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시장보고서
상품코드
1478614
세계의 반도체 및 IC 패키징 재료 시장, 점유율, 규모, 동향, 산업 분석 보고서 : 유형별, 패키징 기술별, 최종 이용 산업별, 지역별, 부문별 예측(2024-2032년)Semiconductor & IC Packaging Materials Market Share, Size, Trends, Industry Analysis Report, By Type; By Packaging Technology; By End-Use Industry; By Region; Segment Forecast, 2024 - 2032 |
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Polaris Market Research의 최신 조사에 따르면, 세계 반도체 및 IC 패키징 재료 시장 규모는 2032년까지 868억 2,000만 달러에 달할 것으로 예상됩니다. 이 보고서는 현재 시장 역학에 대한 자세한 통찰력과 미래 시장 성장에 대한 분석을 제공합니다.
반도체 및 IC 패키징 재료 시장은 반도체 장치의 조립 및 패키징에 사용되는 다양한 재료를 포괄합니다. 이러한 재료는 신뢰성, 성능 및 내구성을 보장하는 데 필수적입니다. 이 시장은 주로 통신, 자동차, 가전, 산업 자동화 등 다양한 응용 분야에서 반도체 디바이스의 광범위한 사용으로 인해 주도되고 있습니다.
반도체 소자의 소형화 및 집적화에 대한 수요 증가로 인해 더 작은 폼팩터에서 더 높은 성능과 기능을 제공하는 첨단 패키징 솔루션의 개발로 시장 트렌드가 변화하고 있습니다. 그러나 우수한 특성과 성능 특성을 가진 신흥국 패키징 재료의 개발 및 제조 비용과 복잡성 증가는 시장 성장을 위해 개선될 수 있는 요인으로 작용할 수 있습니다. 자동차, 가전, 통신, 산업 자동화 등의 산업이 반도체 기술을 제품에 계속 통합함에 따라 반도체 소자에 대한 수요가 시장을 크게 견인하고 있습니다. 이러한 장치의 생산은 패키징 재료에 대한 수요를 증가시킬 것입니다. 반도체 패키징 재료는 이러한 장치를 환경 요인으로부터 보호하고, 전기 절연을 제공하고, 열 특성을 관리하고, 성능과 수명을 보장합니다.
반도체 기술의 지속적인 발전과 더 작고, 더 빠르고, 더 강력한 전자기기에 대한 수요 증가로 인해 열전도율, 전기 절연성, 신뢰성 등 우수한 특성을 가진 첨단 패키징 재료에 대한 요구가 증가하고 있습니다. 이종 집적도가 증가함에 따라 다양한 디바이스 아키텍처에 대응할 수 있는 다재다능한 패키징 재료의 필요성이 시장의 과제로 대두되고 있습니다. 이 과정에는 서로 다른 반도체 재료와 기술을 하나의 패키지에 결합하는 것이 포함됩니다.
반도체 및 IC 패키징 재료 시장 보고서 하이라이트
유기 기판 시장은 유리섬유 강화 에폭시 수지 및 라미네이트와 같은 재료를 사용한 기판으로 구성된 유기 기판 부문이 지배적입니다. 이러한 기판은 뛰어난 전기 절연 특성, 비용 효율성 및 열 성능으로 인해 반도체 패키징에 매우 선호되는 기판입니다.
민수용 전자제품 부문은 수요 증가로 인해 시장을 주도하고 있습니다. 이는 스마트폰, 태블릿, 노트북, 웨어러블 기기, 가전제품 등 다양한 소비자 전자제품의 채택이 증가하고 있기 때문입니다. 그 결과, 소비자 가전 부문은 업계에서 가장 큰 시장 점유율을 유지하고 있습니다.
아시아태평양은 다양한 분야에서 리더십을 발휘하고 있어 전자 산업에서 압도적인 강세를 보이고 있습니다. 일본, 중국, 대만, 한국, 싱가포르와 같은 국가들은 파운드리, 패키징 시설, 장비 공급업체, 연구기관이 종합적으로 존재하는 여러 전자제품 제조 허브를 구축했습니다.
목차
제1장 서론
제2장 주요 요약
제3장 조사 방법
제4장 세계의 반도체 및 IC 패키징 재료 시장 인사이트
- 패키징 기술 현황
- 반도체 및 IC 패키징 재료 시장 역학
- 성장 촉진요인과 기회
- 성장 억제요인과 과제
- PESTEL 분석
- 반도체 및 IC 패키징 재료 시장의 패키징 기술 동향
- 밸류체인 분석
- COVID-19의 영향 분석
제5장 세계의 반도체 및 IC 패키징 재료 시장 : 유형별
- 주요 조사 결과
- 서론
- 본딩 와이어
- 세라믹 패키지
- 다이아 터치 재료
- 캡슐화 수지
- 리드 프레임
- 유기 기질
- 땜납 볼
- 열전도 재료
- 기타
제6장 세계의 반도체 및 IC 패키징 재료 시장 : 최종 이용 산업별
- 주요 조사 결과
- 서론
- 항공우주 및 방위
- 자동차
- 가전
- 헬스케어
- IT 및 통신
- 기타
제7장 세계의 반도체 및 IC 패키징 재료 시장 : 패키징 기술별
- 주요 조사 결과
- 서론
- Dual Flat No-Leads (DFN)
- Dual-In-Line (DIP)
- Grid Array (GA)
- Quad Flat No-Leads (QFN)
- Quad Flat Packages (QFP)
- Small Outline Package (SOP)
- 기타
제8장 세계의 반도체 및 IC 패키징 재료 시장 : 지역별
- 주요 조사 결과
- 서론
- 반도체 및 IC 패키징 재료 시장 평가 : 지역,2019-2032년
- 북미
- 북미 : 유형별, 2019-2032년
- 북미 : 패키징 기술별, 2019년-2032년
- 북미 : 최종 이용 산업별, 2019년-2032년
- 미국
- 캐나다
- 유럽
- 유럽 : 유형별, 2019-2032
- 유럽 : 패키징 기술별, 2019-2032년
- 유럽 : 최종 이용 산업별, 2019년-2032년
- 영국
- 프랑스
- 독일
- 이탈리아
- 스페인
- 네덜란드
- 러시아
- 아시아태평양
- 아시아태평양 : 유형별, 2019-2032
- 아시아태평양 : 패키징 기술별, 2019-2032년
- 아시아태평양 : 최종 이용 산업별, 2019년-2032년
- 중국
- 인도
- 말레이시아
- 일본
- 인도네시아
- 한국
- 중동 및 아프리카
- 중동 및 아프리카 : 유형별, 2019년-2032년
- 중동 및 아프리카 : 패키징 기술별, 2019-2032년
- 중동 및 아프리카 : 최종 이용 산업별, 2019년-2032년
- 사우디아라비아
- 아랍에미리트(UAE)
- 이스라엘
- 남아프리카공화국
- 라틴아메리카
- 라틴아메리카 : 유형별, 2019-2032년
- 라틴아메리카 : 패키징 기술별, 2019-2032년
- 라틴아메리카 : 최종 이용 산업별, 2019년-2032년
- 멕시코
- 브라질
- 아르헨티나
제9장 경쟁 구도
- 확장 및 인수 분석
- 확장
- 인수
- 제휴/협업/합의/공개
제10장 기업 개요
- Amkor Technology
- ASE
- Fujitsu Semiconductor Memory Solution Limited
- Henkel AG & Co. KGaA
- IBIDEN
- KYOCERA Corporation
- LG Chem
- Powertech Technology Inc
- Siliconware Precision Industries Co., Ltd.
- Texas Instruments Incorporated
The global semiconductor & IC packaging materials market size is expected to reach USD 86.82 Billion by 2032, according to a new study by Polaris Market Research. The report "Semiconductor & IC Packaging Materials Market Share, Size, Trends, Industry Analysis Report, By Type; By Packaging Technology; By End-Use Industry (Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, IT & Telecommunication, Others); By Region; Segment Forecast, 2024 - 2032" gives a detailed insight into current market dynamics and provides analysis on future market growth.
The market for semiconductor and IC packaging materials encompasses an extensive array of materials used in the assembly and packaging of semiconductor devices. These materials are vital in ensuring their reliability, performance, and durability. The market is primarily driven by the widespread usage of semiconductor devices in various applications such as telecommunications, automotive, consumer electronics, and industrial automation.
The market trends are moving towards the development of advanced packaging solutions that offer higher performance and functionality in smaller form factors due to the growing demand for miniaturization and integration of semiconductor devices. However, the increasing cost and complexity of developing and manufacturing advanced packaging materials with superior properties and performance characteristics could be improved for market growth. The demand for semiconductor devices is significantly driving the market as industries such as automotive, consumer electronics, telecommunications, and industrial automation continue to integrate semiconductor technology into their products. The production of these devices correspondingly increases the demand for packaging materials. Semiconductor packaging materials protect these devices from environmental factors, provide electrical insulation, and manage thermal properties, ensuring their performance and longevity.
The continuous evolution of semiconductor technology and the increasing demand for smaller, faster, and more powerful electronic devices are increasing the need for advanced packaging materials with superior properties such as thermal conductivity, electrical insulation, and reliability. Due to the increasing adoption of heterogeneous integration, the market is challenged by the need for versatile packaging materials capable of accommodating diverse device architectures. This process involves combining different semiconductor materials and technologies in a single package.
Semiconductor & IC Packaging Materials Market Report Highlights
The market is dominated by the organic substrate segment, which comprises substrates made using materials such as fiberglass-reinforced epoxy resin or laminate. These substrates are highly preferred in semiconductor packaging due to their exceptional electrical insulation properties, cost-effectiveness, and thermal performance.
The consumer electronics sector has dominated the market due to its substantial growth in demand. This can be attributed to the increased adoption of various consumer electronic devices such as smartphones, tablets, laptops, wearable devices, and home appliances. As a result, the consumer electronics segment has remained the largest market share holder in this industry.
The Asia Pacific region is a dominant force in the electronics industry, thanks to its leadership in various areas. Countries like Japan, China, Taiwan, South Korea, and Singapore have established multiple electronics manufacturing hubs with a comprehensive presence of foundries, packaging facilities, equipment suppliers, and research institutions.
The global key market players include Amkor Technology, ASE, Fujitsu Semiconductor Memory Solution Limited, Henkel AG & Co. KGaA, IBIDEN, KYOCERA Corporation, LG Chem, Powertech Technology Inc., Siliconware Precision Industries Co., Ltd., and Texas Instruments Incorporated.
Polaris Market Research has segmented the Semiconductor & IC Packaging Materials market report based on type, packaging technology, end-use industry, and region:
Semiconductor & IC Packaging Materials, Type Outlook (Revenue - USD Billion, 2019 - 2032)
- Bonding Wires
- Ceramic Packages
- Die Attach Materials
- Encapsulation Resins
- Leadframes
- Organic Substrate
- Solder Balls
- Thermal Interface Materials
- Others
Semiconductor & IC Packaging Materials, Packaging Technology Outlook (Revenue - USD Billion, 2019 - 2032)
- Dual Flat No-Leads (DFN)
- Dual-In-Line (DIP)
- Grid Array (GA)
- Quad Flat No-Leads (QFN)
- Quad Flat Packages (QFP)
- Small Outline Package (SOP)
- Others
Semiconductor & IC Packaging Materials, End-Use Industry Outlook (Revenue - USD Billion, 2019 - 2032)
- Aerospace & Defense
- Automotive
- Consumer Electronics
- Healthcare
- IT & Telecommunication
- Others
Semiconductor & IC Packaging Materials, Regional Outlook (Revenue - USD Billion, 2019 - 2032)
- North America
- U.S.
- Canada
- Europe
- Germany
- UK
- France
- Italy
- Spain
- Russia
- Netherlands
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Indonesia
- Malaysia
- Australia
- Rest of APAC
- Latin America
- Argentina
- Brazil
- Mexico
- Rest of Latin America
- Middle East & Africa
- UAE
- Saudi Arabia
- Israel
- South Africa
- Rest of MEA
Table of Contents
1. Introduction
- 1.1. Report Description
- 1.1.1. Objectives of the Study
- 1.1.2. Market Scope
- 1.1.3. Assumptions
- 1.2. Stakeholders
2. Executive Summary
- 2.1. Market Highlights
3. Research Methodology
- 3.1. Overview
- 3.1.1. Data Mining
- 3.2. Data Sources
- 3.2.1. Primary Sources
- 3.2.2. Secondary Sources
4. Global Semiconductor & IC Packaging Materials Market Insights
- 4.1. Semiconductor & IC Packaging Materials Market - Packaging Technology Snapshot
- 4.2. Semiconductor & IC Packaging Materials Market Dynamics
- 4.2.1. Drivers and Opportunities
- 4.2.1.1. The increasing demand for semiconductor devices is driving semiconductor & IC packaging materials market growth
- 4.2.1.2. The increasing demand for miniaturization and integration is driving the semiconductor & IC packaging materials market growth
- 4.2.2. Restraints and Challenges
- 4.2.2.1. The cost and complexity of advanced materials
- 4.2.1. Drivers and Opportunities
- 4.3. Porter's Five Forces Analysis
- 4.3.1. Bargaining Power of Suppliers (Moderate)
- 4.3.2. Threats of New Entrants: (Low)
- 4.3.3. Bargaining Power of Buyers (Moderate)
- 4.3.4. Threat of Substitute (Moderate)
- 4.3.5. Rivalry among existing firms (High)
- 4.4. PESTEL Analysis
- 4.5. Semiconductor & IC Packaging Materials Market Packaging Technology Trends
- 4.6. Value Chain Analysis
- 4.7. COVID-19 Impact Analysis
5. Global Semiconductor & IC Packaging Materials Market, by Type
- 5.1. Key Findings
- 5.2. Introduction
- 5.2.1. Global Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 5.3. Bonding Wires
- 5.3.1. Global Semiconductor & IC Packaging Materials Market, by Bonding Wires, by Region, 2019-2032 (USD Billion)
- 5.4. Ceramic Packages
- 5.4.1. Global Semiconductor & IC Packaging Materials Market, by Ceramic Packages, by Region, 2019-2032 (USD Billion)
- 5.5. Die Attach Materials
- 5.5.1. Global Semiconductor & IC Packaging Materials Market, by Die Attach Materials, by Region, 2019-2032 (USD Billion)
- 5.6. Encapsulation Resins
- 5.6.1. Global Semiconductor & IC Packaging Materials Market, by Encapsulation Resins, by Region, 2019-2032 (USD Billion)
- 5.7. Leadframes
- 5.7.1. Global Semiconductor & IC Packaging Materials Market, by Leadframes, by Region, 2019-2032 (USD Billion)
- 5.8. Organic Substrate
- 5.8.1. Global Semiconductor & IC Packaging Materials Market, by Organic Substrate, by Region, 2019-2032 (USD Billion)
- 5.9. Solder Balls
- 5.9.1. Global Semiconductor & IC Packaging Materials Market, by Solder Balls, by Region, 2019-2032 (USD Billion)
- 5.10. Thermal Interface Materials
- 5.10.1. Global Semiconductor & IC Packaging Materials Market, by Thermal Interface Materials, by Region, 2019-2032 (USD Billion)
- 5.11. Others
- 5.11.1. Global Semiconductor & IC Packaging Materials Market, by Others, by Region, 2019-2032 (USD Billion)
6. Global Semiconductor & IC Packaging Materials Market, by End-Use Industry
- 6.1. Key Findings
- 6.2. Introduction
- 6.2.1. Global Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 6.3. Aerospace & Defense
- 6.3.1. Global Semiconductor & IC Packaging Materials Market, by Aerospace & Defense, by Region, 2019-2032 (USD Billion)
- 6.4. Automotive
- 6.4.1. Global Semiconductor & IC Packaging Materials Market, by Automotive, by Region, 2019-2032 (USD Billion)
- 6.5. Consumer Electronics
- 6.5.1. Global Semiconductor & IC Packaging Materials Market, by Consumer Electronics, by Region, 2019-2032 (USD Billion)
- 6.6. Healthcare
- 6.6.1. Global Semiconductor & IC Packaging Materials Market, by Healthcare, by Region, 2019-2032 (USD Billion)
- 6.7. IT & Telecommunication
- 6.7.1. Global Semiconductor & IC Packaging Materials Market, by IT & Telecommunication, by Region, 2019-2032 (USD Billion)
- 6.8. Others
- 6.8.1. Global Semiconductor & IC Packaging Materials Market, by Others, by Region, 2019-2032 (USD Billion)
7. Global Semiconductor & IC Packaging Materials Market, by Packaging Technology
- 7.1. Key Findings
- 7.2. Introduction
- 7.2.1. Global Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 7.3. Dual Flat No-Leads (DFN)
- 7.3.1. Global Semiconductor & IC Packaging Materials Market, by Dual Flat No-Leads (DFN), By Region, 2019-2032 (USD Billion)
- 7.4. Dual-In-Line (DIP)
- 7.4.1. Global Semiconductor & IC Packaging Materials Market, by Dual-In-Line (DIP), By Region, 2019-2032 (USD Billion)
- 7.5. Grid Array (GA)
- 7.5.1. Global Semiconductor & IC Packaging Materials Market, by Grid Array (GA), By Region, 2019-2032 (USD Billion)
- 7.6. Quad Flat No-Leads (QFN)
