AI 컴퓨팅 하드웨어 시장 : 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the AI computing hardware market size is expected to increase from USD 43.41 billion in 2025 to USD 47.43 billion in 2026 and reach USD 77.55 billion by 2031, growing at a CAGR of 10.33% over 2026-2031.

This report is Segmented by Compute Silicon Type (GPU Accelerators, and More), System Form Factor (AI Servers, Accelerator Cards and Modules, and More), Deployment Location (Cloud Data Centers, and More), Workload Type (Training, Inference, and More), End-User Industry (Hyperscale's and Cloud Service Providers, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global AI Computing Hardware Market Trends and Insights

Hyperscaler AI Infrastructure Capex Expansion Fuels Accelerator Demand

Hyperscaler capital programs continue to scale, with aggregate outlays crossing into the hundreds of billions for 2026 and growing year on year in the mid-thirties percent range. Momentum is centered on AI-specific infrastructure that includes servers with accelerators, high-speed networking fabrics, and liquid-cooled rack designs that sustain higher density per rack. Mega-deployments that commit to multi-gigawatt system footprints further validate the scale and durability of operator demand across training and inference use cases. Strategic alliances between platform vendors also concentrate investment in integrated solutions, including CPU platform collaborations that streamline scale-out deployments in AI clusters. Broadening adoption of liquid cooling and rack-scale assemblies reduces deployment friction by pre-integrating thermal and power subsystems for high-TDP accelerators. The AI computing hardware market benefits from this acceleration in capital spending, as it transitions from pilot projects to scaled production footprints across multiple regions.

Inference Workload Shift Redefines Data Center Economics

The balance of compute cycles is shifting toward inference, which drives recurring consumption patterns and turns serving performance into the central design constraint for fleets. This change favors accelerators and systems tuned for cost per token, low latency, and efficient memory hierarchies, which differs from training-optimized profiles. Memory footprints and bandwidth become critical for rapid token generation, and new memory modules that shorten time to first token reinforce the value of memory-rich designs in production environments. The need to place inference closer to users also increases the attractiveness of smaller, regional deployments that balance latency and power availability without compromising reliability. Operator strategies now prioritize consistent rollouts of inference-capable capacity alongside training clusters to serve steady workloads. The AI computing hardware market reflects these priorities in both silicon roadmaps and integrated rack offerings that consolidate compute, memory, networking, and cooling.

Power and Grid Constraints Throttle Deployment Velocity

Power availability and interconnection timelines shape where and how operators deploy AI capacity, and constraints in key metros are extending commissioning schedules for large campuses. To manage higher density and sustained load profiles, operators adopt liquid cooling and modular power architectures that align with higher-TDP accelerator roadmaps. Networking innovations such as co-packaged optics also help reduce the power penalty per bit, which indirectly eases facility-scale energy budgets at the margins. These measures do not remove siting challenges, yet they improve the performance-per-watt envelope for both training and inference clusters. The AI computing hardware market is therefore sensitive to regional grid dynamics and seeks standardization around integrated, liquid-cooled racks to ensure consistent thermal and electrical behavior. Large offtake commitments by AI platform leaders signal that long-term capacity planning is underway to mitigate grid bottlenecks through diversified siting and staged buildouts.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid GPU and Rack-Scale Product Cadence Compresses Refresh Cycles
2. Accelerated Server Architectures Dominate AI Infrastructure Spending
3. HBM and Advanced Packaging Supply Chain Bottlenecks Constrain Scaling

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

GPU accelerators are expected to account for the largest share in 2025 at 64%, supported by mature software stacks and trained engineering talent that keep switching costs high. AI ASICs post the fastest growth at a 10.6% CAGR through 2031 as large operators prioritize per-token efficiency and tighter workload alignment for production inference. Across the AI computing hardware market, hyperscaler-designed chips reduce reliance on merchant silicon and support optimization of power, memory, and networking at rack scale. FPGAs remain relevant at the edge for deterministic latency and field reconfigurability in safety and automation settings. NPUs embedded in client devices address privacy and latency for on-device tasks within tighter thermal and power budgets. CPUs continue to anchor control-plane duties, storage orchestration, and general-purpose tasks while handing heavy matrix workloads to attached accelerators.

ASIC momentum and GPU incumbency coexist as software ecosystems, with developer familiarity and vendor toolchains continuing to influence platform decisions. Interoperability standards in fabrics and networks have become important differentiators as buyers weigh vendor lock-in against cost, availability, and performance. The AI computing hardware market is also seeing interest in emerging architectures such as neuromorphic and photonic processors, though these efforts remain nascent. For memory-intensive inference, product choices emphasize high-bandwidth memory capacity and memory bandwidth to sustain throughput. As a result, platform selection now balances peak compute against memory, networking, and thermal characteristics that are relevant to real-time serving. AI accelerators from leading vendors anchor these decisions within rack-scale blueprints that unify compute, fabric, and cooling.

AI servers held the dominant 2025 share at 78%, and integrated rack-scale solutions record the fastest growth at a 10.7% CAGR. GPU refresh cadence, memory requirements, and thermal envelopes push operators toward pre-integrated racks that deliver predictable performance and simplify commissioning in liquid-cooled environments. In 2025 to 2026, multiple vendors advanced rack-scale platforms that consolidate accelerators, networking, and cooling into standardized building blocks to streamline capacity additions. This approach reduces integration risk while aligning with site-level electrical and mechanical constraints. Within the AI computing hardware market, rack-level architectures also improve serviceability and reduce cabling complexity relative to bespoke system combinations.

Accelerator cards and modules remain important for retrofits and incremental upgrades in facilities that have yet to migrate to high-density racks. Edge devices and gateways fill latency-sensitive roles where low power budgets and compact footprints are essential. The AI computing hardware market benefits from vendor ecosystems that include reference designs, validated fabrics, and cooling solutions tuned to rack-level operation. As these platforms mature, purchasers value interoperability and standards participation that protect long-lived deployments. Vendors are pairing silicon roadmaps with liquid cooling and fabric strategies to ensure predictable performance across product generations. Co-packaged optics will play a growing role in top-of-rack and spine layers as data rates increase and operators focus on power per bit.

Complete Report Scope:

• By Compute Silicon Type
  • GPU Accelerators
  • AI ASICs
  • FPGAs
  • CPUs
  • NPUs (Edge)
  • Other Compute Silicon Types
• By System Form Factor
  • AI Servers
  • Accelerator Cards and Modules (PCIe, OAM, SXM)
  • Integrated Systems and Appliances
  • Edge Devices and Gateways
  • Other System Form Factors
• By Deployment Location
  • Cloud Data Centers
  • Enterprise and On-Premises Data Centers
  • Edge and Endpoint
  • Other Deployment Locations
• By Workload Type
  • Training
  • Inference
  • Other Workload Types
• By End-user Industry
  • Hyperscalers and Cloud Service Providers
  • Technology and Internet Companies
  • Financial Services
  • Healthcare and Life Sciences
  • Automotive and Manufacturing
  • Telecommunications
  • Retail and Consumer
  • Public Sector
  • Other End-user Industries
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Chile
    • Rest of South America
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Netherlands
    • Russia
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Australia
    • Singapore
    • Taiwan
    • Rest of Asia-Pacific
  • Middle East
    • United Arab Emirates
    • Saudi Arabia
    • Turkey
    • Israel
    • Rest of Middle East
  • Africa
    • South Africa
    • Egypt
    • Nigeria
    • Rest of Africa

Geography Analysis

North America accounts for a 35.7% revenue share in 2025 as global hyperscalers concentrate headquarters, platform engineering, and advanced design partnerships in the region. Asia-Pacific posts the fastest expansion at an 11.0% CAGR through 2031 as sovereign cloud initiatives and regional digital services increase local compute footprints. Within the AI computing hardware market, North American growth is tempered by power and interconnection constraints in several Tier 1 metros, prompting diversification to adjacent markets. Europe balances data residency and power availability, and operators distribute deployments across regions that can provide land, grid capacity, and renewable sourcing. The Middle East continues to invest in large-scale AI infrastructure that complements Western technology stacks.

Export controls shape sourcing and deployment decisions along the U.S.-China corridor, which introduces planning complexity for cross-border capacity allocation and chip availability. Operators respond by staging multi-region builds and by pursuing longer-term procurement commitments for accelerators and components. In Asia-Pacific, growing demand for regional model serving reinforces investments in edge sites that balance latency and power access. The AI computing hardware market therefore expands through a distributed footprint that segments training and serving across facility classes. Partnerships that secure large system deployments illustrate the region-wide scale of future buildouts across training and inference. In aggregate, regional strategies converge on liquid-cooled rack-scale systems and high-speed fabrics to sustain rapid growth.

1. NVIDIA Corporation
2. Advanced Micro Devices, Inc.
3. Intel Corporation
4. Huawei Technologies Co., Ltd.
5. International Business Machines Corporation
6. Dell Technologies Inc.
7. Hewlett Packard Enterprise Company
8. Super Micro Computer, Inc.
9. Lenovo Group Limited
10. Inspur Electronic Information Industry Co., Ltd.
11. Amazon.com, Inc.
12. Google LLC
13. Microsoft Corporation
14. Baidu, Inc.
15. Alibaba Group Holding Limited
16. Tencent Holdings Limited
17. Cerebras Systems Inc.
18. Graphcore Limited
19. Tenstorrent, Inc.
20. Groq, Inc.
21. SambaNova Systems, Inc.
22. Qualcomm Incorporated
23. Arm Holdings plc
24. Ampere Computing LLC

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Hyperscaler AI Infrastructure Capex Expansion
  • 4.2.2 Shift From Training To Inference Increases Compute Volume
  • 4.2.3 Rapid Product Cadence In High-End AI GPUs and Rack-Scale Systems
  • 4.2.4 Accelerated Servers Dominate AI Infrastructure Spending
  • 4.2.5 Co-Packaged Optics Adoption For High-Bandwidth Interconnects
  • 4.2.6 Liquid Cooling Penetration Unlocks Higher-TDP AI Systems
• 4.3 Market Restraints
  • 4.3.1 Power and Grid Constraints For AI Data Centers
  • 4.3.2 Supply Constraints In HBM and Advanced Packaging
  • 4.3.3 Export Controls and Tech Fragmentation
  • 4.3.4 Serviceability and Ecosystem Complexity For Advanced Cooling
• 4.4 Industry Value / Supply-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Impact of Macroeconomic Factors on the Market
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Suppliers
  • 4.8.3 Bargaining Power of Buyers
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Industry Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (Value and Volume)

• 5.1 By Compute Silicon Type
  • 5.1.1 GPU Accelerators
  • 5.1.2 AI ASICs
  • 5.1.3 FPGAs
  • 5.1.4 CPUs
  • 5.1.5 NPUs (Edge)
  • 5.1.6 Other Compute Silicon Types
• 5.2 By System Form Factor
  • 5.2.1 AI Servers
  • 5.2.2 Accelerator Cards and Modules (PCIe, OAM, SXM)
  • 5.2.3 Integrated Systems and Appliances
  • 5.2.4 Edge Devices and Gateways
  • 5.2.5 Other System Form Factors
• 5.3 By Deployment Location
  • 5.3.1 Cloud Data Centers
  • 5.3.2 Enterprise and On-Premises Data Centers
  • 5.3.3 Edge and Endpoint
  • 5.3.4 Other Deployment Locations
• 5.4 By Workload Type
  • 5.4.1 Training
  • 5.4.2 Inference
  • 5.4.3 Other Workload Types
• 5.5 By End-user Industry
  • 5.5.1 Hyperscalers and Cloud Service Providers
  • 5.5.2 Technology and Internet Companies
  • 5.5.3 Financial Services
  • 5.5.4 Healthcare and Life Sciences
  • 5.5.5 Automotive and Manufacturing
  • 5.5.6 Telecommunications
  • 5.5.7 Retail and Consumer
  • 5.5.8 Public Sector
  • 5.5.9 Other End-user Industries
• 5.6 By Geography
  • 5.6.1 North America
    • 5.6.1.1 United States
    • 5.6.1.2 Canada
    • 5.6.1.3 Mexico
  • 5.6.2 South America
    • 5.6.2.1 Brazil
    • 5.6.2.2 Argentina
    • 5.6.2.3 Chile
    • 5.6.2.4 Rest of South America
  • 5.6.3 Europe
    • 5.6.3.1 Germany
    • 5.6.3.2 United Kingdom
    • 5.6.3.3 France
    • 5.6.3.4 Italy
    • 5.6.3.5 Spain
    • 5.6.3.6 Netherlands
    • 5.6.3.7 Russia
    • 5.6.3.8 Rest of Europe
  • 5.6.4 Asia-Pacific
    • 5.6.4.1 China
    • 5.6.4.2 Japan
    • 5.6.4.3 South Korea
    • 5.6.4.4 India
    • 5.6.4.5 Australia
    • 5.6.4.6 Singapore
    • 5.6.4.7 Taiwan
    • 5.6.4.8 Rest of Asia-Pacific
  • 5.6.5 Middle East
    • 5.6.5.1 United Arab Emirates
    • 5.6.5.2 Saudi Arabia
    • 5.6.5.3 Turkey
    • 5.6.5.4 Israel
    • 5.6.5.5 Rest of Middle East
  • 5.6.6 Africa
    • 5.6.6.1 South Africa
    • 5.6.6.2 Egypt
    • 5.6.6.3 Nigeria
    • 5.6.6.4 Rest of Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles
  • 6.4.1 NVIDIA Corporation
  • 6.4.2 Advanced Micro Devices, Inc.
  • 6.4.3 Intel Corporation
  • 6.4.4 Huawei Technologies Co., Ltd.
  • 6.4.5 International Business Machines Corporation
  • 6.4.6 Dell Technologies Inc.
  • 6.4.7 Hewlett Packard Enterprise Company
  • 6.4.8 Super Micro Computer, Inc.
  • 6.4.9 Lenovo Group Limited
  • 6.4.10 Inspur Electronic Information Industry Co., Ltd.
  • 6.4.11 Amazon.com, Inc.
  • 6.4.12 Google LLC
  • 6.4.13 Microsoft Corporation
  • 6.4.14 Baidu, Inc.
  • 6.4.15 Alibaba Group Holding Limited
  • 6.4.16 Tencent Holdings Limited
  • 6.4.17 Cerebras Systems Inc.
  • 6.4.18 Graphcore Limited
  • 6.4.19 Tenstorrent, Inc.
  • 6.4.20 Groq, Inc.
  • 6.4.21 SambaNova Systems, Inc.
  • 6.4.22 Qualcomm Incorporated
  • 6.4.23 Arm Holdings plc
  • 6.4.24 Ampere Computing LLC

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and unmet-need assessment