with Samsung Electro-Mechanics positioning high-value substrate applications as a larger share of its portfolio. The region contains the broadest mix of incumbent scale, challenger investment, and materials know-how, which is why the GPU substrate market still depends on Asia-Pacific for most proven high-volume capability.

Europe held a smaller but strategically meaningful position in the GPU substrate market in 2025, with AT&S acting as the region's most visible advanced substrate player. AT&S said in June 2026 that its Kulim facility expansion for high-end IC substrates required EUR 1.5 billion to EUR 2.0 billion, or USD 1.68 billion to USD 2.24 billion, backed by long-term customer commitments. South America and the Middle East and Africa still have minimal substrate manufacturing capacity, even though AI infrastructure demand is beginning to rise in parts of those regions. That means the GPU substrate market remains globally sold but regionally concentrated on the supply side, with Europe adding technology depth and new investment, while most production capability still sits in Asia and demand leadership remains strongest in North America.

1. Unimicron Technology Corporation
2. Ibiden Co., Ltd.
3. AT&S Austria Technologie und Systemtechnik AG
4. Nan Ya Printed Circuit Board Corporation
5. Shinko Electric Industries Co., Ltd.
6. Kinsus Interconnect Technology Corp.
7. Samsung Electro-Mechanics Co., Ltd.
8. LG Innotek Co., Ltd.
9. Daeduck Electronics Co., Ltd.
10. Shennan Circuits Co., Ltd.
11. Absolics Inc. (SKC subsidiary)
12. Shenzhen Fastprint Circuit Tech Co., Ltd.
13. Korea Circuit Co., Ltd.
14. FICT Limited
15. AKM Meadville Co., Ltd.
16. Meiko Electronics Co., Ltd.
17. WUS Printed Circuit Co., Ltd.
18. Shinhwa Intertek Corp.
19. TOPPAN Inc.
20. Kyocera Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors on the Market
• 4.3 Market Drivers
  • 4.3.1 Rising AI GPU Shipments and High-Density Packaging Demand
  • 4.3.2 Shift to Chiplet-Based GPU Architectures
  • 4.3.3 Expansion of Hyperscale Data Centers and AI Clusters
  • 4.3.4 Supply Localization Incentives for Advanced Packaging Capacity
  • 4.3.5 Increasing Build-Up Layer Counts and Interconnect Density Requirements
  • 4.3.6 Adoption of Advanced Thermal-Management Substrate Designs
• 4.4 Market Restraints
  • 4.4.1 High Capital Intensity and Long Ramp-Up Cycles
  • 4.4.2 Yield Losses at Very High Layer Counts
  • 4.4.3 Concentrated ABF Material Supply Base
  • 4.4.4 Emerging Glass and RDL-First Alternatives
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Industry Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Substrate Construction Type
  • 5.1.1 ABF-Based Organic Substrates
  • 5.1.2 BT/Epoxy-Based Organic Substrates
  • 5.1.3 Coreless Organic Substrates
  • 5.1.4 Glass-Core Substrates
  • 5.1.5 Ceramic and Other Specialty Substrates
• 5.2 By Package Architecture
  • 5.2.1 FC-BGA Substrates
  • 5.2.2 FC-CSP Substrates
  • 5.2.3 2.5D Interposer-Based Package Substrates
  • 5.2.4 3D Die-Stacked Package Substrates
  • 5.2.5 Fan-Out / RDL-Based Package Substrates
• 5.3 By GPU Application
  • 5.3.1 Data Center AI GPUs
  • 5.3.2 HPC and Scientific Computing GPUs
  • 5.3.3 Gaming and Consumer GPUs
  • 5.3.4 Professional Visualization and Workstation GPUs
  • 5.3.5 Edge AI and Embedded GPUs
  • 5.3.6 Automotive GPUs
• 5.4 By End-Use Industry
  • 5.4.1 Hyperscale Cloud and AI Infrastructure
  • 5.4.2 Enterprise and Colocation Data Centers
  • 5.4.3 HPC, Government, and Defense
  • 5.4.4 Consumer Electronics and Gaming
  • 5.4.5 Automotive and Mobility
  • 5.4.6 Industrial, Telecom, and Edge Computing
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 India
    • 5.5.3.5 Southeast Asia
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Positioning Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Unimicron Technology Corporation
  • 6.4.2 Ibiden Co., Ltd.
  • 6.4.3 AT&S Austria Technologie und Systemtechnik AG
  • 6.4.4 Nan Ya Printed Circuit Board Corporation
  • 6.4.5 Shinko Electric Industries Co., Ltd.
  • 6.4.6 Kinsus Interconnect Technology Corp.
  • 6.4.7 Samsung Electro-Mechanics Co., Ltd.
  • 6.4.8 LG Innotek Co., Ltd.
  • 6.4.9 Daeduck Electronics Co., Ltd.
  • 6.4.10 Shennan Circuits Co., Ltd.
  • 6.4.11 Absolics Inc. (SKC subsidiary)
  • 6.4.12 Shenzhen Fastprint Circuit Tech Co., Ltd.
  • 6.4.13 Korea Circuit Co., Ltd.
  • 6.4.14 FICT Limited
  • 6.4.15 AKM Meadville Co., Ltd.
  • 6.4.16 Meiko Electronics Co., Ltd.
  • 6.4.17 WUS Printed Circuit Co., Ltd.
  • 6.4.18 Shinhwa Intertek Corp.
  • 6.4.19 TOPPAN Inc.
  • 6.4.20 Kyocera Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment