6G 통신 시장 : 재구성 가능한 지능형 표면(RIS) 소재 및 하드웨어 시장 및 기술(2027-2047년)

Summary

Successive generations of wireless communications promise wider availability and new, must-have user features, partly by adopting higher frequencies. To enable these, 6G, launching in 2030, must widely deploy Reconfigurable Intelligent Surfaces RIS in the propagation path. The new commercially-oriented, 579-page report, "6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047" details your opportunities, clarified with 11 SWOT appraisals, 24 forecast lines 2027-2047, 57 key conclusions.

Clear infograms not rambling text

The report is intended for all in the value chain from investors to added value materials companies, device manufacturers, product and system integrators, and facilities managers. Indeed, there is much to interest academics, regulators and other interested parties. For example, here you will find potential partners and acquisitions, winning approaches, best practice and lessons from failure. The new PhD level analysis is presented as SWOT appraisals, comparison charts, new infograms, roadmaps, forecasts and sections marked “Zhar Research Comment”. For easy understanding, successful materials are prioritised in pie charts and highlighted in red in the text. Key points are highlighted in green. The report is constantly updated so you only get the latest - essential because the progress is now rapid. Billion-dollar businesses can be created by those keeping ahead with this level of original insight and detail.

Deep coverage of the flood of new research

Vitally, there is deep coverage of the flood of new research and company activity through 2025 and 2026. It will assist those seeking opportunities for their existing materials and manufacturing expertise such as flexible and structural electronics, fine metals, conductive inks, graphene, activated carbon, silicon, silicas and liquid crystal, often wide-area. See future progress from GHz to THz and visible-light RIS and to sophisticated forms such as Transparent Amplifying Intelligent Surfaces TAIS and morphing RIS.

Two stages

6G will mostly launch in 2030 with minimal infrastructure expenditure, performance being improved by radical advances above the physical layer. However, later, many advanced forms of RIS will be essential to meet the original promises and reverse the decline in sales of client devices. Those promises include Tbps data rates, sub ms latency, native AI, native sensing and native precise positioning, ten times the client density of 5G, all sufficient to serve the ambitions of real-time brain-computer interfaces, superlative robotics, holographic communication, immersive extended reality XR and so much more. For these, we may widely deploy 0.1-0.3 THz, visible light communication and affordable RIS. This report therefore covers RIS at all likely frequencies from GHz to visible light and ways of limiting the RIS expenditure and improving paybacks by such things as 360-degree RIS, including as windows, multipurpose RIS and fully active RIS that doubles range and provides much better added value services. We also cover RIS technology in aerospace, underwater and underground, all essential if the poor geographical coverage of 5G is not to be repeated.

Report contents

The Executive Summary and Conclusions (74 pages) is self-sufficient for those with limited time. See the basics, conclusions, main SWOT appraisals, roadmaps and all forecasts. The Introduction (117 pages) presents the various RIS variants, objectives and trends emerging and how they support necessary 6G evolution. Learn how a 6G Phase Two will be essential to meet the original promises. Backing up the analysis, 60 research papers from 2026 are listed. Chapter 3. “Ultimate 6G RIS hardware toolkit: invisible, wide area, self-powered, self-learning, self-adaptive, self-healing, self-cleaning, ubiquitous, autonomous, everlasting, AI enabled, dynamic spectrum sharing, other” (38 pages), with other research advances through 2026, details these aspects. Chapter 4. “Beyond diagonal RIS architecture tackles 6G RIS limitations” (22 pages) explains this relatively-new aspect.

Affordable and acceptable RIS everywhere

To be affordable and acceptable. RIS must become more capable and disappear into the fabric of society. Chapter 5. “Multifunctional and multi-mode RIS including STAR RIS, ISAC, SWIPT with research through 2026” (54 pages) explains how this will be achieved, eventually including SWIPT providing enough power in the signal beam to interrogate unpowered 6G client devices such as Internet of Things nodes in billions.

RIS technology will enhance 6G base stations

RIS technology will enhance 6G base stations as their nature changes, and example being “Tower in the Sky”. Chapter 6. “Base station, UM-MIMO, Tower in the Sky HAPS and UAV RIS with research advances 2026” explains. Indeed, Unmanned Aerial Vehicles will both enhance and benefit from RIS-enabled 6G. Chapter 7. “RIS tuning hardware objectives and progress with research through 2026” (52 pages) concerns the formulation and patterning options for materials and components enabling the reconfigurable feature of RIS metasurfaces. The trend is from flip chip to structural electronics, with vanadium dioxide among the likely winners.

Optical and other advanced RIS

Given the inevitability of 6G progressing later to frequencies high enough to provide the ultimate benefits, visible light communication must become part of the mix. Indeed, only this has demonstrated Tbps data rates. Chapter 8. “Optical Wireless Communications ORIS for 6G: major progress through 2026” (61 pages) explains your opportunities arising. They cover indoor up to satellite optical systems. Chapter 9. “6G Morphing Flexible Intelligent Metasurfaces FIM, 6G hypersurfaces, metamaterial basics” (49 pages) covers other options that will appear later in the 2027-2047 timeframe. It also gives metamaterial basics for those that need them. The report closes with Chapter 10. “RIS and reflect-array manufacture, inspection, testing, cost breakdown”.

“6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047” is your essential handbook.

CAPTION: Recent research papers relevant to RIS at GHz and THz showing need for more experimental work as we approach commercialisation. Source: Zhar Research report, “6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047”.

Table of Contents

1. Executive summary and conclusions with roadmap and forecast lines 2027-2047

• 1.1 Purpose of this report
• 1.2 Methodology of this analysis
• 1.3 Background to RIS
  • 1.3.1 Useful for 5G but essential for 6G
  • 1.3.2 RIS Google, research paper, patent trends, trending RIS topics
  • 1.3.3 Dreams of RIS everywhere: infograms
• 1.4 Many types of RIS needed for 6G
• 1.5 Ten key conclusions concerning 6G Communications generally
• 1.6 27 general conclusions concerning 6G RIS
• 1.7 Seven key conclusions concerning 6G RIS materials and component opportunities
• 1.8 Seven key conclusions concerning 6G RIS cost issues
• 1.9 Six key conclusions concerning 6G RIS and reflect-array manufacturing technology
• 1.10 Eight SWOT appraisals
  • 1.10.1 6G RIS SWOT appraisal
  • 1.10.2 SWOT appraisal of 6G adding sub-THz, THz, near infrared and visible frequencies
  • 1.10.3 SWOT appraisal of BD-RIS for 6G
  • 1.10.4 STAR-RIS SWOT appraisal
  • 1.10.5 SWOT appraisal of 6G RIS for OWC
  • 1.10.6 SWOT appraisal of 6G ISAC and its use of RIS
  • 1.10.7 SWOT appraisal of visible light communication VLC
  • 1.10.8 SWOT appraisal for metamaterials and metasurfaces generally
  • 1.10.9 SWOT appraisal of morphing Flexible Intelligent Metasurfaces FIM
• 1.11 6G systems, materials and standards roadmaps in six lines 2026-2047
• 1.12 6G reflectarray and RIS market forecasts and background forecasts in 24 lines 2027-2047
  • 1.12.1 6G fully passive metamaterial reflect-array market OWC and total $ billion 2029-2047
  • 1.12.2 6G RIS value market $ billion: active vs four semi-passive categories by frequency 2026-2047 with explanation
  • 1.12.3 6G RIS area sales yearly billion square meters 2027-2047 with explanation
  • 1.12.4 Average 6G RIS price $/ square m. ex-factory including electronics 2028-2047 with explanation
  • 1.12.5 6G RIS area sales vs average panel area, sales number and total deployed cumulatively 2027-2047 with explanation
  • 1.12.6 Percentage share of global RIS hardware value market by four regions 2029-2047
  • 1.12.7 Smartphone and successor billion units sold globally 2025-2047
  • 1.12.8 Market for 6G vs 5G base stations units millions yearly 2025-2047
  • 1.12.9 Market for 6G base stations market value $bn 2029-2047

2. Introduction with research through 2026

• 2.1 Overview
  • 2.1.1 RIS definitions, context, needs driving increased RIS sophistication
  • 2.1.2 RIS operation modes, issues and design approaches in providing planned 6G benefits
  • 2.1.3 Important trend from moving parts to smart materials
  • 2.1.4 Diverse functionalities and applications of RIS and allied intelligent metasurfaces
  • 2.1.5 Examples of current approaches to RIS design and capability
  • 2.1.6 Unique features of RIS vs traditional approaches and combinations
  • 2.1.7 Liquid crystal as a variable capacitive medium in phased arrays
  • 2.1.8 RIS competing with traditional approaches
  • 2.1.9 How 6G systems will mix and match many technologies in the propagation path
  • 2.1.10 Active RIS becomes important: different envisaged potential and advances
• 2.2 RIS functionality and usefulness – a closer look
  • 2.2.1 Improved spatial coverage and macro-diversity
  • 2.2.2 Capacity enhancement, green communications and Internet of Things
  • 2.2.3 Physical layer security, anti-jamming, and reliability enhancement
  • 2.2.4 Enabling Large-Scale IoT Network Deployment
  • 2.2.5 Wireless Sensing and Localization, HRIS, ISAC
  • 2.2.6 RIS from the systems and security viewpoint
• 2.3 Activities of standards bodies and influencers related to 6G RIS
• 2.4 Broadening vs retrenching 6G and 6G RIS objectives, smart radio environments
• 2.5 Terminology thicket
• 2.6 Changing industrial and research trends
  • 2.6.1 Broadening theoretical studies useful but relative neglect of hardware is not
  • 2.6.2 Backtracking on frequencies compromises capability at launch
  • 2.6.3 Latest research focussed on broadly 5G frequencies: GHz and mmWave for 6G
  • 2.6.4 0.1THz to 3THz 6G RIS research
• 2.7 Improving reach at the higher frequencies: trajectory engineering
• 2.8 Analysis of other research advances 2025 through
  • 2.8.1 Specifically 6G RIS, reflect arrays, phased arrays
  • 2.8.2 Adjacent topics research in 2025, 2026 and for scheduled publication in
• 2.9 6G global architecture proposals, complementary systems

3. Ultimate 6G RIS hardware toolkit: invisible, wide area, self-powered, self-learning, self-adaptive, self-healing, self-cleaning, ubiquitous, autonomous, everlasting, AI enabled, dynamic spectrum sharing, other with research through 2026

• 3.1 Overview
  • 3.1.1 Making 6G RIS more acceptable, deployable and useful: many advances through
  • 3.1.2 Synergistic combination of advanced physical and RIS properties
• 3.2 Invisible RIS – transparent or out of sight
  • 3.2.1 The journey to vanishing RIS: transparent or out-of-sight
  • 3.2.2 Transparent 6G RIS in 2025-6: companies, universities, ambitions
  • 3.2.3 Transparent reflect arrays: Sekisui and others
• 3.3 Large Intelligent Surfaces LIS and Extremely Large-scale Antenna Array ELAA research including wide area RIS
  • 3.3.1 Definitions and benefits
  • 3.3.2 Large Intelligent Surfaces LIS RIS enhancing security, range, error reduction
  • 3.3.3 Advances in protective coatings for wide area energy harvesting and RIS
• 3.4 RIS will become self-powered and enable zero energy client devices
  • 3.4.1 Overview
  • 3.4.2 Maturity of primary ZED enabling technologies
  • 3.4.3 Ranking of most popular 6G ZED compounds and carbon allotropes in research
  • 3.4.4 Context of ZED: overlapping and adjacent technologies and examples of long-life energy independence
  • 3.4.5 SWIPT, STIIPT, AmBC and CD-ZED objectives and latest progress
  • 3.4.6 13 harvesting technologies for 6G ZED infrastructure and client devices 2027-2047
  • 3.4.7 6G active RIS and UM MIMO base station power demands matched to energy harvesting options
  • 3.4.8 SWOT appraisal of batteryless storage technologies for ZED RIS and more
  • 3.4.9 SWOT appraisal of circuits and infrastructure that eliminate storage
• 3.5 Artificial intelligence and machine learning for optimising, self-learning, self-adaptive , autonomous RIS
• 3.6 Multimode and multifrequency, dynamic spectrum sharing DSS 6G and its RIS

4. Beyond diagonal RIS architecture tackles 6G RIS limitations

• 4.1 Definitions, material challenges, applicability
  • 4.1.1 Significance
  • 4.1.2 The simple description
  • 4.1.3 SWOT appraisal of BD-RIS for 6G
  • 4.1.4 Coverage in this chapter and your opportunities
• 4.2 Potential benefits of BD-RIS
• 4.3 BD-RIS hardware challenges
• 4.4 Practical implementations and requirement for improvement
  • 4.4.1 The challenge
  • 4.4.2 First practical demonstrations of BD-RIS
  • 4.4.3 Terrestrial BD-RIS progress through 2025: many other advances and appraisals
  • 4.4.4 Improving RIS in non terrestrial networks NTN

5. Multifunctional and multi-mode RIS including STAR RIS, ISAC, SWIPT with research through 2026

• 5.1 Overview with review of research, industrial trends and possibilities
• 5.2 Simultaneous transmissive and reflective STAR RIS
  • 5.2.1 Overview
  • 5.2.2 STAR-RIS optimisation
  • 5.2.3 STAR-RIS-ISAC integrated sensing and communication system
  • 5.2.4 TAIS Transparent Amplifying Intelligent Surface
  • 5.2.5 Simultaneous Wireless Information and Power Transfer SWIPT including active STAR-RIS and THz versions
  • 5.2.6 STAR-RIS with energy harvesting and adaptive power
  • 5.2.7 STAR RIS SWOT appraisal
• 5.3 Other multifunctional and multi-mode RIS
  • 5.3.1 Overview
  • 5.3.2 Multifunctional RIS: solid-state cooling functionality
• 5.4 Integrated sensing and communication ISAC including RIS, SWOT, advances 2025 snd
  • 5.4.1 Native 6G capability
  • 5.4.2 SWOT appraisal of 6G ISAC and its use of RIS
  • 5.4.3 Basics
• 5.5 Multimode RIS ensuring system security: combined semi-passive and active RIS

6. Base station, UM-MIMO, Tower in the Sky HAPS and UAV RIS with research advances 2026

• 6.1 Overlapping subjects: RIS enhancing 6G base stations and non-terrestrial networks
• 6.2 Progress to UM-MIMO
• 6.3 RIS-enabled, self-powered ultra-massive 6G UM-MIMO base station design
  • 6.3.1 Basic and structural RIS
  • 6.3.2 Morphing metamaterial MIMO technology
• 6.4 RIS for massive MIMO base station: Tsinghua University, Emerson
• 6.5 RIS as small cell base station
• 6.6 Other important advances in RIS-enabled MIMO and base stations in 2025 through
• 6.7 How satellites and UAVs will aid and sometimes benefit from 6G RIS
• 6.8 Important advances announced in 2025 and 2026 and scheduled for
• 6.9 Large stratospheric HAPS RIS

7. RIS tuning hardware objectives and progress with research through 2026

• 7.1 Overview
  • 7.1.1 Primitive to advanced tuning
  • 7.1.2 Tuning mechanisms in context
  • 7.1.3 Examples of RIS external control stimuli used in research and trials
  • 7.1.4 RIS tuning hardware options compared
  • 7.1.5 Infogram: The Terahertz Gap demands different tuning materials and devices
• 7.2 Lessons from research carried out on RIS tuning: 2026 and earlier
  • 7.2.1 Changing focus
  • 7.2.2 Electrical and optical tuning and higher frequencies favoured
• 7.3 Detailed analysis of progress with discrete tuning components
  • 7.3.1 General
  • 7.3.2 Schottky diode RIS tuning vs other diodes
  • 7.3.3 High-Electron Mobility Transistor HEMT RIS tuning
  • 7.3.4 Less successful other options with reasons
• 7.4 Prioritisation of tuning materials replacing discretes for 6G RIS 0.1-1THz and NearIR
  • 7.4.1 Winners on current evidence
  • 7.4.2 Options for integrated tuning materials for higher frequency 6G
  • 7.4.3 Vanadium dioxide: rationale and major progress through 2025,
  • 7.4.4 Chalcogenide phase change materials notably GST and GeTe
  • 7.4.5 Graphene: rationale and major progress through 2025,
  • 7.4.6 Liquid crystal rationale and progress through 2025,
• 7.5 Large RIS and other gaps in the market

8. Optical Wireless Communications ORIS for 6G: major progress through 2026

• 8.1 Why OWC including RIS at its frequencies is an attractive addition for 6G
  • 8.1.1 Optical Wireless Communications OWC, subset Visible Light Communications VLC, 2026 advances
  • 8.1.2 The case for multi-frequency 6G Phase Two including optical “so one gets through”
  • 8.1.3 Parameter comparison of Free Space Optical FSO with 3-300GHz communication
• 8.2 The potential and the challenges of Optical RIS ORIS with SWOT appraisals
  • 8.2.1 Overview
  • 8.2.2 ORIS benefits and the Distributed RIS DRIS option
  • 8.2.3 ORIS challenges
  • 8.2.4 SWOT appraisal of 6G RIS for OWC
  • 8.2.5 SWOT appraisal of visible light communication
• 8.3 ORIS implementation procedures
• 8.4 Long range, underground, underwater and space OWC: RIS: research advances 2026 and earlier
  • 8.4.1 General
  • 8.4.2 RIS enhanced OWC vehicular networks and mobile environments
  • 8.4.3 Hybrid RF-FSO RIS
  • 8.4.4 Underwater UOWC systems with 2026 advances
  • 8.4.5 Underground OWC needing RIS
  • 8.4.6 Laser stratospheric and space communications with RIS technology
• 8.5 Short range and indoor OWC and its RIS: research advances through 2026 and earlier
  • 8.5.1 Indoors and short range in air
  • 8.5.2 Leveraging other indoor and short-range outdoor systems such as LiFi with RIS
• 8.6 Potentially 6G optical materials
• 8.7 Metalenses for 6G including advances through
• 8.8 Mirror array ORIS design and application advances through

9. 6G Morphing Flexible Intelligent Metasurfaces FIM, 6G hypersurfaces, metamaterial basics

• 9.1 Overview
• 9.2 Appraisal of 6G-related metamaterial research major advances through
  • 9.2.1 New advances in metamaterial design
  • 9.2.2 Hypersurfaces, stacked intelligent metasurfaces, swarms, bifunctional metasurfaces
  • 9.2.3 Optimal metamaterial substrates and low loss, 6G glass TIRS
  • 9.2.4 Optimal metamaterial substrates including transparent 6G glass
• 9.3 Metamaterial basics
  • 9.3.1 The meta-atom and patterning options
  • 9.3.2 Material and functional families
  • 9.3.3 Metamaterial reflect-arrays for 5G and 6G Communications
  • 9.3.4 Metamaterial patterns and materials through
  • 9.3.5 Six formats of communications metamaterial with examples
• 9.4 Metasurface basics
  • 9.4.1 Metasurface design, operation and RIS
  • 9.4.2 How metamaterial RIS hardware operates
  • 9.4.3 RIS and reflect-array construction and potential capability
  • 9.4.4 All dielectric and non-linear dielectric metasurfaces
• 9.5 The long-term picture of metamaterials overall
• 9.6 Emerging applications of GHz, THz, infrared and optical metamaterials
• 9.7 Thermal metamaterials
• 9.8 SWOT appraisal for metamaterials and metasurfaces generally
• 9.9 Morphing Flexible Intelligent Metasurfaces FIM basics and their research through
  • 9.9.1 Basics
  • 9.9.2 FIM network topology and potential applications targetted
  • 9.9.3 Many FIM research advances through 2026 assessed
  • 9.9.4 SWOT appraisal of 6G FIM

10. RIS and reflect-array manufacture, inspection, testing, cost breakdown

• 10.1 Thin film and transparent electronics state-of-the-art
• 10.2 Trend from discrete boards, stacked films to full smart material integration
• 10.3 Importance of flexible, laminar and 2D energy harvesting and sensing
• 10.4 How manufacturing technologies differ for 6G RIS optical, low or high THz
  • 10.4.1 Candidates: nano-imprinting, nano-lithography, lithography, gravure, inkjet, screen, flexo, spray, other
  • 10.4.2 Special case: 3D printing with electron beam evaporation
  • 10.4.3 Ultra-fast laser system
• 10.5 6G RIS inspection and testing: new advances
  • 10.5.1 Testing challenges
  • 10.5.2 Progress in RIS inspection
• 10.6 RIS cost analysis
  • 10.6.1General assessment
  • 10.6.2 NEC and other costed case studies
  • 10.6.3 Outdoor semi-passive and active RIS cost analysis at high areas of deployment
  • 10.6.4 Indoor semi-passive RIS cost analysis at volume

11. 6G RIS companies : products, plans, patents, Zhar appraisals

• 11.1 Overview and patenting
  • 11.1.1 Rapidly changing situation 2025-6
  • 11.1.2 RIS patenting and literature trends
• 11.2 AGC Japan
• 11.3 Alcan Systems Germany
• 11.4 Alibaba China
• 11.5 Alphacore USA
• 11.6 China Telecom China Mobile, China Unicom, Huawei, ZTE, Lenovo, CICT China collaboration
• 11.7 Ericsson Sweden
• 11.8 Fractal Antenna Systems USA
• 11.9 Greenerwave France
• 11.10 Huawei China
• 11.11 ITOCHU Japan
• 11.12 Kymeta Corp. USA
• 11.13 Kyocera Japan
• 11.14 Metacept Systems USA
• 11.15 Metawave USA
• 11.16 NEC Japan
• 11.17 Nokia Finland with LG Uplus South Korea
• 11.18 NTT DoCoMo and NTTJapan
• 11.19 Orange France
• 11.20 Panasonic Japan
• 11.21 Pivotal Commware USA
• 11.22 Qualcomm USA
• 11.23 Samsung Electronic South Korea
• 11.24 Sekisui Japan
• 11.25 SensorMetrix USA
• 11.26 SK Telecom South Korea
• 11.27 Sony Japan
• 11.28 Teraview USA
• 11.29 Vivo Mobile Communications China
• 11.30 VTT Finland
• 11.31 ZTE China