- 7.6.1. Global Semiconductor & IC Packaging Materials Market, by Quad Flat No-Leads (QFN), By Region, 2019-2032 (USD Billion)
- 7.7. Quad Flat Packages (QFP)
- 7.7.1. Global Semiconductor & IC Packaging Materials Market, by Quad Flat Packages (QFP), By Region, 2019-2032 (USD Billion)
- 7.8. Small Outline Package (SOP)
- 7.8.1. Global Semiconductor & IC Packaging Materials Market, by Small Outline Package (SOP), By Region, 2019-2032 (USD Billion)
- 7.9. Others
- 7.9.1. Global Semiconductor & IC Packaging Materials Market, by Others, By Region, 2019-2032 (USD Billion)
8. Global Semiconductor & IC Packaging Materials Market, by Geography
- 8.1. Key findings
- 8.2. Introduction
- 8.2.1. Semiconductor & IC Packaging Materials Market Assessment, By Geography, 2019-2032 (USD Billion)
- 8.3. Semiconductor & IC Packaging Materials Market - North America
- 8.3.1. North America: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.3.2. North America: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.3.3. North America: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.3.4. Semiconductor & IC Packaging Materials Market - U.S.
- 8.3.4.1. U.S.: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.3.4.2. U.S.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.3.4.3. U.S.: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.3.5. Semiconductor & IC Packaging Materials Market - Canada
- 8.3.5.1. Canada: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.3.5.2. Canada.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.3.5.3. Canada: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4. Semiconductor & IC Packaging Materials Market - Europe
- 8.4.1. Europe: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.2. Europe.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.3. Europe: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.4. Semiconductor & IC Packaging Materials Market - UK
- 8.4.4.1. UK: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.4.2. UK.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.4.3. UK: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.5. Semiconductor & IC Packaging Materials Market - France
- 8.4.5.1. France: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.5.2. France.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.5.3. France: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.6. Semiconductor & IC Packaging Materials Market - Germany
- 8.4.6.1. Germany: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.6.2. Germany.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.6.3. Germany: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.7. Semiconductor & IC Packaging Materials Market - Italy
- 8.4.7.1. Italy: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.7.2. Italy.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.7.3. Italy: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.8. Semiconductor & IC Packaging Materials Market - Spain
- 8.4.8.1. Spain: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.8.2. Spain.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.8.3. Spain: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.9. Semiconductor & IC Packaging Materials Market - Netherlands
- 8.4.9.1. Netherlands: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.9.2. Netherlands.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.9.3. Netherlands: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.4.10. Semiconductor & IC Packaging Materials Market - Russia
- 8.4.10.1. Russia: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.4.10.2. Russia.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.4.10.3. Russia: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5. Semiconductor & IC Packaging Materials Market - Asia Pacific
- 8.5.1. Asia Pacific: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.2. Asia Pacific.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.3. Asia Pacific: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.4. Semiconductor & IC Packaging Materials Market - China
- 8.5.4.1. China: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.4.2. China.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.4.3. China: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.5. Semiconductor & IC Packaging Materials Market - India
- 8.5.5.1. India: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.5.2. India.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.5.3. India: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.6. Semiconductor & IC Packaging Materials Market - Malaysia
- 8.5.6.1. Malaysia: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.6.2. Malaysia.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.6.3. Malaysia: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.7. Semiconductor & IC Packaging Materials Market - Japan
- 8.5.7.1. Japan: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.7.2. Japan.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.7.3. Japan: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.8. Semiconductor & IC Packaging Materials Market - Indonesia
- 8.5.8.1. Indonesia: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.8.2. Indonesia.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.8.3. Indonesia: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.5.9. Semiconductor & IC Packaging Materials Market - South Korea
- 8.5.9.1. South Korea: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.5.9.2. South Korea.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.5.9.3. South Korea: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.6. Semiconductor & IC Packaging Materials Market - Middle East & Africa
- 8.6.1. Middle East & Africa: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.6.2. Middle East & Africa.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.6.3. Middle East & Africa: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.6.4. Semiconductor & IC Packaging Materials Market - Saudi Arabia
- 8.6.4.1. Saudi Arabia: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.6.4.2. Saudi Arabia.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.6.4.3. Saudi Arabia: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.6.5. Semiconductor & IC Packaging Materials Market - UAE
- 8.6.5.1. UAE: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.6.5.2. UAE.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.6.5.3. UAE: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.6.6. Semiconductor & IC Packaging Materials Market - Israel
- 8.6.6.1. Israel: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.6.6.2. Israel.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.6.6.3. Israel: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.6.7. Semiconductor & IC Packaging Materials Market - South Africa
- 8.6.7.1. South Africa: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.6.7.2. South Africa.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.6.7.3. South Africa: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.7. Semiconductor & IC Packaging Materials Market - Latin America
- 8.7.1. Latin America: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.7.2. Latin America.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.7.3. Latin America: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.7.4. Semiconductor & IC Packaging Materials Market - Mexico
- 8.7.4.1. Mexico: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.7.4.2. Mexico.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.7.4.3. Mexico: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.7.5. Semiconductor & IC Packaging Materials Market - Brazil
- 8.7.5.1. Brazil: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.7.5.2. Brazil.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.7.5.3. Brazil: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
- 8.7.6. Semiconductor & IC Packaging Materials Market - Argentina
- 8.7.6.1. Argentina: Semiconductor & IC Packaging Materials Market, by Type, 2019-2032 (USD Billion)
- 8.7.6.2. Argentina.: Semiconductor & IC Packaging Materials Market, by Packaging Technology, 2019-2032 (USD Billion)
- 8.7.6.3. Argentina: Semiconductor & IC Packaging Materials Market, by End-Use Industry, 2019-2032 (USD Billion)
9. Competitive Landscape
- 9.1. Expansion and Acquisition Analysis
- 9.1.1. Expansion
- 9.1.2. Acquisitions
- 9.2. Partnerships/Collaborations/Agreements/Exhibitions
10. Company Profiles
- 10.1. Amkor Technology
- 10.1.1. Company Overview
- 10.1.2. Financial Performance
- 10.1.3. Product Benchmarking
- 10.1.4. Recent Development
- 10.2. ASE
- 10.2.1. Company Overview
- 10.2.2. Financial Performance
- 10.2.3. Product Benchmarking
- 10.2.4. Recent Development
- 10.3. Fujitsu Semiconductor Memory Solution Limited
- 10.3.1. Company Overview
- 10.3.2. Financial Performance
- 10.3.3. Product Benchmarking
- 10.3.4. Recent Development
- 10.4. Henkel AG & Co. KGaA
- 10.4.1. Company Overview
- 10.4.2. Financial Performance
- 10.4.3. Product Benchmarking
- 10.4.4. Recent Development
- 10.5. IBIDEN
- 10.5.1. Company Overview
- 10.5.2. Financial Performance
- 10.5.3. Product Benchmarking
- 10.5.4. Recent Development
- 10.6. KYOCERA Corporation
- 10.6.1. Company Overview
- 10.6.2. Financial Performance
- 10.6.3. Product Benchmarking
- 10.6.4. Recent Development
- 10.7. LG Chem
- 10.7.1. Company Overview
- 10.7.2. Financial Performance
- 10.7.3. Product Benchmarking
- 10.7.4. Recent Development
- 10.8. Powertech Technology Inc
- 10.8.1. Company Overview
- 10.8.2. Financial Performance
- 10.8.3. Product Benchmarking
- 10.8.4. Recent Development
- 10.9. Siliconware Precision Industries Co., Ltd.
- 10.9.1. Company Overview
- 10.9.2. Financial Performance
- 10.9.3. Product Benchmarking
- 10.9.4. Recent Development
- 10.10. Texas Instruments Incorporated
- 10.10.1. Company Overview
- 10.10.2. Financial Performance
- 10.10.3. Product Benchmarking
- 10.10.4. Recent Development
