네트워킹 및 통신 장비용 DRAM 시장 : 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the DRAM for networking and telecom equipment market size is projected to be USD 3.2 billion in 2025, USD 3.5 billion in 2026, and reach USD 5.6 billion by 2031, growing at a CAGR of 10.1% from 2026 to 2031.

This report is Segmented by Type (SDRAM, DDR, DDR2, DDR3, DDR4, and DDR5), Product Form (DRAM IC, and DARM Modules (UDIMM, RDIMM/LRDIMM)), Form Factor (Embedded DRAM, and Memory Modules), Functionality (Standard DRAM, and Low-Power DRAM), and Geography (North America, Europe, Asia-Pacific, Rest of the World). The Market Forecasts are Provided in Terms of Value (USD).

Global DRAM For Networking and Telecom Equipment Market Trends and Insights

Growing 5G And Advanced Network Rollouts

Growing 5G and advanced network rollouts are increasing memory demand across routers, switches, baseband units, and edge compute nodes in the DRAM for networking and telecom equipment market. The change is greater than in earlier mobile generations because Open RAN and virtualized functions rely more heavily on server-style architectures, bringing higher DRAM density into telecom deployments. That shift moves more memory into commercial platforms that must support both software workloads and transport functions simultaneously, which lifts content value even before unit volume fully scales. KDDI completed technical validation of its distributed disaggregated backbone router cluster in February 2025 and began large-scale commercial deployment in 2026, showing how carrier backbone upgrades are increasing memory needs per node. Standards bodies such as 3GPP and ETSI continue to shape platform requirements, and that keeps supplier qualification closely tied to long network investment cycles across the DRAM for networking and telecom equipment market. As operators push wider 5G coverage and more network intelligence, suppliers with telecom-ready DDR4 and DDR5 portfolios are positioned to capture steadier design wins over the forecast period.

Rising Memory Density Requirements In Routers And Switches

Rising memory density requirements in routers and switches are increasing the value of higher-capacity configurations in the DRAM for networking and telecom equipment market. Network equipment now has to handle larger routing tables, more software control functions, and more AI-assisted traffic management inside hardware platforms that still face strict reliability and thermal limits. That pressure is pushing vendors to support multiple DRAM generations simultaneously, because customers still need continuity in fielded systems even as newer platforms move higher in bandwidth and capacity. Broadcom launched its BCM677x family in June 2026, supporting DDR4, DDR5, LPDDR4, and LPDDR5, reflecting the need for flexible memory choices in next-generation routers and 5G fixed wireless access equipment. The DRAM for networking and telecom equipment market is therefore benefiting from both capacity growth and architectural flexibility, rather than from shipment growth alone. Vendors that can qualify denser modules or embedded designs without disrupting field reliability are likely to remain favored in refresh cycles where uptime and compatibility still matter more than headline speed alone.

Supply Prioritization Toward HBM And AI Servers

Supply prioritization toward HBM and AI servers is limiting the pace at which the DRAM for networking and telecom equipment market can be served, even though demand fundamentals remain firm. The issue is not weak network spending, but the reallocation of advanced manufacturing attention toward AI memory products that offer stronger pricing and faster near-term growth. Samsung began mass production of HBM4 in February 2026, reinforcing the industry's focus on high-bandwidth memory programs at a time when telecom buyers still needed conventional DRAM lines. As more leading-edge capacity shifts in that direction, telecom buyers face tighter availability of conventional DDR4 and DDR5 families across the DRAM for networking and telecom equipment market. The result is longer planning cycles, more pressure to secure supply early, and greater dependence on large vendors with broad product roadmaps and stronger allocation control. This restraint matters most for equipment makers that need stable sourcing across several platform generations, because they cannot easily redesign qualified systems every time memory availability tightens.

Other drivers and restraints analyzed in the detailed report include:

1. DDR5 Transition In Telecom Infrastructure Platforms
2. AI-Driven Edge And Micro Data Center Expansion
3. Long Qualification Cycles For Carrier-Grade Memory

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

DDR4 held 58.2% of the DRAM for networking and telecom equipment market share in 2025, reflecting the size of the installed base across routers, switches, and base station platforms that were qualified based on DDR4 availability and cost discipline. Its lead remained tied to ecosystem maturity, lower transition risk, and the fact that many carrier platforms still prioritize continuity over aggressive architecture change. Older generations, such as SDRAM, DDR, DDR2, and DDR3, stayed limited to maintenance programs and lifecycle extensions, with little relevance to fresh design wins in 2026 platform planning. DDR5 is forecast to expand at a 11.3% CAGR through 2031, indicating where new product development is heading as vendors prepare for broader software workloads, faster buffering, and richer control functions. The result is a structure where the DRAM for networking and telecom equipment market still earns much of its value from DDR4 volume, even while future design momentum shifts higher.

Micron sampled its 256 GB DDR5 RDIMM at 9,200 MT/s in May 2026, and that release provided equipment designers with a clear reference point for next-generation control-plane and server-based telecom workloads. SK Hynix's certification milestone in December 2025 also supported broader confidence around enterprise-grade DDR5 readiness for telecom-adjacent platforms that need long qualification paths and high-density scaling. Even so, the transition is slower here than in hyperscale servers because operators keep equipment in the field longer and test more extensively before a platform shift is approved. That creates a long overlap period in which suppliers that can serve both DDR4 and DDR5 remain best placed in the DRAM for networking and telecom equipment market. It also means type leadership will change more gradually than design activity suggests, because installed hardware and procurement discipline still favor orderly migration over rapid replacement.

DRAM IC commanded a 74.2% share in 2025, indicating that direct chip integration still anchors most hardware designs in the DRAM for networking and telecom equipment market. Those discrete chips fit well in routing ASICs, switching SoCs, and line cards where board layout, latency control, thermal behavior, and long validation cycles remain tightly managed. DRAM Modules held the smaller position, but they became more relevant where telecom functions moved onto commercial server hardware rather than fully custom carrier platforms. RDIMM/LRDIMM is forecast to grow at a 10.5% CAGR through 2031, and that part of the DRAM for networking and telecom equipment market size is tied to Open RAN, NFV, and virtual router deployments. The product-form mix, therefore, shows a clear split between fixed-embedded designs in traditional equipment and modular server memory in newer software-led architectures.

Innodisk showcased DDR5 8000 RDIMM, CUDIMM, CSODIMM, and MRDIMM 12800 at COMPUTEX 2026, signaling a broader module roadmap for edge AI and telecom deployments that require flexible capacity options. Its February 2026 CXL Add-In Card also showed that module-led growth is expanding beyond standard DIMM slots into upgrade-friendly edge formats with fewer platform redesign demands. This gives specialist suppliers more room to differentiate on qualification, lifecycle support, and controlled configurations rather than on wafer scale alone. As server-based telecom architecture spreads, product-form demand should keep shifting from fixed board integration toward more flexible memory arrangements within the DRAM for networking and telecom equipment market. That change should be gradual, but it clearly favors vendors that understand both industrial module design and carrier procurement discipline.

Complete Report Scope:

• By Type
  • SDRAM
  • DDR
  • DDR2
  • DDR3
  • DDR4
  • DDR5
• By Product Form
  • DRAM IC (Discrete Chips)
  • DRAM Modules
    • UDIMM
    • RDIMM/LRDIMM
• By Form Factor
  • Embedded DRAM
  • Memory Modules
• By Functionality
  • Standard DRAM
  • Low-Power DRAM
• By Geography
  • North America
  • Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • Rest of the World

Geography Analysis

Asia-Pacific held 48.2% of the DRAM for networking and telecom equipment market share in 2025, and it is also expected to post the fastest 11.3% CAGR through 2031. The region combines a strong manufacturing base with large-scale telecom network rollouts, which keeps supply and demand closely linked inside the DRAM for networking and telecom equipment market. South Korea remains central because Samsung and SK Hynix continue to anchor regional memory supply for carrier and edge hardware with broad product portfolios and active technology roadmaps. Japan also adds demand depth, and KDDI's 2026 rollout of distributed, disaggregated backbone routers shows how advanced carrier upgrades are increasing per-node memory requirements across backbone infrastructure. This combination of local production strength and active network modernization keeps Asia-Pacific at the center of the DRAM for networking and telecom equipment market over the full forecast period.

North America remained the second-largest regional market, supported by AI-ready network investments and ongoing interest in software-driven telecom architecture that requires denser, faster memory configurations. The region also matters because supply resilience has become a strategic issue for operators and equipment makers that do not want memory allocation risk to delay network rollouts. Micron's 2026 DDR5 RDIMM sampling and LPDRAM SOCAMM2 launch show that North America remains important in product development for infrastructure memory serving networking and edge platforms. Export control discussions and supply continuity concerns are also making regional procurement planning more cautious, which increases the value of long-term supplier relationships in the DRAM for networking and telecom equipment market.

Europe and the rest of the world remained smaller positions in 2025, but both still matter to the DRAM for networking and telecom equipment market as 5G coverage and enterprise network upgrades continue. European demand is supported by carrier modernization and by large telecom equipment ecosystems that need long-life, qualified memory components rather than short-cycle commodity supply. In the rest of the world, deployments are earlier in the cycle, so demand is more closely tied to cost, supply timing, and project sequencing than to immediate volume scale. That leaves these regions as medium-term opportunities for the DRAM for networking and telecom equipment market, especially as modular and lower-power configurations become easier to qualify and deploy in distributed network settings.

1. Samsung Electronics Co., Ltd.
2. SK Hynix Inc.
3. Micron Technology, Inc.
4. Nanya Technology Corporation
5. Winbond Electronics Corporation
6. Etron Technology, Inc.
7. Kingston Technology Company, Inc.
8. Transcend Information, Inc.
9. Kingston Technology Corporation
10. Integrated Silicon Solution Inc.
11. Powerchip Technology Corporation
12. ATP Electronics, Inc.
13. AP Memory Technology Corporation
14. GigaDevice Semiconductor Inc.
15. Elite Semiconductor Microelectronics Technology Inc.
16. ProMOS Technologies Inc.
17. Adata Technology Co., Ltd.
18. Team Group Inc.
19. Apacer Technology Inc.
20. Innodisk Corporation
21. Smart Modular Technologies, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Growing 5G and Advanced Network Rollouts
  • 4.2.2 Rising Memory Density Requirements in Routers and Switches
  • 4.2.3 DDR5 Transition in Telecom Infrastructure Platforms
  • 4.2.4 AI-Driven Edge and Micro Data Center Expansion
  • 4.2.5 Power Efficiency Pressure in Network Equipment Design
  • 4.2.6 CXL and Memory Pooling for Telecom Edge Architectures
• 4.3 Market Restraints
  • 4.3.1 Supply Prioritization Toward HBM and AI Servers
  • 4.3.2 Long Qualification Cycles for Carrier-Grade Memory
  • 4.3.3 Legacy DDR4 Installed Base Delaying Migration Cycles
  • 4.3.4 Export Controls and Supply Chain Concentration Risk
• 4.4 Industry Supply Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Type
  • 5.1.1 SDRAM
  • 5.1.2 DDR
  • 5.1.3 DDR2
  • 5.1.4 DDR3
  • 5.1.5 DDR4
  • 5.1.6 DDR5
• 5.2 By Product Form
  • 5.2.1 DRAM IC (Discrete Chips)
  • 5.2.2 DRAM Modules
    • 5.2.2.1 UDIMM
    • 5.2.2.2 RDIMM/LRDIMM
• 5.3 By Form Factor
  • 5.3.1 Embedded DRAM
  • 5.3.2 Memory Modules
• 5.4 By Functionality
  • 5.4.1 Standard DRAM
  • 5.4.2 Low-Power DRAM
• 5.5 By Geography
  • 5.5.1 North America
  • 5.5.2 Europe
  • 5.5.3 Asia-Pacific
    • 5.5.3.1 China
    • 5.5.3.2 Japan
    • 5.5.3.3 South Korea
    • 5.5.3.4 Taiwan
    • 5.5.3.5 Rest of Asia-Pacific
  • 5.5.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
  • 6.4.1 Samsung Electronics Co., Ltd.
  • 6.4.2 SK Hynix Inc.
  • 6.4.3 Micron Technology, Inc.
  • 6.4.4 Nanya Technology Corporation
  • 6.4.5 Winbond Electronics Corporation
  • 6.4.6 Etron Technology, Inc.
  • 6.4.7 Kingston Technology Company, Inc.
  • 6.4.8 Transcend Information, Inc.
  • 6.4.9 Kingston Technology Corporation
  • 6.4.10 Integrated Silicon Solution Inc.
  • 6.4.11 Powerchip Technology Corporation
  • 6.4.12 ATP Electronics, Inc.
  • 6.4.13 AP Memory Technology Corporation
  • 6.4.14 GigaDevice Semiconductor Inc.
  • 6.4.15 Elite Semiconductor Microelectronics Technology Inc.
  • 6.4.16 ProMOS Technologies Inc.
  • 6.4.17 Adata Technology Co., Ltd.
  • 6.4.18 Team Group Inc.
  • 6.4.19 Apacer Technology Inc.
  • 6.4.20 Innodisk Corporation
  • 6.4.21 Smart Modular Technologies, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment