세계의 웨이퍼 레벨 포장 시장 예측(-2030년) : 패키지 유형별, 상호 접속 기술별, 최종 사용자별, 지역별 분석

According to Stratistics MRC, the Global Wafer Level Packaging Market is accounted for $9.58 billion in 2024 and is expected to reach $29.78 billion by 2030 growing at a CAGR of 20.8% during the forecast period. Wafer Level Packaging (WLP) is a state-of-the-art semiconductor packaging method that encapsulates chips at the wafer level prior to their separation into separate pieces. By doing away with the need for conventional packaging procedures, which are typically performed after the wafer is cut, this technique offers benefits like smaller size, improved performance, and cheaper production costs. Moreover, WLP is particularly well suited for small, high-performing devices like wearables, smartphones, and automotive electronics because it positions components close together, allowing for high-density interconnections, better thermal management, and faster signal transmission.

According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market, which includes wafer level packaging, is expected to grow significantly, with sales expected to reach $551 billion in 2021.

Market Dynamics:

Driver:

Demand for chips with superior performance

Wafer-level packaging adoption is being driven by the growing demand for modern electronics to have higher bandwidth, faster processing speeds, and lower power consumption. As chips get more sophisticated, particularly in industries like gaming, telecommunications, and high-performance computing, they need packaging solutions that can meet these demands. Additionally, WLP offers a number of advantages over conventional packaging techniques, including improved power efficiency, higher signal integrity, and better electrical performance.

Restraint:

Expensive initial investment costs

The high upfront cost of specialized tools and technologies is one of the major obstacles to Wafer Level Packaging adoption. Advanced manufacturing infrastructure, such as specialized tools for die testing, encapsulation, and wafer bonding, is required to implement WLP. Furthermore, these systems can be costly, especially for small and mid-sized businesses that might lack the funds to purchase the required machinery. In order to improve methods and reach targeted performance standards, the process also entails high research and development (R&D) expenses.

Opportunity:

Developments in wearable technology and medical devices

Wafer Level Packaging has significant prospects in the medical device sector, especially given the growing popularity of wearable medical technology. These small, light devices need powerful sensors, processors, and communication modules to track health information like blood sugar, heart rate, and even brain activity. The development of non-invasive, wearable health monitoring devices depends on the ability to combine these diverse components into a single, compact package, which WLP makes possible. Moreover, WLP is also applicable to diagnostic equipment that needs small electronics to fit into limited spaces and implantable medical devices that must function dependably in confined spaces.

Threat:

Competitive pressure from other packaging technologies

Alternative cutting-edge packaging technologies that can provide comparable advantages pose a serious threat to the wafer-level packaging market. With comparable benefits like lower environmental impact, enhanced performance, and cost-effectiveness, technologies like System-in-Package (SiP), 3D packaging, flip-chip, and Chip-on-Board (COB) are vying for market share. Additionally, in some applications, like memory modules or high-performance computing, where vertical integration is desired, 3D packaging, which entails stacking multiple chips vertically, may be more appropriate.

Covid-19 Impact:

Wafer Level Packaging (WLP) was significantly impacted by the COVID-19 pandemic, which mainly disrupted global supply chains and semiconductor manufacturing processes. Production delays and longer lead times for essential materials resulted from labor shortages, travel restrictions, and factory closures, which impacted the timely delivery of WLP solutions. Furthermore, a brief slowdown in market expansion was caused by the economic uncertainty and a decline in consumer demand for electronic products during the early stages of the pandemic. But as businesses adjusted to the new normal, the demand for medical, automotive, and consumer electronics devices increased, necessitating the use of cutting-edge packaging technologies like WLP.

The Wafer Level Chip Scale Packaging (WLCSP) segment is expected to be the largest during the forecast period

The Wafer Level Packaging (WLP) market is expected to be dominated by the Wafer Level Chip Scale Packaging (WLCSP) segment. Because it offers a small, affordable, and effective substitute for conventional packaging techniques, WLCSP is a widely used packaging solution. It entails putting the chip straight onto the package with few extra parts, greatly reducing the device's size and weight, making it perfect for wearables, smartphones, and consumer electronics applications. Moreover, the widespread use of WLCSP is being driven by the increasing demand for more compact, powerful electronic devices that perform better and use less energy.

The Copper Pillar segment is expected to have the highest CAGR during the forecast period

In the Wafer Level Packaging (WLP) market, the Copper Pillar segment is expected to have the highest CAGR. Because copper pillar technology can enhance semiconductor devices' performance and dependability, especially in high-density and high-performance applications, it is rapidly gaining popularity. Additionally, this packaging technique offers superior electro migration resistance, increased mechanical strength, and improved thermal conductivity by substituting copper pillars for conventional solder bumps. Because of these benefits, copper pillar packaging is especially well-suited for cutting-edge uses like high-performance computing, automotive electronics, and 5G.

Region with largest share:

Due to the presence of important semiconductor manufacturing hubs, such as China, Japan, South Korea, and Taiwan, the Asia-Pacific (APAC) region commands the largest share of the Wafer Level Packaging (WLP) market. Large companies in the electronics and semiconductor sectors, including ASE Group, Samsung, and TSMC, are based in Asia. To keep up with the increasing demand for faster, more compact, and more effective electronic devices, these companies make significant investments in cutting-edge packaging technologies like WLP. Furthermore, the region's robust manufacturing base, along with rapid technological innovation and adoption in the automotive, telecommunications, and consumer electronics industries, supports APAC's ongoing dominance in the WLP market.

Region with highest CAGR:

The Wafer Level Packaging (WLP) market is anticipated to grow at the highest CAGR in the North American region. The demand for sophisticated semiconductor packaging is rising in sectors like consumer electronics, healthcare, automotive, and telecommunications, especially as 5G, driverless cars, and the Internet of Things (IoT) become more prevalent. Numerous top semiconductor companies and research institutes that are at the forefront of packaging technology innovation are based in North America. Moreover, the need for sophisticated WLP solutions is further accelerated by the expanding use of data centers, artificial intelligence (AI), and high-performance computing.

Key players in the market

Some of the key players in Wafer Level Packaging market include Amkor Technology, Inc., Fujitsu Limited, Nordson Corporation, Toshiba Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Siliconware Precision Industries Co., Ltd., Deca Technologies, Inc, Nemotek Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company Limited, KLA Corporation, Applied Materials, Inc., ChipMOS Technologies Inc. and Tokyo Electron Ltd.

Key Developments:

In September 2024, Fujitsu Limited and Stellar Science Foundation, a General Incorporated Association have entered into a partnership focused on discovering and supporting the next generation of scientific researchers and fostering the creation of cutting-edge research topics.

In May 2024, Nordson Corporation announced that it has entered into a definitive agreement to acquire Atrion Corporation, a leader in proprietary medical infusion fluid delivery and niche cardiovascular solutions, for $460.00 per share in cash. This reflects a valuation of 15X Atrion's 2024 full-year estimated EBITDA, inclusive of synergies Nordson expects to generate in the first two years of its ownership.

In May 2024, Amkor Technology, Inc. announced that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Under the long-term supply agreement, Amkor will receive the substantial majority of IBM's subcontract wire bond and flip chip assembly and final test.

Package Types Covered:

• Fan-in Wafer Level Packaging (FI-WLP)
• Fan-out Wafer Level Packaging (FO-WLP)
• 3D TSV WLP
• 2.5D TSV WLP
• Wafer Level Chip Scale Package (WLCSP)

Interconnect Technologies Covered:

• Through-Silicon Via (TSV)
• Solder Bumping
• Copper Pillar
• Flip Chip

End Users Covered:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Wafer Level Packaging Market, By Package Type

• 5.1 Introduction
• 5.2 Fan-in Wafer Level Packaging (FI-WLP)
• 5.3 Fan-out Wafer Level Packaging (FO-WLP)
• 5.4 3D TSV WLP
• 5.5 2.5D TSV WLP
• 5.6 Wafer Level Chip Scale Package (WLCSP)

6 Global Wafer Level Packaging Market, By Interconnect Technology

• 6.1 Introduction
• 6.2 Through-Silicon Via (TSV)
• 6.3 Solder Bumping
• 6.4 Copper Pillar
• 6.5 Flip Chip

7 Global Wafer Level Packaging Market, By End User

• 7.1 Introduction
• 7.2 Consumer Electronics
• 7.3 IT and Telecommunication
• 7.4 Automotive
• 7.5 Industrial
• 7.6 Aerospace & Defense
• 7.7 Healthcare
• 7.8 Other End Users

8 Global Wafer Level Packaging Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Amkor Technology, Inc.
• 10.2 Fujitsu Limited
• 10.3 Nordson Corporation
• 10.4 Toshiba Corporation
• 10.5 Lam Research Corporation
• 10.6 Qualcomm Technologies, Inc.
• 10.7 Siliconware Precision Industries Co., Ltd.
• 10.8 Deca Technologies, Inc
• 10.9 Nemotek Technology Inc.
• 10.10 Infineon Technologies AG
• 10.11 Taiwan Semiconductor Manufacturing Company Limited
• 10.12 KLA Corporation
• 10.13 Applied Materials, Inc.
• 10.14 ChipMOS Technologies Inc.
• 10.15 Tokyo Electron Ltd.