이미지 센서 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the image sensors market size is expected to increase from USD 30.94 billion in 2025 to USD 33.12 billion in 2026 and reach USD 45.54 billion by 2031, growing at a CAGR of 6.58% over 2026-2031.

This report is Segmented by Type (CMOS, and CCD), Processing Technology (FSI, BSI, and Stacked BSI), Shutter Type (Rolling, and Global), Spectrum (Visible, NIR, SWIR, and X-ray/UV), Resolution (Less Than 1 MP, 1-3 MP, 4-12 MP, 13-24 MP, and >=25 MP), End-User (Consumer Electronics, Automotive, Industrial, Security, Healthcare, and More), and Geography. Market Forecasts are Provided in Terms of Value (USD).

Global Image Sensors Market Trends and Insights

Smartphone Multicamera Proliferation Elevating CMOS Demand

Global handset vendors shipped 1.2 billion smartphones with three or more rear cameras in 2025, up 26% year-on-year, as mid-tier models adopted ultra-wide and telephoto modules once reserved for flagships. Competitive pressure compressed the bill of materials, forcing sensor suppliers to spread R&D across massive volumes while conceding lower average selling prices. Vertically integrated players such as Sony and Samsung, with captive wafer capacity and image-signal-processor (ISP) cores, are positioned to sustain profitability. Computational photography further shifts value from optics to pixels; algorithms like Apple Deep Fusion and Google Night Sight rely on high dynamic range and low read noise, placing a premium on stacked BSI chips with on-chip 14-bit converters that deliver 120 dB dynamic range.

Automotive-Grade Global-Shutter Sensors Enabling Level 3+ ADAS

Rolling-shutter artifacts become unacceptable when vehicles travel above 100 km/h, prompting OEMs to switch to global-shutter CMOS for forward-facing and surround-view cameras. Mercedes-Benz certified Drive Pilot Level 3 in Germany and California in 2024 using eight global-shutter devices. ON Semiconductor's Hyperlux platform integrates 3 µm pixels with 140 dB dynamic range, preserving detail in high-contrast scenes. Euro NCAP's 2025 test protocols effectively require pedestrian-detection cameras on all models, accelerating global-shutter penetration.

300 mm CIS Wafer Capacity Bottlenecks Creating Price Volatility

Image sensors consumed 180,000 300 mm wafer starts per month in 2025, yet demand exceeded supply by 8%, inflating automotive-grade sensor prices by 12% in early 2025. Sony allocated JPY 200 billion (USD 1.34 billion) to expand its Kumamoto fab by 40,000 wafers per month, but the additional capacity arrives only in late 2026. Fabless vendors lacking long-term contracts face 16-week lead times and margin pressure.

Other drivers and restraints analyzed in the detailed report include:

1. Edge-AI Vision Modules Catalysing Smart-City Investments
2. SWIR Sensors Penetrating Precision Agriculture and Industrial QC
3. Thermal Noise Limits in Sub-1 µm Pixels Hindering Resolution Race

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CMOS devices captured 93.17% of 2025 revenue, a footprint that cements scale economies and drives the image sensors market share advantage over charge-coupled devices (CCD). CMOS integrates readout, analog-to-digital converters, and even neural accelerators on the same die, trimming assembly cost by 30% and power budgets below 500 mW. CCD held 6.83% share in astronomy, pathology, and medical endoscopy, where its sub-electron read noise outweighs slower frame rates. Scientific CMOS, typified by Sony's IMX661, now delivers 95% quantum efficiency and read noise under 0.3 e-, eroding CCD's niche. SWIR CMOS, while a small subset today, is expanding 7.11% per year as industrial and agricultural applications migrate from silicon CCD to indium-gallium-arsenide photodiodes.

CCD remains the tool of choice for deep-sky observatories seeking 10-hour integrations with minimal dark current. Medical imaging firms prize CCD uniformity for colour-true tissue differentiation. Yet as the image sensors market size for scientific devices shifts to stacked BSI CMOS with sub-0.5 e- noise, CCD volume is forecast to contract. Niche suppliers will survive on bespoke runs, but mainstream handset, automotive, and vision-system buyers will consolidate around advanced CMOS supply chains.

Backside-illuminated technologies owned 44.68% of revenue in 2025. However, stacked BSI is advancing at 7.34% as vendors embed dynamic random-access memory (DRAM) and AI cores under the photodiodes, converting sensors into ultra-low-latency processors. Sony's IMX989 stacks a 45 nm pixel array atop a 28 nm logic die, cutting image-to-display latency from 50 ms to 5 ms and enabling 14-bit HDR capture. Front-side-illuminated CMOS remains in price-sensitive rear-view cameras, where a 15% bill-of-materials saving still outweighs the 40% sensitivity penalty.

The image sensors market size linked to stacked BSI will keep expanding as heterogeneous integration matures. Canon's room-temperature surface-activated bonding raises BSI yields by 12 points while meeting automotive defect thresholds. Although through-silicon-via formation adds process steps and 8% cost, OEMs accept the premium for multi-exposure HDR, per-frame AI inference, and lens aberration correction delivered within a 10 mm-square module.

Complete Report Scope:

• By Type
  • CMOS
  • CCD
• By Processing Technology
  • Front-Side Illuminated (FSI)
  • Back-Side Illuminated (BSI)
  • Stacked BSI
• By Shutter Type
  • Rolling Shutter
  • Global Shutter
• By Spectrum
  • Visible (RGB)
  • Near-Infrared (NIR)
  • Short-Wave Infrared (SWIR)
  • X-ray / Ultraviolet
• By Resolution
  • Less than 1 MP
  • 1 - 3 MP
  • 4 - 12 MP
  • 13 - 24 MP
  • More than Equal to 25 MP
• By End-User Industry
  • Consumer Electronics
  • Automotive and Transportation
  • Industrial Automation and Robotics
  • Security and Surveillance
  • Healthcare and Life Sciences
  • Aerospace and Defense
  • Smart City, Agriculture, Marine
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • Middle East
    • Israel
    • Saudi Arabia
    • United Arab Emirates
    • Turkey
    • Rest of Middle East
  • Africa
    • South Africa
    • Egypt
    • Rest of Africa
  • South America
    • Brazil
    • Argentina
    • Rest of South America

Geography Analysis

Asia-Pacific contributed 44.21% of 2025 revenue and is projected to grow 7.65% CAGR to 2031. China assembled 68% of smartphones and 52% of security cameras, giving local sensor firms a home-field advantage despite export-control headwinds. Japan's Sony and Canon retained half of global premium revenue from stacked BSI and scientific CMOS, while South Korea's Samsung leveraged LPDDR5 memory stacking to break 8K recording barriers.

Europe and North America pooled 38% of revenue. The European Union's General Safety Regulation, effective July 2024, mandates automated emergency braking and lane-keeping assist, lifting camera content. STMicroelectronics and ams OSRAM supply AEC-Q100 sensors that operate from -40 °C to +105 °C, anchoring a defensible European franchise. North American momentum splits between Tesla's 12-camera Full Self-Driving suite and Amazon's 50,000 vision-guided robots.

The Middle East, Africa, and South America captured the remaining 18%. Dubai, Riyadh, and Doha rolled out smart-city edge vision, while Saudi Arabia's NEOM ordered 100,000 AI cameras worth USD 300 million. South Africa's mines deployed thermal imagers on autonomous haul trucks, and Brazil's agribusiness tested SWIR-enabled irrigation. Infrastructure constraints and foreign-exchange volatility temper accelerated uptake, but project-based spikes create localized demand peaks.

1. Sony Group Corp.
2. Samsung Electronics Co., Ltd.
3. OmniVision Technologies, Inc.
4. STMicroelectronics N.V.
5. ON Semiconductor Corporation
6. Canon Inc.
7. Panasonic Holdings Corporation
8. Teledyne DALSA Inc.
9. ams OSRAM AG
10. SK hynix Inc.
11. GalaxyCore Inc.
12. Hamamatsu Photonics K.K.
13. SmartSens Technology
14. PixArt Imaging Inc.
15. Himax Technologies, Inc.
16. Tower Semiconductor Ltd.
17. Teledyne e2v
18. Gpixel Inc.
19. Forza Silicon Corp.
20. Toshiba Electronic Devices and Storage Corp.
21. Pyxalis S.A.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Smartphone Multicamera Proliferation Elevating CMOS Demand
  • 4.2.2 Automotive-Grade Global-Shutter Sensors Enabling Level-3+ ADAS
  • 4.2.3 Edge-AI Vision Modules Catalysing Smart-City Investments
  • 4.2.4 SWIR Sensors Penetrating Precision-Agriculture And Industrial QC
  • 4.2.5 3D/Event-Based Sensors Powering Next-Gen AR/VR Wearables
  • 4.2.6 Government Safety Mandates Driving In-Cabin DMS Cameras
• 4.3 Market Restraints
  • 4.3.1 300 mm CIS Wafer Capacity Bottlenecks Creating Price Volatility
  • 4.3.2 Thermal Noise Limits in Sub-1 µm Pixels Hindering Resolution Race
  • 4.3.3 Export Controls on Advanced Imaging Chips Impacting Chinese OEMs
  • 4.3.4 High Integration Cost of SWIR Sensors Slowing Consumer Uptake
• 4.4 Industry Value-Chain Analysis
• 4.5 Regulatory Outlook
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces Analysis
  • 4.7.1 Bargaining Power of Suppliers
  • 4.7.2 Bargaining Power of Consumers
  • 4.7.3 Threat of New Entrants
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Intensity of Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Type
  • 5.1.1 CMOS
  • 5.1.2 CCD
• 5.2 By Processing Technology
  • 5.2.1 Front-Side Illuminated (FSI)
  • 5.2.2 Back-Side Illuminated (BSI)
  • 5.2.3 Stacked BSI
• 5.3 By Shutter Type
  • 5.3.1 Rolling Shutter
  • 5.3.2 Global Shutter
• 5.4 By Spectrum
  • 5.4.1 Visible (RGB)
  • 5.4.2 Near-Infrared (NIR)
  • 5.4.3 Short-Wave Infrared (SWIR)
  • 5.4.4 X-ray / Ultraviolet
• 5.5 By Resolution
  • 5.5.1 Less than 1 MP
  • 5.5.2 1 - 3 MP
  • 5.5.3 4 - 12 MP
  • 5.5.4 13 - 24 MP
  • 5.5.5 More than Equal to 25 MP
• 5.6 By End-User Industry
  • 5.6.1 Consumer Electronics
  • 5.6.2 Automotive and Transportation
  • 5.6.3 Industrial Automation and Robotics
  • 5.6.4 Security and Surveillance
  • 5.6.5 Healthcare and Life Sciences
  • 5.6.6 Aerospace and Defense
  • 5.6.7 Smart City, Agriculture, Marine
• 5.7 By Geography
  • 5.7.1 North America
    • 5.7.1.1 United States
    • 5.7.1.2 Canada
    • 5.7.1.3 Mexico
  • 5.7.2 Europe
    • 5.7.2.1 United Kingdom
    • 5.7.2.2 Germany
    • 5.7.2.3 France
    • 5.7.2.4 Italy
    • 5.7.2.5 Rest of Europe
  • 5.7.3 Asia-Pacific
    • 5.7.3.1 China
    • 5.7.3.2 Japan
    • 5.7.3.3 India
    • 5.7.3.4 South Korea
    • 5.7.3.5 Rest of Asia-Pacific
  • 5.7.4 Middle East
    • 5.7.4.1 Israel
    • 5.7.4.2 Saudi Arabia
    • 5.7.4.3 United Arab Emirates
    • 5.7.4.4 Turkey
    • 5.7.4.5 Rest of Middle East
  • 5.7.5 Africa
    • 5.7.5.1 South Africa
    • 5.7.5.2 Egypt
    • 5.7.5.3 Rest of Africa
  • 5.7.6 South America
    • 5.7.6.1 Brazil
    • 5.7.6.2 Argentina
    • 5.7.6.3 Rest of South America

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Sony Group Corp.
  • 6.4.2 Samsung Electronics Co., Ltd.
  • 6.4.3 OmniVision Technologies, Inc.
  • 6.4.4 STMicroelectronics N.V.
  • 6.4.5 ON Semiconductor Corporation
  • 6.4.6 Canon Inc.
  • 6.4.7 Panasonic Holdings Corporation
  • 6.4.8 Teledyne DALSA Inc.
  • 6.4.9 ams OSRAM AG
  • 6.4.10 SK hynix Inc.
  • 6.4.11 GalaxyCore Inc.
  • 6.4.12 Hamamatsu Photonics K.K.
  • 6.4.13 SmartSens Technology
  • 6.4.14 PixArt Imaging Inc.
  • 6.4.15 Himax Technologies, Inc.
  • 6.4.16 Tower Semiconductor Ltd.
  • 6.4.17 Teledyne e2v
  • 6.4.18 Gpixel Inc.
  • 6.4.19 Forza Silicon Corp.
  • 6.4.20 Toshiba Electronic Devices and Storage Corp.
  • 6.4.21 Pyxalis S.A.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment