시장보고서
상품코드
1786989

세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 : 규모, 점유율, 동향, 산업 분석 보고서 - 서비스 유형별, 패키징 유형별, 최종 사용자별, 지역별 예측(2025-2034년)

Outsourced Semiconductor Assembly and Test (OSAT) Market Size, Share, Trends, & Industry Analysis Report By Service Type (Assembly & Packaging, Testing), By Type of Packaging, By End User, and By Region - Market Forecast, 2025-2034

발행일: | 리서치사: Polaris Market Research | 페이지 정보: 영문 128 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

Polaris Market Research의 최근 조사에 따르면 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 규모는 2034년까지 912억 9,000만 달러에 이를 전망입니다. 이 조사 보고서는 현재 시장 역학을 자세히 파악하고 향후 시장 성장에 대한 분석을 제공합니다.

OSAT 시장은 반도체 제조업체들이 성능, 확장성, 비용 효율성을 보장하기 위해 칩렛의 패키징과 테스트를 외부 공급자에 의존하는 경향이 커지고 성장하고 있습니다. 스마트 컨슈머 디바이스의 채용 증가, 자동차에 전자 통합, 칩의 복잡성의 급속한 진보가 OSAT 솔루션의 전개를 세계적으로 가속화하고 있습니다.

시장 확대의 원동력은 고밀도 칩 통합에 대한 수요, 지역 공급 체인의 탄력성, 고급 자동차 등급 테스트의 필요성입니다. OSAT 프로바이더는 시스템 인 패키지, 웨이퍼 레벨 패키징, AI 탑재 검증 툴을 채용해, 가전, 자동차, 통신의 각 분야에서 최종 사용자 수요에 부응하고 있습니다.

아웃소싱 반도체 조립 및 검사(OSAT) 시장 보고서 하이라이트

서비스 유형별로 테스트 분야는 2024년에 압도적인 수익 점유율을 획득했습니다. 이 주도적 지위는 다양한 반도체 용도에서 품질 보증 요구사항과 신뢰성 벤치마크가 증가함에 기인합니다.

패키징 유형별로, 칩 스케일 패키징(CSP) 솔루션은 모바일 디바이스 및 웨어러블 기술에서 소형화되고 고성능 패키징 포맷에 대한 업계의 요구에 부응하여 예측 기간 동안 채택이 가속될 것으로 예측됩니다.

아시아태평양의 아웃소싱 반도체 조립 및 검사(OSAT) 분야는 성숙한 반도체 제조 에코시스템과 대규모 집적 회로 생산 능력의 혜택을 받아 2024년 세계 최대 시장 점유율을 확보했습니다.

북미 OSAT 산업은 국내 반도체 제조 활동 확대와 공급망 독립성을 강화하는 전략적 이니셔티브에 힘입어 2034년까지 가장 빠른 성장률을 기록할 전망입니다.

세계 주요 시장 기업은 ASE Technology Holding Co., Ltd., Amkor Technology, Inc., JCET Group Co., Ltd., Powertech Technology Inc., Tongfu Microelectronics Co., Ltd., UTAC Holdings Ltd., ChipMOS Technologies Inc., Hana Micron Inc., Unisem Group, Walton Advanced Engineering Inc., Signetics Corporation, Lingsen Precision Industries, Ltd 등이 있습니다.

목차

제1장 서론

제2장 주요 요약

제3장 조사 방법

제4장 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 인사이트

  • 시장 현황
  • 아웃소싱 반도체 조립 및 검사(OSAT) 시장 역학
    • 성장 촉진요인과 기회
      • 세계에서 급속히 증가하는 소비자용 디바이스
      • ADAS 기술을 탑재한 전기자동차의 보급 확대
    • 억제요인과 과제
      • 첨단 패키징 기기의 높은 자본 집약도
  • PESTEL 분석
  • 아웃소싱 반도체 조립 및 검사(OSAT) 시장 동향
  • 밸류체인 분석

제5장 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 : 서비스 유형별

  • 주요 조사 결과
  • 소개
  • 조립 및 포장
  • 테스트

제6장 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 : 패키징 유형별

  • 주요 조사 결과
  • 소개
  • 볼 그리드 어레이(BGA) 패키지
  • 칩 스케일 패키지(CSP)
  • 스택 다이 패키징
  • 멀티칩 패키징
  • 쿼드 플랫 및 듀얼 인라인 패키지

제7장 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 : 최종 사용자별

  • 주요 조사 결과
  • 소개
  • 가전
  • 산업
  • 통신
  • 자동차
  • 항공우주 및 방어
  • 의료 및 헬스케어
  • 물류 및 운송

제8장 세계의 아웃소싱 반도체 조립 및 검사(OSAT) 시장 : 지역별

  • 주요 조사 결과
  • 소개
    • 아웃소싱 반도체 조립 및 검사(OSAT) 시장 평가 : 지역별, 2020-2034년
  • 북미
    • 북미 : 서비스 유형별, 2020-2034년
    • 북미 : 패키징 유형별, 2020-2034년
    • 북미 : 최종 사용자별, 2020-2034년
    • 미국
    • 캐나다
  • 유럽
    • 유럽 : 서비스 유형별, 2020-2034년
    • 유럽 : 패키징 유형별, 2020-2034년
    • 유럽 : 최종 사용자별, 2020-2034년
    • 영국
    • 프랑스
    • 독일
    • 이탈리아
    • 스페인
    • 네덜란드
    • 러시아
    • 기타 유럽
  • 아시아태평양
    • 아시아태평양 : 서비스 유형별, 2020-2034년
    • 아시아태평양 : 포장 유형별, 2020-2034년
    • 아시아태평양 : 최종 사용자별, 2020-2034년
    • 중국
    • 인도
    • 말레이시아
    • 일본
    • 인도네시아
    • 한국
    • 호주
    • 기타 아시아태평양
  • 중동 및 아프리카
    • 중동 및 아프리카 : 서비스 유형별, 2020-2034년
    • 중동 및 아프리카 : 포장 유형별, 2020-2034년
    • 중동 및 아프리카 : 최종 사용자별, 2020-2034년
    • 사우디아라비아
    • 아랍에미리트(UAE)
    • 이스라엘
    • 남아프리카
    • 기타 중동 및 아프리카
  • 라틴아메리카
    • 라틴아메리카 : 서비스 유형별, 2020-2034년
    • 라틴아메리카 : 패키징 유형별, 2020-2034년
    • 라틴아메리카 : 최종 사용자별, 2020-2034년
    • 멕시코
    • 브라질
    • 아르헨티나
    • 기타 라틴아메리카

제9장 경쟁 구도

  • 확대 및 인수 분석
    • 확대
    • 인수
  • 제휴/협업/합의/공개

제10장 기업 프로파일

  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • ChipMOS Technologies Inc.
  • Hana Micron Inc.
  • JCET Group Co., Ltd.
  • Lingsen Precision Industries, Ltd.
  • Powertech Technology Inc.
  • Signetics Corporation
  • Tongfu Microelectronics Co., Ltd.
  • Unisem Group
  • UTAC Holdings Ltd.
  • Walton Advanced Engineering Inc.
JHS 25.08.18

The Outsourced Semiconductor Assembly and Test (OSAT) market size is expected to reach USD 91.29 Billion by 2034, according to a new study by Polaris Market Research. The report "Outsourced Semiconductor Assembly and Test (OSAT) Market Share, Size, Trends, Industry Analysis Report: By Service Type (Assembly & Packaging, Testing), By Type of Packaging, By End User, and By Region; Market Forecast, 2025-2034" gives a detailed insight into current market dynamics and provides analysis on future market growth.

The OSAT market is growing as semiconductor manufacturers increasingly rely on external providers for chiplets packaging and testing to ensure performance, scalability, and cost-efficiency. Rising adoption of smart consumer devices, electronic integration in vehicles, and rapid advancements in chip complexity are accelerating the deployment of OSAT solutions globally.

Market expansion is driven by demand for high-density chip integration, regional supply chain resilience, and the need for advanced automotive-grade testing. OSAT providers are adopting system-in-package, wafer-level packaging, and AI-powered validation tools to meet end-user demands across consumer electronics, automotive, and telecommunications.

Outsourced Semiconductor Assembly and Test (OSAT) Market Report Highlights

Based on service type, the testing segment captured the dominant revenue share in 2024. This leadership position stems from escalating quality assurance requirements and reliability benchmarks across diverse semiconductor applications.

In terms of type of packaging, the chip-scale packaging (CSP) solutions are anticipated to experience accelerated adoption during the forecast period, responding to industry demands for miniaturized yet high-performance packaging formats in mobile devices and wearable technologies.

Asia Pacific's outsourced semiconductor assembly and test (OSAT) sector secured the largest global market share in 2024, benefiting from the region's mature semiconductor fabrication ecosystem and mass-scale integrated circuit production capabilities.

North American OSAT industry is poised to register the fastest growth rate through 2034, fueled by expanding domestic semiconductor manufacturing activities and strategic initiatives to strengthen supply chain independence.

A few global key market players include ASE Technology Holding Co., Ltd., Amkor Technology, Inc., JCET Group Co., Ltd., Powertech Technology Inc., Tongfu Microelectronics Co., Ltd., UTAC Holdings Ltd., ChipMOS Technologies Inc., Hana Micron Inc., Unisem Group, Walton Advanced Engineering Inc., Signetics Corporation, and Lingsen Precision Industries, Ltd.

Polaris Market Research has segmented the market report on the basis of service type, type of packaging, end user, and region:

By Service Type Outlook (Revenue, USD Billion, 2020-2034)

Assembly & Packaging

Ball Grid Array Packaging

Chip Scale Packaging

Multi-chip Packaging

Stacked Die Packaging

Quad-flat & Dual-inline Packaging

Testing

By Type of Packaging Outlook (Revenue, USD Billion, 2020-2034)

Ball Grid Array (BGA) Packaging

Chip-scale Packaging (CSP)

Stacked Die Packaging

Multi-chip Packaging

Quad Flat and Dual-inline Packaging

By End User Outlook (Revenue, USD Billion, 2020-2034)

Consumer Electronics

Industrial

Telecommunication

Automotive

Aerospace & Defense

Medical & Healthcare

Logistics & Transportation

By Regional Outlook (Revenue, USD Billion, 2020-2034)

North America

US

Canada

Europe

Germany

France

UK

Italy

Spain

Netherlands

Russia

Rest of Europe

Asia Pacific

China

Japan

India

Malaysia

South Korea

Indonesia

Australia

Vietnam

Rest of Asia Pacific

Middle East & Africa

Saudi Arabia

UAE

Israel

South Africa

Rest of Middle East & Africa

Latin America

Mexico

Brazil

Argentina

Rest of Latin America

Table of Contents

1. Introduction

  • 1.1. Report Description
    • 1.1.1. Objectives of the Study
    • 1.1.2. Market Scope
    • 1.1.3. Assumptions
  • 1.2. Stakeholders

2. Executive Summary

  • 2.1. Market Highlights

3. Research Methodology

  • 3.1. Overview
    • 3.1.1. Data Mining
  • 3.2. Data Sources
    • 3.2.1. Primary Sources
    • 3.2.2. Secondary Sources

4. Global Outsourced Semiconductor Assembly and Test (OSAT) Market Insights

  • 4.1. Outsourced Semiconductor Assembly and Test (OSAT) Market - Market Snapshot
  • 4.2. Outsourced Semiconductor Assembly and Test (OSAT) Market Dynamics
    • 4.2.1. Drivers and Opportunities
      • 4.2.1.1. Rapidly Increasing Consumer Devices Across the Globe
      • 4.2.1.2. Growing Adoption of Electric Vehicles Featuring ADAS Technology
    • 4.2.2. Restraints and Challenges
      • 4.2.2.1. High Capital Intensity of Advanced Packaging Equipment
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers (Moderate)
    • 4.3.2. Threats of New Entrants: (Low)
    • 4.3.3. Bargaining Power of Buyers (Moderate)
    • 4.3.4. Threat of Substitute (Moderate)
    • 4.3.5. Rivalry among existing firms (High)
  • 4.4. PESTEL Analysis
  • 4.5. Outsourced Semiconductor Assembly and Test (OSAT) Market Trends
  • 4.6. Value Chain Analysis

5. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type

  • 5.1. Key Findings
  • 5.2. Introduction
    • 5.2.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
  • 5.3. Assembly & Packaging
    • 5.3.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Assembly & Packaging, by Region, 2020-2034 (USD Billion)
  • 5.4. Testing
    • 5.4.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Testing, by Region, 2020-2034 (USD Billion)

6. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging

  • 6.1. Key Findings
  • 6.2. Introduction
    • 6.2.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
  • 6.3. Ball Grid Array (BGA) Packaging
    • 6.3.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Ball Grid Array (BGA) Packaging, by Region, 2020-2034 (USD Billion)
  • 6.4. Chip-scale Packaging (CSP)
    • 6.4.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Chip-scale Packaging (CSP), by Region, 2020-2034 (USD Billion)
  • 6.5. Stacked Die Packaging
    • 6.5.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Stacked Die Packaging, by Region, 2020-2034 (USD Billion)
  • 6.6. Multi-chip Packaging
    • 6.6.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Multi-chip Packaging, by Region, 2020-2034 (USD Billion)
  • 6.7. Quad Flat and Dual-inline Packaging
    • 6.7.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Quad Flat and Dual-inline Packaging, by Region, 2020-2034 (USD Billion)

7. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User

  • 7.1. Key Findings
  • 7.2. Introduction
    • 7.2.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
  • 7.3. Consumer Electronics
    • 7.3.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Consumer Electronics, by Region, 2020-2034 (USD Billion)
  • 7.4. Industrial
    • 7.4.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Industrial, by Region, 2020-2034 (USD Billion)
  • 7.5. Telecommunication
    • 7.5.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Telecommunication, by Region, 2020-2034 (USD Billion)
  • 7.6. Automotive
    • 7.6.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Automotive, by Region, 2020-2034 (USD Billion)
  • 7.7. Aerospace & Defense
    • 7.7.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Aerospace & Defense, by Region, 2020-2034 (USD Billion)
  • 7.8. Medical & Healthcare
    • 7.8.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Medical & Healthcare, by Region, 2020-2034 (USD Billion)
  • 7.9. Logistics & Transportation
    • 7.9.1. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Logistics & Transportation, by Region, 2020-2034 (USD Billion)

8. Global Outsourced Semiconductor Assembly and Test (OSAT) Market, by Geography

  • 8.1. Key Findings
  • 8.2. Introduction
    • 8.2.1. Outsourced Semiconductor Assembly and Test (OSAT) Market Assessment, By Geography, 2020-2034 (USD Billion)
  • 8.3. Outsourced Semiconductor Assembly and Test (OSAT) Market - North America
    • 8.3.1. North America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
    • 8.3.2. North America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
    • 8.3.3. North America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.3.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - U.S.
      • 8.3.4.1. U.S.: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.3.4.2. U.S.: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.3.4.3. U.S.: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.3.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - Canada
      • 8.3.5.1. Canada: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.3.5.2. Canada: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.3.5.3. Canada: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
  • 8.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - Europe
    • 8.4.1. Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
    • 8.4.2. Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
    • 8.4.3. Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - UK
      • 8.4.4.1. UK: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.4.2. UK: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.4.3. UK: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - France
      • 8.4.5.1. France: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.5.2. France: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.5.3. France: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.6. Outsourced Semiconductor Assembly and Test (OSAT) Market - Germany
      • 8.4.6.1. Germany: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.6.2. Germany: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.6.3. Germany: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.7. Outsourced Semiconductor Assembly and Test (OSAT) Market - Italy
      • 8.4.7.1. Italy: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.7.2. Italy: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.7.3. Italy: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.8. Outsourced Semiconductor Assembly and Test (OSAT) Market - Spain
      • 8.4.8.1. Spain: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.8.2. Spain: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.8.3. Spain: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.9. Outsourced Semiconductor Assembly and Test (OSAT) Market - Netherlands
      • 8.4.9.1. Netherlands: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.9.2. Netherlands: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.9.3. Netherlands: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.10. Outsourced Semiconductor Assembly and Test (OSAT) Market - Russia
      • 8.4.10.1. Russia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.10.2. Russia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.10.3. Russia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.4.11. Outsourced Semiconductor Assembly and Test (OSAT) Market - Rest of Europe
      • 8.4.11.1. Rest of Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.4.11.2. Rest of Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.4.11.3. Rest of Europe: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
  • 8.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - Asia Pacific
    • 8.5.1. Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
    • 8.5.2. Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
    • 8.5.3. Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - China
      • 8.5.4.1. China: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.4.2. China: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.4.3. China: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - India
      • 8.5.5.1. India: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.5.2. India: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.5.3. India: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.6. Outsourced Semiconductor Assembly and Test (OSAT) Market - Malaysia
      • 8.5.6.1. Malaysia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.6.2. Malaysia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.6.3. Malaysia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.7. Outsourced Semiconductor Assembly and Test (OSAT) Market - Japan
      • 8.5.7.1. Japan: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.7.2. Japan: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.7.3. Japan: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.8. Outsourced Semiconductor Assembly and Test (OSAT) Market - Indonesia
      • 8.5.8.1. Indonesia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.8.2. Indonesia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.8.3. Indonesia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.9. Outsourced Semiconductor Assembly and Test (OSAT) Market - South Korea
      • 8.5.9.1. South Korea: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.9.2. South Korea: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.9.3. South Korea: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.10. Outsourced Semiconductor Assembly and Test (OSAT) Market - Australia
      • 8.5.10.1. Australia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.10.2. Australia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.10.3. Australia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.5.11. Outsourced Semiconductor Assembly and Test (OSAT) Market - Rest of Asia Pacific
      • 8.5.11.1. Rest of Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.5.11.2. Rest of Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.5.11.3. Rest of Asia Pacific: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
  • 8.6. Outsourced Semiconductor Assembly and Test (OSAT) Market - Middle East & Africa
    • 8.6.1. Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
    • 8.6.2. Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
    • 8.6.3. Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.6.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - Saudi Arabia
      • 8.6.4.1. Saudi Arabia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.6.4.2. Saudi Arabia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.6.4.3. Saudi Arabia: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.6.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - UAE
      • 8.6.5.1. UAE: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.6.5.2. UAE: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.6.5.3. UAE: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.6.6. Outsourced Semiconductor Assembly and Test (OSAT) Market - Israel
      • 8.6.6.1. Israel: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.6.6.2. Israel: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.6.6.3. Israel: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.6.7. Outsourced Semiconductor Assembly and Test (OSAT) Market - South Africa
      • 8.6.7.1. South Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.6.7.2. South Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.6.7.3. South Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.6.8. Outsourced Semiconductor Assembly and Test (OSAT) Market - Rest of Middle East & Africa
      • 8.6.8.1. Rest of Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.6.8.2. Rest of Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.6.8.3. Rest of Middle East & Africa: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
  • 8.7. Outsourced Semiconductor Assembly and Test (OSAT) Market - Latin America
    • 8.7.1. Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
    • 8.7.2. Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
    • 8.7.3. Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.7.4. Outsourced Semiconductor Assembly and Test (OSAT) Market - Mexico
      • 8.7.4.1. Mexico: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.7.4.2. Mexico: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.7.4.3. Mexico: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.7.5. Outsourced Semiconductor Assembly and Test (OSAT) Market - Brazil
      • 8.7.5.1. Brazil: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.7.5.2. Brazil: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.7.5.3. Brazil: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.7.6. Outsourced Semiconductor Assembly and Test (OSAT) Market - Argentina
      • 8.7.6.1. Argentina: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.7.6.2. Argentina: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.7.6.3. Argentina: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)
    • 8.7.7. Outsourced Semiconductor Assembly and Test (OSAT) Market - Rest of Latin America
      • 8.7.7.1. Rest of Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Service Type, 2020-2034 (USD Billion)
      • 8.7.7.2. Rest of Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by Type of Packaging, 2020-2034 (USD Billion)
      • 8.7.7.3. Rest of Latin America: Outsourced Semiconductor Assembly and Test (OSAT) Market, by End User, 2020-2034 (USD Billion)

9. Competitive Landscape

  • 9.1. Expansion and Acquisition Analysis
    • 9.1.1. Expansion
    • 9.1.2. Acquisitions
  • 9.2. Partnerships/Collaborations/Agreements/Exhibitions

10. Company Profiles

  • 10.1. Amkor Technology, Inc.
    • 10.1.1. Company Overview
    • 10.1.2. Financial Performance
    • 10.1.3. Product Benchmarking
    • 10.1.4. Recent Development
  • 10.2. ASE Technology Holding Co., Ltd.
    • 10.2.1. Company Overview
    • 10.2.2. Financial Performance
    • 10.2.3. Product Benchmarking
    • 10.2.4. Recent Development
  • 10.3. ChipMOS Technologies Inc.
    • 10.3.1. Company Overview
    • 10.3.2. Financial Performance
    • 10.3.3. Product Benchmarking
    • 10.3.4. Recent Development
  • 10.4. Hana Micron Inc.
    • 10.4.1. Company Overview
    • 10.4.2. Financial Performance
    • 10.4.3. Product Benchmarking
    • 10.4.4. Recent Development
  • 10.5. JCET Group Co., Ltd.
    • 10.5.1. Company Overview
    • 10.5.2. Financial Performance
    • 10.5.3. Product Benchmarking
    • 10.5.4. Recent Development
  • 10.6. Lingsen Precision Industries, Ltd.
    • 10.6.1. Company Overview
    • 10.6.2. Financial Performance
    • 10.6.3. Product Benchmarking
    • 10.6.4. Recent Development
  • 10.7. Powertech Technology Inc.
    • 10.7.1. Company Overview
    • 10.7.2. Financial Performance
    • 10.7.3. Product Benchmarking
    • 10.7.4. Recent Development
  • 10.8. Signetics Corporation
    • 10.8.1. Company Overview
    • 10.8.2. Financial Performance
    • 10.8.3. Product Benchmarking
    • 10.8.4. Recent Development
  • 10.9. Tongfu Microelectronics Co., Ltd.
    • 10.9.1. Company Overview
    • 10.9.2. Financial Performance
    • 10.9.3. Product Benchmarking
    • 10.9.4. Recent Development
  • 10.10. Unisem Group
    • 10.10.1. Company Overview
    • 10.10.2. Financial Performance
    • 10.10.3. Product Benchmarking
    • 10.10.4. Recent Development
  • 10.11. UTAC Holdings Ltd.
    • 10.11.1. Company Overview
    • 10.11.2. Financial Performance
    • 10.11.3. Product Benchmarking
    • 10.11.4. Recent Development
  • 10.12. Walton Advanced Engineering Inc.
    • 10.12.1. Company Overview
    • 10.12.2. Financial Performance
    • 10.12.3. Product Benchmarking
    • 10.12.4. Recent Development
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