전자용 열관리 소재 : 시장 점유율 분석, 업계 동향과 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the electronic thermal management materials market size was estimated at USD 4.85 billion in 2025 and is estimated to grow from USD 5.13 billion in 2026 to USD 6.98 billion by 2031, at a CAGR of 6.36% during the forecast period (2026-2031).

Global Electronic Thermal Management Materials Market Trends and Insights

AI-Enabled Computing and Rising Chip Power Density

AI workloads are changing thermal design requirements across the electronics supply chain. AI accelerator packages approach or exceed 1,000 W of thermal design power, limiting the use of conventional air cooling. This is increasing the use of liquid metals, indium foils, and silver-filled gels across die-to-lid interfaces. Each interface must manage localized heat loads while maintaining low thermal resistance. SK hynix introduced iHBM in May 2026, incorporating cooling elements into the D2D PHY area, and reported a 30% reduction in thermal resistance. The electronic thermal management materials market requires formulations that maintain low resistance under changing operating conditions and package loads.

Electrification of Vehicles and High-Voltage Power Electronics

Electric vehicle (EV) battery packs, onboard chargers, and power inverters require multiple layers of thermal interface material. Silicon carbide (SiC) and gallium nitride (GaN) devices operate at higher junction temperatures, increasing thermal requirements across the drivetrain stack. Cell-to-pack and cell-to-chassis architectures eliminate the module layer and extend automotive-grade qualification requirements to the battery cell-to-chassis interface. SAE International research published in 2025 found that specified phase change materials can extend EV battery operation without active cooling by up to 80% across consecutive Worldwide Harmonized Light Vehicles Test Procedure (WLTP) drive cycles. A 2025 review found that carbon-based nano-additives increased the thermal conductivity of phase change material by 40-120%, while low-temperature processing reduced material costs by 20-35% compared with earlier laboratory formulations. Henkel launched Bergquist TGF 2030APS and Loctite TLB 9270APS in May 2026 for cell-to-pack and cell-to-chassis applications.

Qualification Cycles and Reliability Testing Costs

A new thermal interface material for automotive or aerospace programs may require 18-36 months of thermomechanical reliability testing. JESD22 thermal cycling protocols require verification across 250-1,000 cycles at extreme temperatures before program approval. Testing accounts for a significant share of qualification time and cost. After qualification, established suppliers can retain their position throughout a platform's production life. New formulations may require requalification, extending adoption timelines. This can delay material innovation by two or three design generations and lengthen the R&D payback period. Smaller suppliers face higher costs when qualifying products for automotive-grade and data center applications, particularly when IATF 16949 and application-specific JEDEC or IPC (Association Connecting Electronics Industries) approvals are required.

Other drivers and restraints analyzed in the detailed report include:

1. Semiconductor Packaging Complexity and Advanced Interconnects
2. 5G, Edge Infrastructure and High-Density Data Centers
3. Filler, Silicone, and Specialty Polymer Cost Volatility

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Thermal interface materials accounted for 44.74% of the electronic thermal management materials market in 2025. They are used between the die and heat spreader, the heat spreader and heat sink, and the battery cell and cooling structure. After platform-specific original equipment manufacturer (OEM) validation, a formulation typically remains in production throughout the program lifecycle. Phase change materials are forecast to grow at a CAGR of 8.34% from 2026 to 2031, supported by their ability to conform to irregular surfaces during thermal cycling. This supports their use in EV battery modules, onboard chargers, and AI accelerator assemblies.

Graphite- and graphene-based materials are gaining adoption in consumer electronics and 5G radio units because they distribute heat laterally with limited z-axis thickness. Carbon-based nano-additives improve phase change material conductivity by 40-120%, while lower-temperature processing reduces costs by 20-35% compared with earlier formulations. Metal-based materials, including indium foils and sintered silver alternatives, are used in TIM1 applications for three-dimensional integrated circuit (3D-IC) and HBM packages. Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) compliance requirements limit formulation options for lead- and bismuth-bearing alloys in Europe. Other materials include specialty films, coatings, and structural thermal adhesives for aerospace and medical electronics, where long-term certification supports higher unit values.

Complete Report Scope:

• By Material Type
  • Thermal Interface Materials
  • Phase Change Materials
  • Graphite and Graphene-Based Materials
  • Metal-Based Thermal Materials
  • Other Thermal Management Materials
• By Form Factor
  • Sheet
  • Paste
  • Liquid
  • Others
• By Application
  • Consumer Electronics
  • Automotive
  • Aerospace
  • Telecommunications
  • Healthcare
  • Industrial Equipment
  • Other Applications
• By Geography
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • ASEAN Countries
    • Rest of Asia-Pacific
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • NORDIC Countries
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Middle East and Africa
    • Saudi Arabia
    • South Africa
    • Rest of Middle East and Africa

Geography Analysis

Asia-Pacific accounted for 41.39% of the electronic thermal management materials market in 2025 and is projected to grow at a CAGR of 7.63% through 2031. The region includes consumer electronics production in China, EV battery assembly in South Korea and Japan, and the expansion of hyperscale data center capacity. In 2025, Taiwan consumed USD 21.7 billion in semiconductor materials, followed by China at USD 15.6 billion and South Korea at USD 11.2 billion. Advanced packaging supports demand for thermal interface materials (TIMs), phase-change materials, and graphite spreaders, as high-bandwidth memory (HBM) assemblies, chiplets, and interposers require multiple thermal layers. India, Vietnam, Thailand, and Indonesia also support demand through investments in assembly and testing and through domestic EV production.

North America held the second-largest position in the electronic thermal management materials market. The United States semiconductor sector designs AI accelerators, and the thermal specifications of these accelerators influence material development across the global supply chain. Hyperscale operators committed significant infrastructure capital in 2025 and 2026, while AI-capable racks require liquid cooling systems and interface materials at multiple heat-transfer points. Canada supports demand through high-performance computing infrastructure, while Mexico serves as a secondary hub for automotive-grade gap fillers and potting materials. In Europe, Germany's EV powertrain suppliers and battery requirements support thermal material development across specified temperature ranges.

South America presents an emerging market opportunity, as data center investments in Brazil support digital demand across Latin America. Argentina's role in the lithium triangle could support regional EV battery assembly over the medium term. The Middle East and Africa market is supported by Saudi Arabia's Vision 2030 digital infrastructure program and industrial electronics activity in South Africa. Gulf Cooperation Council governments are deploying AI-capable infrastructure, which could generate localized demand for thermal materials after hyperscale facilities become operational. Near-term demand remains limited, while long-term growth depends on ongoing infrastructure commitments.

1. 3M
2. AI Technology, Inc.
3. Boyd
4. Dow
5. DuPont
6. Fujipoly America Corp.
7. H.B. Fuller Company
8. Henkel AG & Co. KGaA
9. Honeywell International Inc.
10. Indium Corporation
11. Master Bond
12. Momentive
13. Panasonic Industry
14. PARKER HANNIFIN CORP
15. Shin-Etsu Chemical Co., Ltd.
16. Wacker Chemie AG

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 AI-Enabled Computing and Rising Chip Power Density
  • 4.2.2 Electrification of Vehicles and High-Voltage Power Electronics
  • 4.2.3 Semiconductor Packaging Complexity and Advanced Interconnects
  • 4.2.4 5G, Edge Infrastructure and High-Density Data Centers
  • 4.2.5 Thermal-Material Qualification Embedded in OEM Design Wins
• 4.3 Market Restraints
  • 4.3.1 Qualification Cycles and Reliability Testing Costs
  • 4.3.2 Filler, Silicone and Specialty Polymer Cost Volatility
  • 4.3.3 Thermal Expansion Mismatch and Long-Term Pump-Out Risk
• 4.4 Value Chain Analysis
• 4.5 Porter's Five Forces Analysis
  • 4.5.1 Competitive Rivalry
  • 4.5.2 Threat of New Entrants
  • 4.5.3 Bargaining Power of Suppliers
  • 4.5.4 Bargaining Power of Buyers
  • 4.5.5 Threat of Substitutes

5 Market Size and Growth Forecasts (Value)

• 5.1 By Material Type
  • 5.1.1 Thermal Interface Materials
  • 5.1.2 Phase Change Materials
  • 5.1.3 Graphite and Graphene-Based Materials
  • 5.1.4 Metal-Based Thermal Materials
  • 5.1.5 Other Thermal Management Materials
• 5.2 By Form Factor
  • 5.2.1 Sheet
  • 5.2.2 Paste
  • 5.2.3 Liquid
  • 5.2.4 Others
• 5.3 By Application
  • 5.3.1 Consumer Electronics
  • 5.3.2 Automotive
  • 5.3.3 Aerospace
  • 5.3.4 Telecommunications
  • 5.3.5 Healthcare
  • 5.3.6 Industrial Equipment
  • 5.3.7 Other Applications
• 5.4 By Geography
  • 5.4.1 Asia-Pacific
    • 5.4.1.1 China
    • 5.4.1.2 India
    • 5.4.1.3 Japan
    • 5.4.1.4 South Korea
    • 5.4.1.5 ASEAN Countries
    • 5.4.1.6 Rest of Asia-Pacific
  • 5.4.2 North America
    • 5.4.2.1 United States
    • 5.4.2.2 Canada
    • 5.4.2.3 Mexico
  • 5.4.3 Europe
    • 5.4.3.1 Germany
    • 5.4.3.2 United Kingdom
    • 5.4.3.3 France
    • 5.4.3.4 Italy
    • 5.4.3.5 NORDIC Countries
    • 5.4.3.6 Rest of Europe
  • 5.4.4 South America
    • 5.4.4.1 Brazil
    • 5.4.4.2 Argentina
    • 5.4.4.3 Rest of South America
  • 5.4.5 Middle East and Africa
    • 5.4.5.1 Saudi Arabia
    • 5.4.5.2 South Africa
    • 5.4.5.3 Rest of Middle East and Africa

6 Competitive Landscape

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share (%)/Ranking Analysis
• 6.4 Company Profiles (includes Global Overview, Market Overview, Core Segments, Financials as available, Strategic Information, Products and Services, and Recent Developments)
  • 6.4.1 3M
  • 6.4.2 AI Technology, Inc.
  • 6.4.3 Boyd
  • 6.4.4 Dow
  • 6.4.5 DuPont
  • 6.4.6 Fujipoly America Corp.
  • 6.4.7 H.B. Fuller Company
  • 6.4.8 Henkel AG & Co. KGaA
  • 6.4.9 Honeywell International Inc.
  • 6.4.10 Indium Corporation
  • 6.4.11 Master Bond
  • 6.4.12 Momentive
  • 6.4.13 Panasonic Industry
  • 6.4.14 PARKER HANNIFIN CORP
  • 6.4.15 Shin-Etsu Chemical Co., Ltd.
  • 6.4.16 Wacker Chemie AG

7 Market Opportunities and Future Outlook

• 7.1 White-Space and Unmet-Need Assessment