중국의 집적회로(IC) : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the China integrated circuit market size is expected to grow from USD 216.87 billion in 2025 to USD 237.99 billion in 2026 and is forecast to reach USD 378.84 billion by 2031 at 9.74% CAGR over 2026-2031.

This report is Segmented by Type (Analog IC [General-Purpose IC, Application-Specific IC], and More), Wafer Size (= 200 Mm, 300 Mm, 450 Mm), Process Node (= 65 Nm (Legacy), 45/40 Nm, and More), Design Ownership (Fabless, IDM, Pure-Play Foundry), Application (Consumer Electronics, Automotive, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

China Integrated Circuit (IC) Market Trends and Insights

National Semiconductor Fund Phase III Driving Fab Capacity Expansion

The USD 47.5 billion third-phase Big Fund channels capital directly into high-bandwidth memory and advanced DRAM projects. With the Ministry of Finance holding 17.44%, close oversight ensures alignment with national technology goals. YMTC has already lifted output to 500,000 3D NAND wafers per month, fortifying China's position in premium storage devices. Mature-node expansions that underpin automotive and industrial chips receive priority funding, bridging immediate shortfalls caused by import restrictions. The program's structure ties milestone financing to capacity targets, narrowing gaps with leading overseas manufacturers and stimulating local toolmakers. Collectively, these initiatives quicken the scale-up of domestic fabs and firm long-term supply security across the China integrated circuit market.

EV and NEV Policy Push Boosting Demand for Automotive-grade ICs

China sold 11 million electric vehicles in 2024, equal to nearly half of national car sales. Aggressive purchase subsidies and dual-credit mandates translate into surging orders for power management ICs, SiC modules, and automotive microcontrollers. BYD Semiconductor's power module share hit 28.9% in 2023 as the company vertically integrated silicon carbide and IGBT lines into its EV stack. With the automotive IC pool forecast at USD 23 billion in 2025, local foundries are tailoring 28 nm and 16 nm processes for functional safety compliance. Partnerships between carmakers and chip designers deepen, accelerating qualification cycles and fostering an ecosystem that anchors future mobility electronics inside the China integrated circuit market.

Restricted Access to EUV Lithography Tools

Export controls bar Chinese fabs from purchasing ASML's EUV scanners, stalling mass-production economics below 7 nm. SMIC has replicated 7 nm logic using multi-patterned DUV, yet higher mask counts raise cost and reduce yield. Stricter Dutch and Japanese licensing rules, effective April 2025, deepen the bottleneck. This restraint pushes domestic R&D toward indigenous lithography but widens the cost gap with rivals leveraging full EUV. High-performance computing segments therefore, lean on advanced packaging and chiplet approaches to bridge performance shortfalls while policymakers negotiate for partial exemption

Other drivers and restraints analyzed in the detailed report include:

1. Hyperscale AI/Cloud Build-outs Creating Custom Accelerator Demand
2. Made-in-China IoT Deployments in "Digital Workshop" Manufacturing
3. Acute Shortage of Senior IC Design and Process Engineers

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Memory devices accounted for 35.02% of China integrated circuit market share in 2025 on the back of YMTC's 3D NAND ramp-up and CXMT's DDR5 debut. The China integrated circuit market size tied to memory is set to expand steadily as the Big Fund channels billions into high-bandwidth memory lines. Logic ICs, however, are poised for a 9.55% CAGR as AI inference, autonomous driving domains, and edge computing broaden demand for performance-dense SoCs.

The mixed-signal subset posts healthy gains because converged analog-digital architectures are critical for automotive sensors and industrial controls. Analog ICs remain indispensable in high-reliability sectors, giving local fabs with 180 nm and 90 nm assets enduring relevance. Micro IC demand accelerates alongside IoT proliferation, where domestic CPU players such as Loongson offer non-ARM alternatives that further localize the stack.

The 300 mm format generated 71.45% of national revenue in 2025 as SMIC, Hua Hong, and several JV fabs maxed out capacity. These lines underpin most advanced logic, memory, and RF shipments and provide the cost base from which the China integrated circuit market scales. A nascent 450 mm pilot, projected to grow 13.22% CAGR, demonstrates China's willingness to leapfrog international hesitation and secure long-term manufacturing edge.

Older <=200 mm fabs sustain niche analog, power, and display-driver production. Government incentives permit selective modernization of 200 mm equipment to safeguard domestic supply of specialty nodes. This tiered wafer-size landscape creates flexibility, allowing manufacturers to balance capex risk while meeting differentiated product portfolios.

Complete Report Scope:

• By Type
  • Analog IC
    • General-purpose IC
    • Application-specific IC
  • Logic IC
    • TTL
    • CMOS
    • Mixed-Signal IC
  • Memory IC
    • DRAM
    • NAND/NOR Flash
    • Other Memories (SRAM, EEPROM)
  • Micro IC
    • Microprocessors (MPU)
    • Microcontrollers (MCU)
    • Digital Signal Processors
• By Wafer Size
  • = 200 mm
  • 300 mm
  • 450 mm (Pilot)
• By Process Node
  • = 65 nm (Legacy)
  • 45/40 nm
  • 28 nm
  • 16/14 nm
  • 10/7 nm
• By Design Ownership
  • Fabless
  • IDM
  • Pure-play Foundry
• By Application
  • Consumer Electronics
  • Automotive
  • IT and Telecommunications
  • Industrial and Automation
  • Other Applications
• By Geography
  • East China (Shanghai, Jiangsu, Zhejiang)
  • South-Central China (Guangdong, Hunan, Hubei)
  • North China (Beijing, Tianjin, Hebei)
  • Northeast China (Liaoning, Jilin, Heilongjiang)
  • Southwest China (Sichuan, Chongqing, Yunnan)
  • Northwest China (Shaanxi, Gansu, Xinjiang)

List of Companies Covered in this Report:

1. Semiconductor Manufacturing International Corp. (SMIC)
2. Hua Hong Semiconductor
3. Yangtze Memory Technologies Co. (YMTC)
4. ChangXin Memory Tech (CXMT)
5. HiSilicon (Huawei)
6. UNISOC
7. Nexperia (Wingtech)
8. GigaDevice Semiconductor
9. Loongson Technology
10. Allwinner Technology
11. SG Micro Corp.
12. JCET Group
13. TongFu Micro-electronics
14. Tianshui Huatian Technology
15. Naura Technology Group (Equipment)
16. Advanced Micro-Fabrication Equipment (AMEC)
17. Sino IC Leasing
18. ASR Microelectronics
19. Rockchip Electronics
20. Empyrean Technology (EDA)

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 National Semiconductor Fund Phase III Driving Fab capacity Expansion
  • 4.2.2 EV and NEV Policy Push Boosting Demand for Automotive-grade ICs
  • 4.2.3 Hyperscale AI/Cloud Build-outs Creating Custom Accelerator Demand
  • 4.2.4 Made-in-China IoT Deployments in "Digital Workshop" Manufacturing
  • 4.2.5 Sanctions-Driven Localization Across Mature-Node Supply Chain
  • 4.2.6 Surge in Domestic 5G Base-Station Build Raising RF and Power IC Orders
• 4.3 Market Restraints
  • 4.3.1 Restricted Access to EUV Lithography Tools
  • 4.3.2 Acute Shortage of Senior IC Design and Process Engineers
  • 4.3.3 Price Erosion from Over-capacity at 28 nm and Above
  • 4.3.4 Persistent IP and Patent-Litigation Risks
• 4.4 Industry Ecosystem Analysis
• 4.5 Technological Outlook
• 4.6 Porter's Five Forces Analysis
  • 4.6.1 Bargaining Power of Suppliers
  • 4.6.2 Bargaining Power of Buyers
  • 4.6.3 Threat of New Entrants
  • 4.6.4 Intensity of Competitive Rivalry
  • 4.6.5 Threat of Substitutes
• 4.7 Investment Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Type
  • 5.1.1 Analog IC
    • 5.1.1.1 General-purpose IC
    • 5.1.1.2 Application-specific IC
  • 5.1.2 Logic IC
    • 5.1.2.1 TTL
    • 5.1.2.2 CMOS
    • 5.1.2.3 Mixed-Signal IC
  • 5.1.3 Memory IC
    • 5.1.3.1 DRAM
    • 5.1.3.2 NAND/NOR Flash
    • 5.1.3.3 Other Memories (SRAM, EEPROM)
  • 5.1.4 Micro IC
    • 5.1.4.1 Microprocessors (MPU)
    • 5.1.4.2 Microcontrollers (MCU)
    • 5.1.4.3 Digital Signal Processors
• 5.2 By Wafer Size
  • 5.2.1 = 200 mm
  • 5.2.2 300 mm
  • 5.2.3 450 mm (Pilot)
• 5.3 By Process Node
  • 5.3.1 = 65 nm (Legacy)
  • 5.3.2 45/40 nm
  • 5.3.3 28 nm
  • 5.3.4 16/14 nm
  • 5.3.5 10/7 nm
• 5.4 By Design Ownership
  • 5.4.1 Fabless
  • 5.4.2 IDM
  • 5.4.3 Pure-play Foundry
• 5.5 By Application
  • 5.5.1 Consumer Electronics
  • 5.5.2 Automotive
  • 5.5.3 IT and Telecommunications
  • 5.5.4 Industrial and Automation
  • 5.5.5 Other Applications
• 5.6 By Geography
  • 5.6.1 East China (Shanghai, Jiangsu, Zhejiang)
  • 5.6.2 South-Central China (Guangdong, Hunan, Hubei)
  • 5.6.3 North China (Beijing, Tianjin, Hebei)
  • 5.6.4 Northeast China (Liaoning, Jilin, Heilongjiang)
  • 5.6.5 Southwest China (Sichuan, Chongqing, Yunnan)
  • 5.6.6 Northwest China (Shaanxi, Gansu, Xinjiang)

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
  • 6.4.1 Semiconductor Manufacturing International Corp. (SMIC)
  • 6.4.2 Hua Hong Semiconductor
  • 6.4.3 Yangtze Memory Technologies Co. (YMTC)
  • 6.4.4 ChangXin Memory Tech (CXMT)
  • 6.4.5 HiSilicon (Huawei)
  • 6.4.6 UNISOC
  • 6.4.7 Nexperia (Wingtech)
  • 6.4.8 GigaDevice Semiconductor
  • 6.4.9 Loongson Technology
  • 6.4.10 Allwinner Technology
  • 6.4.11 SG Micro Corp.
  • 6.4.12 JCET Group
  • 6.4.13 TongFu Micro-electronics
  • 6.4.14 Tianshui Huatian Technology
  • 6.4.15 Naura Technology Group (Equipment)
  • 6.4.16 Advanced Micro-Fabrication Equipment (AMEC)
  • 6.4.17 Sino IC Leasing
  • 6.4.18 ASR Microelectronics
  • 6.4.19 Rockchip Electronics
  • 6.4.20 Empyrean Technology (EDA)

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment