네트워크 스위칭 및 패킷 처리용 HBM : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the HBM for network switching and packet processing market is expected to increase from USD 0.15 billion in 2025 to USD 0.21 billion in 2026, and reach USD 1.18 billion by 2031, growing at a CAGR of 41.23% over 2026-2031.

This report is Segmented by Application (Ethernet Switch ASICs, Data Processing Units, Smartnics, and More), HBM Generation ( HBM3E, HBM4, and More), Memory Capacity Per Stack (16 GB, 24 GB, and More), End-User Industry (Cloud Data Centers, Enterprise Networking, and More), and Geography (North America, Asia-Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global HBM For Network Switching and Packet Processing Market Trends and Insights

Rising AI-Optimized Switch ASIC and Packet-Buffer Bandwidth Requirements

As AI training clusters moved past 100,000 accelerators, the HBM market for network switching and packet processing was pushed by a clear memory bandwidth limit that conventional on-die SRAM could not address on its own. A January 2026 IEEE paper on the HBM-NS architecture reported 32.1% lower energy use and 55% lower latency than switchless HBM configurations, supporting the case for near-memory switching as a practical network design option. The Themis paper presented at NSDI 2026 found that HBM-based hybrid buffer management improved end-to-end network performance by up to 2.8 times at 400 Gbps port speeds, providing a strong performance case for the HBM network-switching and packet-processing market beyond simple bandwidth claims. The pressure also rises faster than port speed alone suggests, because larger AI clusters create longer congestion events and denser traffic bursts as networks move from 400G to 800G and then toward 1.6T. That pattern is increasing demand for deeper buffer pools and helping higher-capacity HBM configurations gain ground across the HBM market for network switching and packet processing.

Co-Packaged HBM Adoption in Terabit-Class Network Switching Platforms

The HBM for network switching and packet processing market gained an early packaging blueprint when Broadcom introduced the first 51.2 Tbps co-packaged optics Ethernet switch platform in March 2024 with HBM, silicon photonics, and switch logic assembled in one package. Broadcom extended that model in October 2025 with the Tomahawk 6 Davisson at 102.4 Tbps, which doubled the bandwidth of earlier co-packaged switch designs while keeping HBM at the center of the system architecture. Marvell reinforced this direction in June 2026, when it launched the 102.4 Tbps Teralynx T100 with multiple packaging options for AI and cloud data center networking. This co-packaged approach changes the buying unit within the HBM for the network switching and packet processing market, as hyperscalers increasingly evaluate a combined HBM-ASIC package rather than separate memory and switch components. Vendors that can align memory roadmaps, packaging access, and switch silicon schedules earlier are therefore in a better position to capture the largest deployment cycles.

Limited Advanced Packaging Capacity for High-Volume HBM Integration

The HBM market for network switching and packet processing still depends on advanced packaging capacity that remains tighter than end demand, especially for designs that place HBM and switching logic in a single package. Broadcom's latest Tomahawk and Jericho platforms, along with Marvell's Teralynx T100, all point to a design direction that relies on sophisticated packaging rather than stand-alone memory attachment. That creates direct competition for packaging access between networking silicon and AI accelerators, giving the largest buyers and earliest reservers an obvious advantage in the HBM for network switching and packet processing market. Smaller networking vendors, therefore, face a harder path to scale, even when their technical roadmaps are sound and customer demand is present. The result is a two-speed supply environment in which top hyperscalers can move faster, while second-tier OEMs and enterprise-oriented vendors face slower ramp timing.

Other drivers and restraints analyzed in the detailed report include:

1. Hyperscale Data Center Migration Toward Memory-Bound Network Architectures
2. 800G and 1.6T Ethernet Rollouts Increasing Buffer Depth and Latency Sensitivity
3. Export Controls and Qualification Constraints on Advanced DRAM Nodes

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Ethernet switch ASICs held 43.13% of the HBM market share for network switching and packet processing in 2025, while AI networking fabric switches are projected to grow at a 42.03% CAGR from 2026 to 2031. That revenue lead reflected years of deployment in hyperscale leaf-spine Ethernet environments, where deep-buffer switching had already become a practical requirement for large east-west traffic loads. Broadcom said Jericho4 delivered 160 times the packet buffer capacity of standard on-chip memory, which explains why deep-buffer Ethernet platforms remained central to high-performance AI network design in 2025 and 2026. At the same time, the HBM for network switching and packet processing market is being pulled toward custom AI fabrics, and NVIDIA's March 2026 partnership with Marvell, backed by a USD 2 billion investment, has more tightly linked advanced packet management and scale-up networking to HBM-aware designs.

The next layer of demand comes from interface and packet-processing devices that sit closer to the server, the network edge, or the telecom control plane. Broadcom's BCM88690 datasheet showed that network processing hardware already used dual HBM Gen2 cubes for a total of 8 GB of packet buffer and supported up to 128,000 programmable queues, which kept NPUs relevant for deterministic traffic handling beyond the largest AI fabrics. That matters for the HBM in the network switching and packet processing industry because it shows that the technology is not limited to top-end switch ASICs and can also support queue-heavy, latency-sensitive packet processing workloads. Over time, application demand is likely to keep widening from the highest-performance switching tier into adjacent devices as memory yields improve, per-bit economics ease, and HBM-backed traffic management becomes easier to justify across more networking functions.

HBM3 commanded a 55.92% share in 2025, giving it the largest position in the HBM for network switching and packet processing market size by HBM generation, while HBM4 is projected to expand at a 42.21% CAGR through 2031. HBM3 built that lead because Broadcom's StrataDNX Jericho family and Tomahawk-class systems moved into production across 2024 and 2025, which gave this generation the strongest commercial footing in deployed switching platforms. HBM2 and HBM2E remained in legacy deep-buffer platforms, but their bandwidth-per-pin profile is becoming less suitable as networks move deeper into 400G-and-above switching. Broadcom's BCM88480 documentation illustrated that earlier HBM Gen2 designs still served installed router systems with 4 GB of in-package buffer memory, which shows why older generations did not disappear immediately, even as newer ones gained share.

The HBM market for network switching and packet processing is now moving toward HBM3E and HBM4, as next-generation switch silicon requires wider interfaces and greater bandwidth per stack. Research from Technion, UC Berkeley, and UC San Diego showed that a router-in-a-package design using 4 HBM4 stacks could deliver 81.92 Tbps of combined switching bandwidth, which highlighted the architectural headroom of the next memory generation. Samsung began HBM4 mass production in February 2026, and NVIDIA and SK Hynix formalized a multiyear technology partnership in June 2026 to advance next-generation memory for AI factories, both of which improved visibility around the future supply base. Those moves support the view that the HBM market for network switching and packet processing will continue shifting toward wider 2,048-bit interfaces and higher per-stack bandwidth as the next switching wave reaches production.

Complete Report Scope:

• By Application
  • Ethernet Switch ASICs
  • Data Processing Units (DPUs)
  • SmartNICs
  • Network Processing Units (NPUs)
  • AI Networking Fabric Switches
• By HBM Generation
  • HBM2
  • HBM2E
  • HBM3
  • HBM3E
  • HBM4
• By Memory Capacity Per Stack
  • 4 GB
  • 8 GB
  • 16 GB
  • 24 GB
  • 32 GB and Above
• By End-User Industry
  • Cloud Data Centers
  • Telecommunications
  • Enterprise Networking
  • Government and Defense
  • High-Performance Computing Networks
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • India
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

North America held 44.68% of the HBM for the network switching and packet processing market share in 2025. The region led because the United States was home to the largest hyperscale buyers of advanced switch silicon and was the first to adopt high-end HBM-backed networking platforms at scale. Google disclosed in 2026 that its Virgo network linked 134,000 TPU chips in a flat, non-blocking design and delivered up to 47 petabits per second of bisectional bandwidth, reflecting the scale of infrastructure that North American operators were already planning and deploying. That kind of deployment favors switches with far deeper memory bandwidth and packet buffering than conventional designs can provide, which keeps the HBM for network switching and packet processing market closely aligned with the region's hyperscale spending cycle. Government demand also supported the regional base after the NNSA backed next-generation networking work with Cornelis Networks for national computing programs.

Europe contributed a meaningful share in 2025, with Germany, the United Kingdom, France, and the Nordic countries hosting major cloud campuses and high-capacity network deployments. The region also benefited from 5G standalone core upgrades, which supported ongoing interest in packet processors and routing systems with richer memory subsystems. National AI programs in the United Kingdom and Germany are helping sustain future data center investment, which should support the gradual uptake of advanced switching silicon over the forecast period. Europe also has a strategic interest in reducing long-term dependence on semiconductor and packaging capabilities, even though Taiwan remains the central packaging hub for HBM in the network switching and packet processing market today.

Asia-Pacific is projected to grow at a 42.23% CAGR through 2031, making it the fastest-growing region in the HBM for network switching and packet processing market. South Korea sits at the center of supply because SK hynix posted record FY25 results, and NVIDIA entered a multiyear technology partnership with SK hynix in June 2026 for next-generation memory used in AI infrastructure. Taiwan remains indispensable because the most advanced AI-focused switch platforms from Broadcom and Marvell rely on package-intensive assembly paths that are deeply linked to the island's semiconductor ecosystem. India and Southeast Asia are earlier in adoption, but domestic cloud investment is beginning to create future demand for HBM-integrated switching platforms. South America,d the Middle East,t and Africa remain longer-horizon opportunities, where enterprise modernization and government network upgrades are more important near-term drivers than large AI fabric deployments.

1. SK hynix Inc.
2. Samsung Electronics Co., Ltd.
3. Micron Technology, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Rising AI-Optimized Switch ASIC and Packet-Buffer Bandwidth Requirements
  • 4.2.2 Co-Packaged HBM Adoption in Terabit-Class Network Switching Platforms
  • 4.2.3 Hyperscale Data Center Migration Toward Memory-Bound Network Architectures
  • 4.2.4 800G and 1.6T Ethernet Rollouts Increasing Buffer Depth and Latency Sensitivity
  • 4.2.5 Thermal and Power-Efficiency Gains From Near-Compute Memory Integration
  • 4.2.6 HBM-Rich Edge Networking for Deterministic Packet Processing in Telecom Equipment
• 4.3 Market Restraints
  • 4.3.1 Limited Advanced Packaging Capacity for High-Volume HBM Integration
  • 4.3.2 Export Controls and Qualification Constraints on Advanced DRAM Nodes
  • 4.3.3 Yield Risk Increases Rapidly With Higher-Stack HBM Architectures
  • 4.3.4 Tight Coupling to Custom ASIC Roadmaps Slows Broader Networking Adoption
• 4.4 Industry Value Chain Analysis
• 4.5 Impact of Macroeconomic Factors on the Market
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Application
  • 5.1.1 Ethernet Switch ASICs
  • 5.1.2 Data Processing Units (DPUs)
  • 5.1.3 SmartNICs
  • 5.1.4 Network Processing Units (NPUs)
  • 5.1.5 AI Networking Fabric Switches
• 5.2 By HBM Generation
  • 5.2.1 HBM2
  • 5.2.2 HBM2E
  • 5.2.3 HBM3
  • 5.2.4 HBM3E
  • 5.2.5 HBM4
• 5.3 By Memory Capacity Per Stack
  • 5.3.1 4 GB
  • 5.3.2 8 GB
  • 5.3.3 16 GB
  • 5.3.4 24 GB
  • 5.3.5 32 GB and Above
• 5.4 By End-User Industry
  • 5.4.1 Cloud Data Centers
  • 5.4.2 Telecommunications
  • 5.4.3 Enterprise Networking
  • 5.4.4 Government and Defense
  • 5.4.5 High-Performance Computing Networks
• 5.5 By Geography
  • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
  • 5.5.2 Europe
    • 5.5.2.1 Germany
    • 5.5.2.2 United Kingdom
    • 5.5.2.3 France
    • 5.5.2.4 Italy
    • 5.5.2.5 Rest of Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 Taiwan
    • 5.5.3.5 India
    • 5.5.3.6 Rest of Asia-Pacific
  • 5.5.4 South America
  • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
  • 6.4.1 SK hynix Inc.
  • 6.4.2 Samsung Electronics Co., Ltd.
  • 6.4.3 Micron Technology, Inc.
• 6.5 Other Ecosystem Players
  • 6.5.1 NVIDIA Corporation
  • 6.5.2 Advanced Micro Devices, Inc.
  • 6.5.3 Intel Corporation
  • 6.5.4 Broadcom Inc.
  • 6.5.5 Marvell Technology, Inc.
  • 6.5.6 Taiwan Semiconductor Manufacturing Company Limited
  • 6.5.7 ASE Technology Holding Co., Ltd.
  • 6.5.8 Amkor Technology, Inc.
  • 6.5.9 Powertech Technology Inc.
  • 6.5.10 United Microelectronics Corporation
  • 6.5.11 Rambus Inc.
  • 6.5.12 Cadence Design Systems, Inc.
  • 6.5.13 Synopsys, Inc.
  • 6.5.14 Applied Materials, Inc.
  • 6.5.15 Qualcomm Incorporated
  • 6.5.16 Fujitsu Limited
  • 6.5.17 Texas Instruments Incorporated

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment