세계의 언더필 시장 : 시장 점유율과 순위, 전체 판매 및 수요 예측(2025-2031년)

The global market for Underfill was estimated to be worth US$ 737 million in 2024 and is forecast to a readjusted size of US$ 1344 million by 2031 with a CAGR of 8.5% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Underfill cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Underfill materials are a type of specialized material used in the field of electronic packaging, primarily designed to fill the gaps between integrated circuits (ICs) and printed circuit boards (PCBs) to enhance the reliability and durability of electronic components. Underfill materials are typically made from high-performance substances such as epoxy resins, cyanate esters, and silicone resins, which possess excellent fluidity, thermal stability, mechanical shock resistance, and low coefficient of expansion. These materials effectively reduce thermal stress caused by thermal cycling, ensuring that the packaged structure remains stable and durable during use. They are mainly used in semiconductor packaging, especially in packaging types such as Ball Grid Array (BGA) and Chip-on-Substrate (CSP).

The variety of underfill materials is broad, with different formulations tailored to specific application requirements. For example, fast-curing underfill materials are suitable for high-efficiency production environments, while materials with low expansion coefficients are ideal for applications requiring high thermal stability. In addition, as electronic products continue to demand higher performance, new types of underfill materials have emerged, including those with better thermal conductivity, moisture resistance, and enhanced adhesion properties. The application range of these materials is not limited to traditional consumer electronics but is gradually expanding to fields such as automotive electronics, medical electronics, and aerospace. Driven by emerging technologies like 5G and the Internet of Things (IoT), the demand for underfill materials is increasing, further boosting market growth.

The underfill material market has experienced steady growth over the past few years, driven by several factors. First, the performance requirements of electronic products have been increasingly demanding, particularly with the growing density of integrated circuit packaging, which has raised the standards for underfill materials. Additionally, the widespread adoption of 5G, the Internet of Things (IoT), and smart devices has positively impacted market demand. These emerging technologies require smaller, more efficient, and reliable electronic components, leading to the broader application of underfill materials in new scenarios.

The main risks facing the market include fluctuations in raw material prices, instability in the supply chain, and increasingly stringent environmental regulations. The production process of some underfill materials can have certain environmental impacts, and changes in environmental regulations may exert pressure on the market. Furthermore, the technology barriers for underfill materials are high, requiring continuous innovation to meet more complex and diversified needs. This means that leading companies in the market, with their technological advantages and innovation capabilities, have captured a significant market share, resulting in a relatively concentrated market structure.

In terms of downstream demand, the demand from consumer electronics, automotive electronics, and industrial electronics continues to grow, particularly in the fields of smartphones, automotive electronics, and medical devices, where the demand for underfill materials is on the rise. As intelligent and high-performance electronic products become more widespread, the demand for high-performance and highly reliable underfill materials has become stronger.

In terms of the latest technologies, thermally conductive underfill materials, low expansion coefficient materials, and environmentally friendly materials are becoming mainstream trends in the market. Thermally conductive materials can significantly improve the heat dissipation performance of packaging, especially in high-power electronic components. Low expansion coefficient materials are suitable for applications in environments with high temperature variations. Environmentally friendly underfill materials, with their low environmental impact and compliance with stringent environmental standards, are increasingly favored by customers.

This report aims to provide a comprehensive presentation of the global market for Underfill, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Underfill by region & country, by Type, and by Application.

The Underfill market size, estimations, and forecasts are provided in terms of sales volume (MT) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Underfill.

Market Segmentation

By Company

• Henkel
• Won Chemical
• NAMICS Corporation
• Panasonic Lexcm
• Resonac
• Hanstars
• Shin-Etsu Chemical
• MacDermid Alpha
• ThreeBond
• Parker LORD
• Nagase ChemteX
• Bondline
• AIM Solder
• Zymet
• Panacol-Elosol GmbH
• Master Bond
• Dover Chemical
• Darbond Technology
• Yantai Hightite Chemicals
• Sunstar
• DeepMaterial

Segment by Type

• Wafer and Panel-Level Underfill
• Board-Level Underfill

Segment by Application

• Industrial Electronics
• Consumer Electronics
• Automotive Electronics
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Underfill manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Underfill in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Underfill in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Underfill Product Introduction
• 1.2 Global Underfill Market Size Forecast
  • 1.2.1 Global Underfill Sales Value (2020-2031)
  • 1.2.2 Global Underfill Sales Volume (2020-2031)
  • 1.2.3 Global Underfill Sales Price (2020-2031)
• 1.3 Underfill Market Trends & Drivers
  • 1.3.1 Underfill Industry Trends
  • 1.3.2 Underfill Market Drivers & Opportunity
  • 1.3.3 Underfill Market Challenges
  • 1.3.4 Underfill Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Underfill Players Revenue Ranking (2024)
• 2.2 Global Underfill Revenue by Company (2020-2025)
• 2.3 Global Underfill Players Sales Volume Ranking (2024)
• 2.4 Global Underfill Sales Volume by Company Players (2020-2025)
• 2.5 Global Underfill Average Price by Company (2020-2025)
• 2.6 Key Manufacturers Underfill Manufacturing Base and Headquarters
• 2.7 Key Manufacturers Underfill Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of Underfill
• 2.9 Underfill Market Competitive Analysis
  • 2.9.1 Underfill Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by Underfill Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Underfill as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 Wafer and Panel-Level Underfill
  • 3.1.2 Board-Level Underfill
• 3.2 Global Underfill Sales Value by Type
  • 3.2.1 Global Underfill Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Underfill Sales Value, by Type (2020-2031)
  • 3.2.3 Global Underfill Sales Value, by Type (%) (2020-2031)
• 3.3 Global Underfill Sales Volume by Type
  • 3.3.1 Global Underfill Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global Underfill Sales Volume, by Type (2020-2031)
  • 3.3.3 Global Underfill Sales Volume, by Type (%) (2020-2031)
• 3.4 Global Underfill Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 Industrial Electronics
  • 4.1.2 Consumer Electronics
  • 4.1.3 Automotive Electronics
  • 4.1.4 Others
• 4.2 Global Underfill Sales Value by Application
  • 4.2.1 Global Underfill Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Underfill Sales Value, by Application (2020-2031)
  • 4.2.3 Global Underfill Sales Value, by Application (%) (2020-2031)
• 4.3 Global Underfill Sales Volume by Application
  • 4.3.1 Global Underfill Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global Underfill Sales Volume, by Application (2020-2031)
  • 4.3.3 Global Underfill Sales Volume, by Application (%) (2020-2031)
• 4.4 Global Underfill Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global Underfill Sales Value by Region
  • 5.1.1 Global Underfill Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Underfill Sales Value by Region (2020-2025)
  • 5.1.3 Global Underfill Sales Value by Region (2026-2031)
  • 5.1.4 Global Underfill Sales Value by Region (%), (2020-2031)
• 5.2 Global Underfill Sales Volume by Region
  • 5.2.1 Global Underfill Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global Underfill Sales Volume by Region (2020-2025)
  • 5.2.3 Global Underfill Sales Volume by Region (2026-2031)
  • 5.2.4 Global Underfill Sales Volume by Region (%), (2020-2031)
• 5.3 Global Underfill Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America Underfill Sales Value, 2020-2031
  • 5.4.2 North America Underfill Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe Underfill Sales Value, 2020-2031
  • 5.5.2 Europe Underfill Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific Underfill Sales Value, 2020-2031
  • 5.6.2 Asia Pacific Underfill Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America Underfill Sales Value, 2020-2031
  • 5.7.2 South America Underfill Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa Underfill Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa Underfill Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Underfill Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Underfill Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions Underfill Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions Underfill Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States Underfill Sales Value, 2020-2031
  • 6.3.2 United States Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Underfill Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Underfill Sales Value, 2020-2031
  • 6.4.2 Europe Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Underfill Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Underfill Sales Value, 2020-2031
  • 6.5.2 China Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Underfill Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Underfill Sales Value, 2020-2031
  • 6.6.2 Japan Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Underfill Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Underfill Sales Value, 2020-2031
  • 6.7.2 South Korea Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Underfill Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Underfill Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Underfill Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Underfill Sales Value, 2020-2031
  • 6.9.2 India Underfill Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Underfill Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Henkel
  • 7.1.1 Henkel Company Information
  • 7.1.2 Henkel Introduction and Business Overview
  • 7.1.3 Henkel Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Henkel Underfill Product Offerings
  • 7.1.5 Henkel Recent Development
• 7.2 Won Chemical
  • 7.2.1 Won Chemical Company Information
  • 7.2.2 Won Chemical Introduction and Business Overview
  • 7.2.3 Won Chemical Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Won Chemical Underfill Product Offerings
  • 7.2.5 Won Chemical Recent Development
• 7.3 NAMICS Corporation
  • 7.3.1 NAMICS Corporation Company Information
  • 7.3.2 NAMICS Corporation Introduction and Business Overview
  • 7.3.3 NAMICS Corporation Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 NAMICS Corporation Underfill Product Offerings
  • 7.3.5 NAMICS Corporation Recent Development
• 7.4 Panasonic Lexcm
  • 7.4.1 Panasonic Lexcm Company Information
  • 7.4.2 Panasonic Lexcm Introduction and Business Overview
  • 7.4.3 Panasonic Lexcm Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 Panasonic Lexcm Underfill Product Offerings
  • 7.4.5 Panasonic Lexcm Recent Development
• 7.5 Resonac
  • 7.5.1 Resonac Company Information
  • 7.5.2 Resonac Introduction and Business Overview
  • 7.5.3 Resonac Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Resonac Underfill Product Offerings
  • 7.5.5 Resonac Recent Development
• 7.6 Hanstars
  • 7.6.1 Hanstars Company Information
  • 7.6.2 Hanstars Introduction and Business Overview
  • 7.6.3 Hanstars Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 Hanstars Underfill Product Offerings
  • 7.6.5 Hanstars Recent Development
• 7.7 Shin-Etsu Chemical
  • 7.7.1 Shin-Etsu Chemical Company Information
  • 7.7.2 Shin-Etsu Chemical Introduction and Business Overview
  • 7.7.3 Shin-Etsu Chemical Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Shin-Etsu Chemical Underfill Product Offerings
  • 7.7.5 Shin-Etsu Chemical Recent Development
• 7.8 MacDermid Alpha
  • 7.8.1 MacDermid Alpha Company Information
  • 7.8.2 MacDermid Alpha Introduction and Business Overview
  • 7.8.3 MacDermid Alpha Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 MacDermid Alpha Underfill Product Offerings
  • 7.8.5 MacDermid Alpha Recent Development
• 7.9 ThreeBond
  • 7.9.1 ThreeBond Company Information
  • 7.9.2 ThreeBond Introduction and Business Overview
  • 7.9.3 ThreeBond Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 ThreeBond Underfill Product Offerings
  • 7.9.5 ThreeBond Recent Development
• 7.10 Parker LORD
  • 7.10.1 Parker LORD Company Information
  • 7.10.2 Parker LORD Introduction and Business Overview
  • 7.10.3 Parker LORD Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Parker LORD Underfill Product Offerings
  • 7.10.5 Parker LORD Recent Development
• 7.11 Nagase ChemteX
  • 7.11.1 Nagase ChemteX Company Information
  • 7.11.2 Nagase ChemteX Introduction and Business Overview
  • 7.11.3 Nagase ChemteX Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Nagase ChemteX Underfill Product Offerings
  • 7.11.5 Nagase ChemteX Recent Development
• 7.12 Bondline
  • 7.12.1 Bondline Company Information
  • 7.12.2 Bondline Introduction and Business Overview
  • 7.12.3 Bondline Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 Bondline Underfill Product Offerings
  • 7.12.5 Bondline Recent Development
• 7.13 AIM Solder
  • 7.13.1 AIM Solder Company Information
  • 7.13.2 AIM Solder Introduction and Business Overview
  • 7.13.3 AIM Solder Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 AIM Solder Underfill Product Offerings
  • 7.13.5 AIM Solder Recent Development
• 7.14 Zymet
  • 7.14.1 Zymet Company Information
  • 7.14.2 Zymet Introduction and Business Overview
  • 7.14.3 Zymet Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 Zymet Underfill Product Offerings
  • 7.14.5 Zymet Recent Development
• 7.15 Panacol-Elosol GmbH
  • 7.15.1 Panacol-Elosol GmbH Company Information
  • 7.15.2 Panacol-Elosol GmbH Introduction and Business Overview
  • 7.15.3 Panacol-Elosol GmbH Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.15.4 Panacol-Elosol GmbH Underfill Product Offerings
  • 7.15.5 Panacol-Elosol GmbH Recent Development
• 7.16 Master Bond
  • 7.16.1 Master Bond Company Information
  • 7.16.2 Master Bond Introduction and Business Overview
  • 7.16.3 Master Bond Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.16.4 Master Bond Underfill Product Offerings
  • 7.16.5 Master Bond Recent Development
• 7.17 Dover Chemical
  • 7.17.1 Dover Chemical Company Information
  • 7.17.2 Dover Chemical Introduction and Business Overview
  • 7.17.3 Dover Chemical Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.17.4 Dover Chemical Underfill Product Offerings
  • 7.17.5 Dover Chemical Recent Development
• 7.18 Darbond Technology
  • 7.18.1 Darbond Technology Company Information
  • 7.18.2 Darbond Technology Introduction and Business Overview
  • 7.18.3 Darbond Technology Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.18.4 Darbond Technology Underfill Product Offerings
  • 7.18.5 Darbond Technology Recent Development
• 7.19 Yantai Hightite Chemicals
  • 7.19.1 Yantai Hightite Chemicals Company Information
  • 7.19.2 Yantai Hightite Chemicals Introduction and Business Overview
  • 7.19.3 Yantai Hightite Chemicals Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.19.4 Yantai Hightite Chemicals Underfill Product Offerings
  • 7.19.5 Yantai Hightite Chemicals Recent Development
• 7.20 Sunstar
  • 7.20.1 Sunstar Company Information
  • 7.20.2 Sunstar Introduction and Business Overview
  • 7.20.3 Sunstar Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.20.4 Sunstar Underfill Product Offerings
  • 7.20.5 Sunstar Recent Development
• 7.21 DeepMaterial
  • 7.21.1 DeepMaterial Company Information
  • 7.21.2 DeepMaterial Introduction and Business Overview
  • 7.21.3 DeepMaterial Underfill Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.21.4 DeepMaterial Underfill Product Offerings
  • 7.21.5 DeepMaterial Recent Development

8 Industry Chain Analysis

• 8.1 Underfill Industrial Chain
• 8.2 Underfill Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Underfill Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Underfill Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer