시장보고서
상품코드
1567380

CMP 부속품 시장 : 패드 컨디셔너, 필터, 링, 브러시(2024-2025년)

CMP Ancillaries: Pad-Conditioners, Filters, Rings, and Brushes Market Report 2024-2025

발행일: | 리서치사: TECHCET | 페이지 정보: 영문 | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

프로세스 통합에는 반도체 웨이퍼상 디바이스 구조를 구축하기 위해 얇고 균일한 평탄한 층을 만들어야 하므로 CMP 공정은 반도체 제조에 필수적이며, 새로운 디바이스 기술이 등장할 때마다 CMP 공정의 공정 수는 계속 증가하고 있습니다. 새로운 디바이스 기술은 더 많은 레이어, 새로운 재료, 더 엄격한 공정 제어 요구 사항, 첨단 포장을 위한 새로운 기술이 특징입니다. 이러한 제조 과제는 CMP 공정의 새로운 최적화와 지속적인 최적화가 필요합니다.

CMP 부속품 시장에 대해 조사했으며, 패드 컨디셔너, 리테이너 링, 슬러리 필터, PVA 브러시 시장 성장 촉진요인과 응용 시장의 점유율, 공급업체별 예측에 대해 분석하여 전해드립니다.

인포그래픽스

목차

제1장 개요

제2장 범위와 조사 방법

제3장 반도체 산업 시장 현황과 전망

  • 세계 경제와 산업 전체의 전망
  • 전자 제품 부문별 칩 판매
  • 반도체 제조의 성장과 확대
  • 정책과 무역의 동향과 영향
  • 반도체 재료의 개요

제4장 CMP 부속품 시장 동향

  • CMP 부속품 시장 동향
  • 기술 촉진요인, 중요한 변화와 이동
  • 지역별 동향

제5장 CMP 패드 컨디셔닝 디스크 통계와 예측

  • CMP 패드 컨디셔너 5년간 매출 예측
  • CMP 패드 컨디셔너 5년간 예측(대수별)
  • 패드 컨디셔너 시장 점유율
  • CMP 패드 컨디셔너 M&A 활동 - 발표와 파트너십
  • CMP 패드 컨디셔너 신규 참여 또는 공장 폐쇄
  • CMP 패드 컨디셔너의 가격 동향
  • CMP 패드 컨디셔너 시장 평가

제6장 CMP POU 슬러리 필터 시장 통계와 예측

  • CMP POU 슬러리 필터 5년간 매출 예측
  • CMP POU 슬러리 필터 시장 점유율
  • CMP POU 슬러리 필터 M&A 활동 발표 및 파트너십
  • 애널리스트 평가

제7장 CMP PVA 브러시 공급업체 시장 통계와 예측

  • CMP PVA 브러시 5년간 매출 예측
  • CMP PVA 브러시 5년간 예측(수량별)
  • PVA 브러시 시장 전체의 동향과 시장 점유율
  • CMP PVA 브러시 가격 동향
  • CMP PVA 브러시 시장에 관한 애널리스트의 평가

제8장 CMP 리테이닝 링 공급업체 시장 통계와 예측

  • 웨이퍼 연마 헤드용 CMP 리테이닝 링 5년간 매출 예측
  • CMP 리테이닝 링 5년간 예측(대수별)
  • 리테이닝 링 시장 점유율
  • CMP 리테이닝 링 시장에 관한 애널리스트의 평가

제9장 공급업체 개요

  • 3M
  • Abrasive Technology
  • Ehwa Diamond
  • Entegris
  • Kinik
  • 기타 20사 이상

제10장 부록

KSA 24.10.21

This report looks at the market drivers for pad conditioners, retaining rings, slurry filters, and PVA brushes and forecasts by application market shares suppliers. CMP processes are critical to semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers new materials tighter process control requirements and new techniques for advanced packaging.These manufacturing challenges require new and continued optimization for CMP processes.

