북미의 재분배층 재료 시장 예측(-2030년) : 지역별 분석 - 유형별[폴리이미드, 폴리벤조옥사졸, 벤조실로부텐, 기타], 용도별

The North America redistribution layer material market was valued at US$ 22.34 million in 2022 and is expected to reach US$ 58.86 million by 2030; it is estimated to grow at a CAGR of 12.9% from 2022 to 2030.

Growing Focus on AI-based Equipment and Tools Drive North America Redistribution Layer Material Market

The growing demand for AI-based equipment and tools is significantly impacting the North America redistribution layer material market. The quest for more advanced AI capabilities necessitates the development of more compact and densely integrated hardware components. Redistribution layer (RDL) materials are fundamental in enabling the miniaturization of semiconductor packages, which is essential to accommodate the increasing complexity of AI devices. As AI systems become more sophisticated, the demand for smaller and more efficient components grows. In addition, AI applications are known for their voracious appetite for high-performance computing, which inherently generates substantial heat. Efficient thermal management is paramount to ensure the reliability and longevity of AI hardware. RDL materials play a crucial role by enhancing thermal conductivity and heat dissipation properties. As AI equipment becomes more powerful and heat-intensive, the demand for advanced RDL materials that can effectively address these thermal challenges escalates.

Scalability is also a critical consideration in the AI realm. As AI technology proliferates across industries, the ability to scale up hardware production efficiently is paramount. RDL materials simplify the integration of additional components or chips, streamlining the manufacturing process and enabling rapid scalability. This is especially valuable as AI-based tools and equipment become increasingly essential in finance, healthcare, and manufacturing sectors.

AI systems are intricate and typically involve multiple chips, sensors, and processors that must communicate seamlessly to process and analyze data in real-time. The demand for improved connectivity and signal integrity within AI hardware is ever-increasing. RDL materials are pivotal in facilitating high-speed data transmission and ensuring that various components in AI systems work harmoniously. As AI applications span diverse industries, from healthcare to autonomous vehicles, the need for RDL materials capable of maintaining robust connections becomes even more apparent. Moreover, the AI landscape is characterized by rapid evolution and customization. Different industries have unique requirements for AI hardware solutions, necessitating flexibility in design and configuration. RDL materials enable manufacturers to tailor semiconductor packages to meet these specific demands. This customization capability drives the adoption of RDL materials, empowering AI equipment manufacturers to create specialized hardware optimized for various applications. The rapid economic growth and industrial development across the globe also drive increased investment in AI technology. This growth includes the development of smart cities, autonomous vehicles, and industry 4.0 initiatives, all of which rely on AI-based tools and equipment. As these initiatives gain momentum, the demand for RDL materials as a foundation element in semiconductor packaging grows in tandem. Thus, the escalating demand for AI-based equipment and tools is fostering the growth of the North America redistribution layer material market.

North America Redistribution Layer Material Market Overview

North America has a wide presence of IT service providers, financial industries, and government agencies. The rapid pace of technological development and supporting government regulations made North America the most promising market for data centers. There are more than 2,500 data centers and 2,200 service providers in the US. With the increasing demand from customer for high-quality products and services, growing IT sector, and rising number of data centers, many companies are constantly innovating and developing new products to provide the best possible services to their customers.

The manufacturing industry plays a vital role in the growth of the North American economy. The availability of efficient infrastructure in developed nations has enabled manufacturing companies to explore the limits of science, technology, and commerce. Further, the US manufacturing sector is the second largest in the world, and manufacturers of the country hold 12% of total output in the economy. Moreover, the US manufacturing industry is expected to grow rapidly in the coming years due to several favorable factors, including increased productivity owing to the adoption of new technologies; decreased gas prices; and high labor costs in emerging markets. OEMs across all industries in North America are scaling up automation to compete with global manufacturing hubs such as China and Japan. This has led to the rapid developments in advanced semiconductors.

Also, the manufacturing industry in Mexico is witnessing significant growth due to government initiatives for attracting FDIs, as well as its proximity to the US and ability to achieve cost-competitiveness due to NAFTA. Moreover, the automotive industry in Mexico is experiencing a paradigm shift, with many huge automobile companies constructing their plants in the country. A few of the companies that recently opened their plants in the country include Kia Motors, Mercedes-Benz, Nissan, Audi, and General Motors, among others.

A few of the major manufacturing industries in North America include aerospace, automotive, telecommunications, and electronics, among others. Further, owing to a favorable economy, the spending capacities of individuals in North America are high, which has led to the exponential sales of smartphones, tablets, laptops, personal computers, wearables, and other consumer electronics devices. The consumer electronics industry is another major user of semiconductor-based products. All these industries are highly dependent on the semiconductor industry for effective performance. In September 2020, KLA, the US-based capital equipment company, improved its systems portfolio for advanced packaging by introducing new tools. The new tools consist of a Kronos 1190 wafer-level packaging inspection system, ICOS T3/T7 Series, and ICOS F160XP. The new systems allow the end users to improvise semiconductor device fabrication at a packaging stage. Similarly, in May 2021, Intel announced its plan to invest US$ 3.5 billion in the fabrication of advanced semiconductor packaging technologies.

All the above mentioned factors are anticipated to support the growth of the North America redistribution layer material market during 2022-2030.

North America Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

North America Redistribution Layer Material Market Segmentation

The North America redistribution layer material market is segmented based on type, application, and country.

Based on type, the North America redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By application, the North America redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the North America redistribution layer material market is segmented into US, Canada, and Mexico. The US dominated the North America redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the North America redistribution layer material market.

Table Of Contents

1. Introduction

• 1.1 The Insight Partners Research Report Guidance
• 1.2 Market Segmentation

2. Executive Summary

• 2.1 Key Insights
• 2.2 Market Attractiveness
  • 2.2.1 Market Attractiveness

3. Research Methodology

• 3.1 Coverage
• 3.2 Secondary Research
• 3.3 Primary Research

4. North America Redistribution Layer Material Market Landscape

• 4.1 Overview
• 4.2 Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Intensity of Competitive Rivalry
  • 4.2.5 Threat of Substitutes
• 4.3 Ecosystem Analysis
  • 4.3.1 Raw Material Suppliers
  • 4.3.2 Manufacturers
  • 4.3.3 End Use

5. North America Redistribution Layer Material Market - Key Market Dynamics

• 5.1 Market Drivers
  • 5.1.1 Growing Focus on AI-based Equipment and Tools
  • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
• 5.2 Market Restraints
  • 5.2.1 Fluctuation in Raw Material Prices
• 5.3 Market Opportunities
  • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
• 5.4 Future Trends
  • 5.4.1 Advancements in the Packaging Technology
• 5.5 Impact Analysis

6. Redistribution Layer Material Market - North America Market Analysis

• 6.1 North America Redistribution Layer Material Market Volume (Tons)
• 6.2 North America Redistribution Layer Material Market Revenue (US$ Million)
• 6.3 North America Redistribution Layer Material Market Forecast and Analysis

7. North America Redistribution Layer Material Market Analysis - Type

• 7.1 Polyimide (PI)
  • 7.1.1 Overview
  • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.2 Polybenzoxazole (PBO)
  • 7.2.1 Overview
  • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.3 Benzocylobutene (BCB)
  • 7.3.1 Overview
  • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.4 Others
  • 7.4.1 Overview
  • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. North America Redistribution Layer Material Market Analysis - Application

• 8.1 Fan-Out Wafer Level Packaging (FOWLP)
  • 8.1.1 Overview
  • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
• 8.2 2 5D/3D IC Packaging
  • 8.2.1 Overview
  • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
  • 8.2.3 High Bandwidth Memory (HBM)
    • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.4 Multi-Chip Integration
    • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.5 Package on Package (FOPOP)
    • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.6 Others
    • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. North America Redistribution Layer Material Market - Country Analysis

• 9.1 Overview
  • 9.1.1 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
    • 9.1.1.1 North America Redistribution Layer Material Market Breakdown by Country
    • 9.1.1.2 US: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.3 US: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.3.1 US: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.3.2 US: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.3.3 US: North America Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.4 Canada: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.5 Canada North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.5.1 Canada: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.5.2 Canada: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.5.3 Canada: North America Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.6 Mexico: North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.7 Mexico: North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.7.1 Mexico: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.7.2 Mexico: North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.7.3 Mexico: North America Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

• 10.1 Heat Map Analysis by Key Players
• 10.2 Company Positioning & Concentration

11. Industry Landscape

• 11.1 Overview
• 11.2 Market Initiative
• 11.3 New Product Development
• 11.4 Merger and Acquisition

12. Company Profiles

• 12.1 SK Hynix Inc
  • 12.1.1 Key Facts
  • 12.1.2 Business Description
  • 12.1.3 Products and Services
  • 12.1.4 Financial Overview
  • 12.1.5 SWOT Analysis
  • 12.1.6 Key Developments
• 12.2 Samsung Electronics Co Ltd
  • 12.2.1 Key Facts
  • 12.2.2 Business Description
  • 12.2.3 Products and Services
  • 12.2.4 Financial Overview
  • 12.2.5 SWOT Analysis
  • 12.2.6 Key Developments
• 12.3 Infineon Technologies AG
  • 12.3.1 Key Facts
  • 12.3.2 Business Description
  • 12.3.3 Products and Services
  • 12.3.4 Financial Overview
  • 12.3.5 SWOT Analysis
  • 12.3.6 Key Developments
• 12.4 DuPont de Nemours Inc
  • 12.4.1 Key Facts
  • 12.4.2 Business Description
  • 12.4.3 Products and Services
  • 12.4.4 Financial Overview
  • 12.4.5 SWOT Analysis
  • 12.4.6 Key Developments
• 12.5 FUJIFILM Holdings Corp
  • 12.5.1 Key Facts
  • 12.5.2 Business Description
  • 12.5.3 Products and Services
  • 12.5.4 Financial Overview
  • 12.5.5 SWOT Analysis
  • 12.5.6 Key Developments
• 12.6 Amkor Technology Inc
  • 12.6.1 Key Facts
  • 12.6.2 Business Description
  • 12.6.3 Products and Services
  • 12.6.4 Financial Overview
  • 12.6.5 SWOT Analysis
  • 12.6.6 Key Developments
• 12.7 ASE Technology Holding Co Ltd
  • 12.7.1 Key Facts
  • 12.7.2 Business Description
  • 12.7.3 Products and Services
  • 12.7.4 Financial Overview
  • 12.7.5 SWOT Analysis
  • 12.7.6 Key Developments
• 12.8 NXP Semiconductors NV
  • 12.8.1 Key Facts
  • 12.8.2 Business Description
  • 12.8.3 Products and Services
  • 12.8.4 Financial Overview
  • 12.8.5 SWOT Analysis
  • 12.8.6 Key Developments
• 12.9 JCET Group Co Ltd
  • 12.9.1 Key Facts
  • 12.9.2 Business Description
  • 12.9.3 Products and Services
  • 12.9.4 Financial Overview
  • 12.9.5 SWOT Analysis
  • 12.9.6 Key Developments
• 12.10 Shin-Etsu Chemical Co Ltd
  • 12.10.1 Key Facts
  • 12.10.2 Business Description
  • 12.10.3 Products and Services
  • 12.10.4 Financial Overview
  • 12.10.5 SWOT Analysis
  • 12.10.6 Key Developments

13. Appendix