아시아태평양의 반도체 재료 시장 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the Asia-Pacific semiconductor materials market size is expected to grow from USD 27.10 billion in 2025 to USD 27.99 billion in 2026 and is forecast to reach USD 32.87 billion by 2031 at 3.27% CAGR over 2026-2031.

This report is Segmented by Material (Silicon Wafers, Silicon Carbide, Gallium Arsenide, and More), Application (Fabrication [Process Chemicals, Photomasks], and More), Packaging (Substrates, Lead Frames, and More), End-User Industry (Consumer Electronics, Telecommunication and 5G Infrastructure, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Asia-Pacific Semiconductor Materials Market Trends and Insights

Government-backed Chip Sovereignty Funds Accelerating New Material Fabs in China, Japan and Korea

Several Northeast-Asian governments are using dedicated chip funds to subsidize local material plants, shortening qualification cycles and lifting regional content in leading-edge fabs. In Korea, a USD 471 billion cluster in Gyeonggi Province targets 50% self-sufficiency in critical chemistries by 2030. Japan is tying TSMC's Kumamoto expansion to joint R&D programs with domestic photoresist and wafer suppliers, while China is channeling capital toward indigenous CMP slurries, electronic gases and fluorochemicals. These coordinated investments underpin steady demand even during cyclical downturns, giving the Asia-Pacific semiconductor materials market a structural growth floor.

Surge in SiC and GaN Adoption for EV Powertrains Across China and Japan

Electric-vehicle makers are shifting from silicon MOSFETs to SiC and GaN power devices to cut conduction losses and boost driving range. Chinese vertically integrated substrate pioneers have begun supplying 200 mm SiC wafers that meet automotive-grade defect density thresholds, helping local OEMs lock-in long-term contracts. Japanese material houses are parallel-tracking crystalline-quality improvements for GaN-on-Si epitaxy to serve on-board chargers. This transition is tilting material demand toward wide-bandgap substrates, epitaxial gases and high-temperature encapsulants, broadening the Asia-Pacific semiconductor materials market beyond its silicon core.

Volatile Silicon and Rare-Metal Prices Squeezing Fab Margins

Spot silicon-wafers and crucible-grade quartz have exhibited double-digit price swings amid tight supply chains concentrated in a handful of mines. Parallel spikes in gallium and germanium prices, following export-license restrictions, are forcing fabs to re-negotiate long-term contracts and hedge commodity exposure. Because material outlays can represent 25-30% of wafer-fabrication cash costs, these fluctuations compress profitability and temper expansion plans, keeping the Asia-Pacific semiconductor materials market on a cautious capital-expenditure footing.

Other drivers and restraints analyzed in the detailed report include:

1. Mini/Micro-LED Ramp-up Driving Demand for High-Purity Metal-Organics in Korea and Taiwan
2. ASEAN Re-shoring Initiatives Creating Green-field Chemical Plants for Backend Materials
3. US/EU Export Controls Delaying Material Qualification in Mainland China

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Silicon Wafers retained the largest 37.74% share of the Asia-Pacific semiconductor materials market in 2025, supported by capacity additions at 5 nm and 3 nm nodes. Yet Silicon Carbide is the clear growth engine, expanding at 9.08% CAGR as vehicle electrification and renewable grids demand high-voltage efficiency. This shift is enlarging the Asia-Pacific semiconductor materials market size for wide-bandgap substrates, gases and polishing slurries that meet stringent surface-defect criteria. GaN and GaAs materials are also gaining traction for 5G base-stations and RF front-ends, even though substrate costs remain a cap on volume adoption.

Process innovation is bringing 200 mm SiC wafers to pilot scale, with defect densities below 0.1 cm-2 setting new automotive benchmarks. At the same time, the Korea Research Institute of Chemical Technology's breakthrough in hydrofluoroether synthesis improves local supply security for advanced etch chemistries. As these technical milestones reduce unit costs and raise reliability, they reinforce a performance-over-price paradigm that re-shapes procurement decisions within the Asia-Pacific semiconductor materials market.

Complete Report Scope:

• By Material
  • Silicon Wafers
  • Silicon Carbide (SiC)
  • Gallium Arsenide (GaAs)
  • Gallium Nitride (GaN)
  • Silicon Germanium (SiGe)
  • Indium Phosphide (InP)
  • Copper Indium Gallium Selenide (CIGS)
  • Molybdenum Disulfide (MoS?)
  • Bismuth Telluride (Bi?Te?)
  • Other Materials
• By Application
  • Fabrication
    • Process Chemicals
    • Photomasks
    • Electronic Gases
    • Photoresist Ancillaries
    • Sputtering Targets
    • Silicon Wafers
    • CMP Slurries and Pads
    • Other Fabrication Materials
  • Packaging
    • Substrates
    • Lead Frames
    • Ceramic Packages
    • Bonding Wire
    • Encapsulation Resins
    • Die-Attach Materials
    • Other Packaging Materials
• By End-user Industry
  • Consumer Electronics
  • Telecommunication and 5G Infrastructure
  • Industrial and Manufacturing Automation
  • Automotive and Mobility (EV, ADAS)
  • Energy and Utility (Solar, Power Conversion)
  • Data Centers and HPC
  • Healthcare Devices
  • Others
• By Geography
  • Taiwan
  • South Korea
  • China
  • Japan
  • Rest of Asia-Pacific

List of Companies Covered in this Report:

1. Shin-Etsu Chemical Co., Ltd.
2. Showa Denko Materials Co., Ltd.
3. Sumitomo Chemical Co., Ltd.
4. Merck KGaA (incl. Versum Materials)
5. Air Liquide S.A.
6. BASF SE
7. LG Chem Ltd.
8. Indium Corporation
9. Kyocera Corporation
10. Henkel AG and Co. KGaA
11. Dow Inc.
12. JSR Corporation
13. TOK (Tokyo Ohka Kogyo)
14. DuPont de Nemours, Inc.
15. Entegris, Inc.
16. Linde plc
17. SK Materials Co., Ltd.
18. Toppan Photomask Co., Ltd.
19. UTAC Holdings Ltd.
20. Resonac
21. Fujmi Corporation
22. Mitsubishi Chemical Group Corp.
23. Air Products and Chemicals, Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Government-backed Chip Sovereignty Funds Accelerating New Material Fabs in China, Japan and Korea
  • 4.2.2 Surge in SiC and GaN Adoption for EV Powertrains Across China and Japan
  • 4.2.3 Mini/Micro-LED Ramp-up Driving Demand for High-Purity Metal-Organics in Korea and Taiwan
  • 4.2.4 ASEAN Re-shoring Initiatives Creating Green-field Chemical Plants for Backend Materials
  • 4.2.5 Low-GWP Fluorinated Gas Mandates Boosting Replacement Chemistries
  • 4.2.6 Heterogeneous Integration (2.5D/3D IC) Needs Novel Under-fill and Substrate Materials
• 4.3 Market Restraints
  • 4.3.1 Volatile Silicon and Rare-Metal Prices Squeezing Fab Margins
  • 4.3.2 US/EU Export Controls Delaying Material Qualification in Mainland China
  • 4.3.3 Ultrapure-Water Scarcity in Taiwan and Singapore Hindering capacity Adds
  • 4.3.4 Lengthy EHS Permitting for Chemical Plants in Korea
• 4.4 Industry Ecosystem Analysis
• 4.5 Technological Outlook
  • 4.5.1 Heterogeneous Integration and Back-side Power Delivery
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Buyers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Threat of Substitutes
  • 4.6.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUES)

• 5.1 By Material
  • 5.1.1 Silicon Wafers
  • 5.1.2 Silicon Carbide (SiC)
  • 5.1.3 Gallium Arsenide (GaAs)
  • 5.1.4 Gallium Nitride (GaN)
  • 5.1.5 Silicon Germanium (SiGe)
  • 5.1.6 Indium Phosphide (InP)
  • 5.1.7 Copper Indium Gallium Selenide (CIGS)
  • 5.1.8 Molybdenum Disulfide (MoS?)
  • 5.1.9 Bismuth Telluride (Bi?Te?)
  • 5.1.10 Other Materials
• 5.2 By Application
  • 5.2.1 Fabrication
    • 5.2.1.1 Process Chemicals
    • 5.2.1.2 Photomasks
    • 5.2.1.3 Electronic Gases
    • 5.2.1.4 Photoresist Ancillaries
    • 5.2.1.5 Sputtering Targets
    • 5.2.1.6 Silicon Wafers
    • 5.2.1.7 CMP Slurries and Pads
    • 5.2.1.8 Other Fabrication Materials
  • 5.2.2 Packaging
    • 5.2.2.1 Substrates
    • 5.2.2.2 Lead Frames
    • 5.2.2.3 Ceramic Packages
    • 5.2.2.4 Bonding Wire
    • 5.2.2.5 Encapsulation Resins
    • 5.2.2.6 Die-Attach Materials
    • 5.2.2.7 Other Packaging Materials
• 5.3 By End-user Industry
  • 5.3.1 Consumer Electronics
  • 5.3.2 Telecommunication and 5G Infrastructure
  • 5.3.3 Industrial and Manufacturing Automation
  • 5.3.4 Automotive and Mobility (EV, ADAS)
  • 5.3.5 Energy and Utility (Solar, Power Conversion)
  • 5.3.6 Data Centers and HPC
  • 5.3.7 Healthcare Devices
  • 5.3.8 Others
• 5.4 By Geography
  • 5.4.1 Taiwan
  • 5.4.2 South Korea
  • 5.4.3 China
  • 5.4.4 Japan
  • 5.4.5 Rest of Asia-Pacific

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves (M&A, JVs, capacity Expansions)
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Overview, Market Level Overview, Core Segments, Financials, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Shin-Etsu Chemical Co., Ltd.
  • 6.4.2 Showa Denko Materials Co., Ltd.
  • 6.4.3 Sumitomo Chemical Co., Ltd.
  • 6.4.4 Merck KGaA (incl. Versum Materials)
  • 6.4.5 Air Liquide S.A.
  • 6.4.6 BASF SE
  • 6.4.7 LG Chem Ltd.
  • 6.4.8 Indium Corporation
  • 6.4.9 Kyocera Corporation
  • 6.4.10 Henkel AG and Co. KGaA
  • 6.4.11 Dow Inc.
  • 6.4.12 JSR Corporation
  • 6.4.13 TOK (Tokyo Ohka Kogyo)
  • 6.4.14 DuPont de Nemours, Inc.
  • 6.4.15 Entegris, Inc.
  • 6.4.16 Linde plc
  • 6.4.17 SK Materials Co., Ltd.
  • 6.4.18 Toppan Photomask Co., Ltd.
  • 6.4.19 UTAC Holdings Ltd.
  • 6.4.20 Resonac
  • 6.4.21 Fujmi Corporation
  • 6.4.22 Mitsubishi Chemical Group Corp.
  • 6.4.23 Air Products and Chemicals, Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-Need Assessment