INFOGRAPHICS

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

  • 1.1 CMP ANCILLARIES MARKET OVERVIEW
  • 1.2 CMP ANCILLARIES REVENUE TRENDS
  • 1.3 MARKET TRENDS IMPACTING CMP ANCILLARIES OUTLOOK
  • 1.4 YEAR 2024 IN REVIEW AND FIVE-YEAR FORECAST
    • 1.4.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST
    • 1.4.2 CMP POU SLURRY FILTER 5-YEAR REVENUE FORECAST
    • 1.4.3 CMP PVA BRUSH 5-YEAR REVENUE FORECAST
    • 1.4.4 CMP RETAINING RING FOR WAFER POLISHING HEADS 5-YEAR REVENUE FORECAST
  • 1.5 TECHNOLOGY TRENDS
  • 1.6 TOTAL PAD CONDITIONERS MARKET SHARE
  • 1.7 CMP POU SLURRY FILTER MARKET SHARE ESTIMATE
  • 1.8 TOTAL PVA BRUSH MARKET SHARE
  • 1.9 TOTAL RETAINING RING MARKET SHARE
  • 1.10 ANALYST ASSESSMENT

2 SCOPE AND METHODOLOGY

  • 2.1 SCOPE
  • 2.2 PURPOSE & METHODOLOGY
  • 2.3 OVERVIEW OF OTHER TECHCET CMRTM OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

  • 3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
    • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2 SEMICONDUCTOR SALES GROWTH
    • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
  • 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1 ELECTRONICS OUTLOOK
    • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
    • 3.2.3 SMARTPHONE OUTLOOK
    • 3.2.4 PC OUTLOOK
    • 3.2.5 SERVERS / IT MARKET
  • 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
    • 3.3.2 NEW FABS IN THE US
    • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
    • 3.3.4 EQUIPMENT SPENDING TRENDS
    • 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
    • 3.3.6 FAB INVESTMENT ASSESSMENT
  • 3.4 POLICY & TRADE TRENDS AND IMPACT
  • 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
    • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 CMP ANCILLARIES MARKET TRENDS

  • 4.1 CMP ANCILLARIES MARKET TRENDS
  • 4.2 TECHNOLOGY DRIVERS, MATERIAL CHANGES AND TRANSITIONS
    • 4.2.1 TECHNOLOGY TRENDS
    • 4.2.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS - MEMORY
    • 4.2.3 TECHNOLOGY DRIVERS AND MATERIAL ALTERNATIVES
    • 4.2.4 CMP FOR TSV
    • 4.2.4 TECHNICAL TRENDS IN ADVANCED PACKAGING
    • 4.2.5 CMP FOR GAA BACKSIDE POWER
    • 4.2.6 CMP OF SILICON CARBIDE
  • 4.3 REGIONAL TRENDS

5 CMP PAD CONDITIONING DISKS STATISTICS & FORECASTS

  • 5.1 CMP PAD CONDITIONERS 5-YEAR REVENUE FORECAST
    • 5.1.1 CMP PAD CONDITIONER TYPE 5-YEAR FORECAST
  • 5.2 CMP PAD CONDITIONERS 5-YEAR FORECAST BY UNITS
  • 5.3 TOTAL PAD CONDITIONERS MARKET SHARE
  • 5.4 CMP PAD CONDITIONERS M&A ACTIVITY- ANNOUNCEMENTS AND PARTNERSHIPS
  • 5.5 CMP PAD CONDITIONERS NEW ENTRANTS OR PLANT CLOSURES
  • 5.6 CMP PAD CONDITIONERS PRICING TRENDS
  • 5.7 TECHCET ANALYST ASSESSMENT OF CMP PAD CONDITIONERS MARKET

6 CMP POU* SLURRY FILTER MARKET STATISTICS & FORECASTS

  • 6.1 CMP POU SLURRY FILTER 5-YEAR REVENUE FORECAST
    • 6.1.1 CMP POU SLURRY FILTERS 5-YEAR FORECAST FORECAST BY UNITS
  • 6.2 CMP POU SLURRY FILTER MARKET SHARE ESTIMATE
  • 6.3 CMP POU SLURRY FILTER M&A ACTIVITY ANNOUNCEMENTS AND PARTNERSHIPS
  • 6.4 TECHCET ANALYST ASSESSMENT

7 CMP PVA BRUSH SUPPLIER MARKET STATISTICS & FORECASTS

  • 7.1 CMP PVA BRUSH 5-YEAR REVENUE FORECAST
  • 7.2 CMP PVA BRUSH 5-YEAR FORECAST BY UNITS
  • 7.3 TOTAL PVA BRUSH MARKET DYAMICS AND MARKET SHARE
  • 7.4 CMP PVA BRUSH PRICING TRENDS
  • 7.5 TECHCET ANALYST ASSESSMENT OF CMP PVA BRUSH MARKET

8 CMP RETAINING RING SUPPLIER MARKET STATISTICS & FORECASTS

  • 8.1 CMP RETAINING RING FOR WAFER POLISHING HEADS 5-YEAR REVENUE FORECAST
  • 8.2 CMP RETAINING RING 5-YEAR FORECAST BY UNITS
  • 8.3 TOTAL RETAINING RING MARKET SHARE
  • 8.4 TECHCET ANALYST ASSESSMENT OF CMP RETAINING RING MARKET

9 SUPPLIER PROFILES

  • 3M
  • Abrasive Technology
  • Ehwa Diamond
  • Entegris
  • Kinik
  • ...AND 20+ MORE

10 APPENDIX

  • APPENDIX A: CMP ANCILLARIES OVERVIEW
  • APPENDIX B: TECHCET WAFER START MODELING METHODOLOGY

FIGURES

  • FIGURE 1.1: FORECAST PERCENT OF CMP WAFER PASSES PER YEAR
  • FIGURE 1.2: TOTAL CMP ANCILLARIES REVENUES ($M USD)
  • FIGURE 1.3: CMP STEPS FOR ADVANCED DEVICES
  • FIGURE 1.4: 2024 CMP ANCILLARIES TRENDS/ LESSONS
  • FIGURE 1.5: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE
  • FIGURE 1.6: CMP POU SLURRY FILTERS REVENUE BY SLURRY TYPE
  • FIGURE 1.7: CMP PVA BRUSH REVENUES BY APPLICATION
  • FIGURE 1.8: CMP RETAINING RING REVENUE ($M USD) BY WAFER SIZE
  • FIGURE 1.9: CMOS TECHNOLOGY ROADMAP
  • FIGURE 1.10: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2023
  • FIGURE 1.11: 2023 POU SLURRY FILTER MARKET SHARE
  • FIGURE 1.12: PVA BRUSH SUPPLIER MARKET SHARES IN 2023
  • FIGURE 1.13: RETAINING RING SUPPLIER MARKET SHARES IN 2023
  • FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
  • FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
  • FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
  • FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
  • FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
  • FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
  • FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
  • FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
  • FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
  • FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
  • FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
  • FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
  • FIGURE 4.1: CMP ANCILLARIES REVENUE FOR 2024
  • FIGURE 4.2: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
  • FIGURE 4.3: 14NM VS. 7NM METALLIZATION TECHNIQUES
  • FIGURE 4.4: CMOS TECHNOLOGY ROADMAP
  • FIGURE 4.5: CMP STEPS FOR LOGIC NODES
  • FIGURE 4.6: CMOS TECHNOLOGY ROADMAP
  • FIGURE 4.7: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
  • FIGURE 4.8: STACKING FOR 3D NAND`
  • FIGURE 4.9: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
  • FIGURE 4.10: ADV LOGIC TRANSITION TO BACKSIDE POWER
  • FIGURE 4.11: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 4.12: KEY TRENDS IN ADVANCED PACKAGING
  • FIGURE 4.13: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 4.14: SILICON CARBIDE-BASED POWER DEVICE
  • FIGURE 4.15: ANCILLARIES % REVENUES 2024 REGIONAL HQ
  • FIGURE 5.1: CMP PAD CONDITIONERS REVENUE BY WAFER SIZE
  • FIGURE 5.2: % REVENUE INCREASE OF PRECISION CVD DIAMOND STONES WITH COMPLEXITY OF CMP APPLICATION FOR GAA AND 3D NAND/3D DRAM
  • FIGURE 5.3: FORECASTED PAD CONDITIONERS VOLUME DEMAND
  • FIGURE 5.4: PAD CONDITIONERS SUPPLIER MARKET SHARES IN 2023
  • FIGURE 6.1: CMP POU SLURRY FILTERS REVENUE BY SLURRY TYPE
  • FIGURE 6.2: CMP POU SLURRY FILTERS UNITS BY SLURRY TYPE
  • FIGURE 6.3: 2023 POU SLURRY FILTER MARKET SHARE
  • FIGURE 7.1: CMP PVA BRUSH REVENUES BY APPLICATION
  • FIGURE 7.2: FORECASTED PVA BRUSH UNITS DEMAND
  • FIGURE 7.3: PVA BRUSH SUPPLIER MARKET SHARES IN 2023
  • FIGURE 8.1: CMP RETAINING RING REVENUE ($M USD) BY WAFER SIZE
  • FIGURE 8.2: FORECASTED RETAINING RING UNITS DEMAND
  • FIGURE 8.3: RETAINING RING SUPPLIER MARKET SHARES IN 2023
  • FIGURE 10.1: CMP FOR IC MANUFACTURING PROCESS

TABLES

  • TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
  • TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
  • TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION
  • SERVICES MARKET SPENDING 2023
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