세계의 전자 포장 시장 : 재료, 기술, 용도별 예측(2025-2030년)

The Electronic Packaging Market was valued at USD 3.19 billion in 2023, expected to reach USD 3.69 billion in 2024, and is projected to grow at a CAGR of 16.55%, to USD 9.32 billion by 2030.

The electronic packaging market encompasses the materials and methods used to protect and integrate electronic components within devices. It ensures functionality, reliability, and longevity by shielding from physical, thermal, and electromagnetic interference. The necessity for electronic packaging arises from the growing demand for miniaturized, lightweight, and more efficient electronic products. Applications span across multiple sectors, including consumer electronics, automotive, healthcare, aerospace, and telecommunications, where advanced packaging technologies are crucial for optimal device performance. The end-use scope is broad, covering semiconductors, printed circuit boards (PCBs), sensors, and optoelectronic components. Key growth drivers include the burgeoning consumer electronics market, advancements in Internet of Things (IoT) devices, and the increasing adoption of electric vehicles, which demand sophisticated packaging solutions for power electronics. Emerging technologies such as 5G and AI also fuel the market, presenting opportunities for high-density integration and enhanced thermal management solutions. However, the market faces challenges such as high costs associated with advanced packaging technologies and the need for continuous innovation to meet evolving device requirements. Limitations include stringent regulations and the environmental impact associated with packaging materials. Opportunities lie in innovations like 3D packaging, system-in-package (SiP) solutions, and advancements in nanotechnology that can enhance performance while reducing size and cost. Eco-friendly and sustainable packaging materials also represent a critical research avenue, addressing both market demand and regulatory pressures. As businesses seek growth, investing in R&D for smart packaging solutions and eco-friendly alternatives will be pivotal. The electronic packaging market is dynamic, with trends leaning towards integration, miniaturization, and sustainability, necessitating continuous adaptation and investment in cutting-edge technology to maintain competitive edge. Exploring cross-industry applications and focusing on customization will also open new avenues for expansion and innovation in this evolving field.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Electronic Packaging Market

The Electronic Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growth in semiconductor industry driving the need for advanced electronic packaging
  • Expansion of the automotive industry with emphasis on electronic components and sensors
  • Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
  • Government regulations and standards mandating improved reliability and performance of electronic packaging
• Market Restraints
  • Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
  • Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
• Market Opportunities
  • Expansion of 5G technology and its impact on electronic packaging requirements
  • Increased utilization of system-in-package (SiP) technology for high-performance applications
  • Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
• Market Challenges
  • Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
  • Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements

Porter's Five Forces: A Strategic Tool for Navigating the Electronic Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Electronic Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Electronic Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Electronic Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Electronic Packaging Market

A detailed market share analysis in the Electronic Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Electronic Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Electronic Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Electronic Packaging Market

A strategic analysis of the Electronic Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Electronic Packaging Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Amkor Technology, Inc., Analog Devices, Inc., ASE Technology Holding Co, Ltd, Avnet, Inc., Broadcom Inc., DuPont de Nemours, Inc., Infineon Technologies AG, Intel Corporation, Jabil, Inc., Microchip Technology Inc., Micron Technology, Inc., NXP B.V., ON Semiconductor Corporation, Power Integrations, Inc., Qualcomm Technologies, Inc, Renesas Electronics Corporation, ROHM Co., Ltd., Samsung Electronics Co., Ltd., Schott AG, Skyworks Solutions, Inc., Smart Global Holdings, Inc, Smurfit Kappa Group PLC, Sonoco Products Company, Specialized Packaging Group, Inc., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company, Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Electronic Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Material, market is studied across Glass, Metal, and Plastic.
• Based on Technology, market is studied across Chip-on-Board, Surface Mount Technology, and Through-Hole Technology.
• Based on Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growth in semiconductor industry driving the need for advanced electronic packaging
    • 5.1.1.2. Expansion of the automotive industry with emphasis on electronic components and sensors
    • 5.1.1.3. Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
    • 5.1.1.4. Government regulations and standards mandating improved reliability and performance of electronic packaging
  • 5.1.2. Restraints
    • 5.1.2.1. Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
    • 5.1.2.2. Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
  • 5.1.3. Opportunities
    • 5.1.3.1. Expansion of 5G technology and its impact on electronic packaging requirements
    • 5.1.3.2. Increased utilization of system-in-package (SiP) technology for high-performance applications
    • 5.1.3.3. Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
  • 5.1.4. Challenges
    • 5.1.4.1. Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
    • 5.1.4.2. Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements
• 5.2. Market Segmentation Analysis
  • 5.2.1. Material: Increasing applications of Glass in electronic packaging due to thermal stability
  • 5.2.2. Application: Emerging applications of electronic packaging in healthcare owing to biocompatible packaging
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Electronic Packaging Market, by Material

• 6.1. Introduction
• 6.2. Glass
• 6.3. Metal
• 6.4. Plastic

7. Electronic Packaging Market, by Technology

• 7.1. Introduction
• 7.2. Chip-on-Board
• 7.3. Surface Mount Technology
• 7.4. Through-Hole Technology

8. Electronic Packaging Market, by Application

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Healthcare
• 8.5. Industrial
• 8.6. Telecommunications

9. Americas Electronic Packaging Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Electronic Packaging Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Electronic Packaging Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. Specialized Packaging Group Acquires Clark Foam to Boost Capabilities and Market Reach in Foam Packaging Sector
  • 12.3.2. Micron and Namtech Join Forces to Train Skilled Workforce, Strengthening India's Semiconductor Packaging Industry
  • 12.3.3. Schott Enhances Reliability of Aerospace Electronics with Advanced Packaging Solution
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Advanced Micro Devices, Inc.
• 2. Amkor Technology, Inc.
• 3. Analog Devices, Inc.
• 4. ASE Technology Holding Co, Ltd
• 5. Avnet, Inc.
• 6. Broadcom Inc.
• 7. DuPont de Nemours, Inc.
• 8. Infineon Technologies AG
• 9. Intel Corporation
• 10. Jabil, Inc.
• 11. Microchip Technology Inc.
• 12. Micron Technology, Inc.
• 13. NXP B.V.
• 14. ON Semiconductor Corporation
• 15. Power Integrations, Inc.
• 16. Qualcomm Technologies, Inc
• 17. Renesas Electronics Corporation
• 18. ROHM Co., Ltd.
• 19. Samsung Electronics Co., Ltd.
• 20. Schott AG
• 21. Skyworks Solutions, Inc.
• 22. Smart Global Holdings, Inc
• 23. Smurfit Kappa Group PLC
• 24. Sonoco Products Company
• 25. Specialized Packaging Group, Inc.
• 26. STMicroelectronics International N.V.
• 27. Taiwan Semiconductor Manufacturing Company, Ltd.
• 28. Texas Instruments Incorporated
• 29. Toshiba Corporation
• 30. Vishay Intertechnology, Inc.