세계의 인몰드 일렉트로닉스(IME) 시장(2025-2035년)

In-mold electronics (IME), also sometimes known as plastronics, is an innovative technology that combines traditional injection molding with printed electronics. This process allows for the embedding of functional electronic elements, such as touch sensors, displays, and lighting, directly into plastic components during the molding process. This process allows for the creation of smart surfaces and complex electronic functionalities within a single manufacturing step. IME technology enables the embedding of touch sensors, lighting, and other electronic functionalities into 3D molded surfaces, resulting in streamlined manufacturing processes and reduced assembly costs. This not only enhances product performance but also improves aesthetics by removing the need for external components.

The advantages of IME include:

• Design Flexibility: IME enables the creation of complex shapes and designs that are not possible with traditional electronics integration methods.
• Durability: The electronic components are protected within the molded plastic, making them more resistant to wear and environmental factors.
• Cost Efficiency: By integrating multiple functions into a single part, IME can reduce assembly costs and improve manufacturing efficiency.

IME technology typically involves a three-step process:

• Printing of Electronic Circuits: This step includes the application of conductive inks to create the necessary electronic pathways.
• Forming: The printed circuits are then formed into the desired shape, which is crucial for ensuring that the electronics fit seamlessly into the final product.
• Molding: Finally, the formed circuits are encapsulated within a molded part, creating a durable and functional electronic component that can be used in various applications, such as automotive interiors, consumer electronics, and medical devices.

IME products are particularly beneficial in industries such as automotive, consumer electronics, and medical devices, where space and weight savings are critical. The technology not only enhances product design but also improves durability and performance by eliminating the need for separate electronic assemblies, enabling the creation of user-friendly interfaces and complex electronic systems within a single molded part. IME products are designed to meet the growing demand for smart, connected devices, enabling manufacturers to innovate and differentiate their offerings in competitive markets.

"The Global Market for In-Mold Electronics (IME) 2025-2035" provides an in-depth analysis of the rapidly growing global in-mold electronics (IME) market, examining key trends, technologies, materials, applications, and market forecasts from 2025 to 2035. The study offers detailed insights into this transformative technology that integrates electronic functionality directly into molded plastic components, revolutionizing manufacturing across multiple industries. The report provides extensive coverage of IME manufacturing processes, including detailed analysis of production methods, component integration, and material requirements. Key focus areas include surface functionalization technologies, conductive inks, transparent conductors, and substrate materials essential for successful IME implementation.

Market analysis covers major application sectors including:

• Automotive human-machine interfaces
• White goods and appliances
• Medical devices
• Industrial controls
• Wearable electronics

The study examines critical aspects of IME technology including:

• Manufacturing processes and requirements
• Component integration strategies
• Materials development and selection
• Quality control and testing
• Regulatory considerations
• Sustainability aspects

Technical coverage includes detailed analysis of:

• Conductive ink formulations
• Transparent conductive materials
• Substrate and thermoplastic selection
• Integration of electronic components
• Surface treatment technologies
• Testing and validation methods

The report features comprehensive market data including:

• Market size and growth projections (2025-2035)
• Revenue forecasts by application sector
• Regional market analysis
• Technology adoption trends
• Competitive landscape assessment. The report profiles leading companies across the IME value chain, including Canatu, CHASM Technologies, Covestro, Dupont, E2IP Technologies, Elantas, Embega, FORVIA Faurecia, Genes'Ink, Henkel, Kimoto, Nissha, TactoTek Oy, and more. These companies represent various segments of the IME industry including material suppliers, equipment manufacturers, technology developers, and end-product manufacturers.

Special focus is placed on emerging technologies and innovations:

• Advanced material developments
• Novel manufacturing processes
• Integration strategies
• Future technology roadmaps
• Market opportunities and challenges

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. Design limitations on surfaces
• 1.2. Applications
• 1.3. IME manufacturing
• 1.4. Investments
• 1.5. Sustainability
• 1.6. Market outlook
• 1.7. Market forecasts

2. INTRODUCTION

• 2.1. Functionality Integration
• 2.2. 3D Electronics
• 2.3. IME Value Chain

3. IME MANUFACTURING

• 3.1. IME components
• 3.2. IME production
• 3.3. Implementation approaches
  • 3.3.1. Hybrid
  • 3.3.2. One-film vs two-film
  • 3.3.3. Implementation of multilayer circuits
  • 3.3.4. Integration of integrated circuits in IME
  • 3.3.5. Print-then-plate
  • 3.3.6. Automation
  • 3.3.7. Transfer printing technology
  • 3.3.8. Evaporated line technology
  • 3.3.9. Capacitive touch functionality
• 3.4. Other manufacturing methods
• 3.5. Functional film bonding
• 3.6. Metallization Methods
• 3.7. MID technology
  • 3.7.1. Aerosol deposition
  • 3.7.2. Laser Direct Structuring (LDS)
  • 3.7.3. Two shot molding
  • 3.7.4. 3D surfaces
  • 3.7.5. Impulse printing technology
  • 3.7.6. Pad printing
  • 3.7.7. Spray metallization
• 3.8. Multifunctional composites
• 3.9. Additive manufacturing

4. IME COMPONENTS INTEGRATION

• 4.1. Capacitive sensing technology
  • 4.1.1. Overview
  • 4.1.2. Operation
• 4.2. Lighting
• 4.3. Haptics
• 4.4. 3D Displays
• 4.5. Antenna

5. MATERIALS FOR IME

• 5.1. Overview
• 5.2. Conductive inks
  • 5.2.1. Materials
  • 5.2.2. Stretchable inks
  • 5.2.3. Inks for IME
• 5.3. Dielectric inks
• 5.4. Electrically conductive adhesives
• 5.5. Transparent conductive materials
  • 5.5.1. Overview
  • 5.5.2. Types
  • 5.5.3. Carbon nanotube (CNT) films
  • 5.5.4. Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS)
  • 5.5.5. Carbon nanobuds
  • 5.5.6. Metal mesh
• 5.6. Substrate and thermoplastic materials

6. MARKETS FOR IME

• 6.1. Automotive
  • 6.1.1. Overview
  • 6.1.2. Commercial applications
    • 6.1.2.1. Sensing
    • 6.1.2.2. Headlamp covers
    • 6.1.2.3. Steering Wheel
  • 6.1.3. Global market forecast
• 6.2. White Goods
  • 6.2.1. Overview
  • 6.2.2. Applications
  • 6.2.3. Global market forecast
• 6.3. Medical Devices
  • 6.3.1. Overview
  • 6.3.2. Applications
  • 6.3.3. Global market forecast
• 6.4. Industrial
  • 6.4.1. Overview
  • 6.4.2. Applications
• 6.5. Wearable Electronics
  • 6.5.1. Overview
  • 6.5.2. Applications
• 6.6. Other Markets and Applications

7. COMPANY PROFILES

8. REFERENCES