GPU용 메모리 서브시스템 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the memory subsystem for GPUs market size is projected to expand from USD 8.84 billion in 2025 and USD 10.76 billion in 2026 to USD 27.89 billion by 2031, registering a CAGR of 20.90% between 2026 to 2031.

This report is Segmented by Memory Architecture (GDDR-Based Memory, and HBM-Based Memory), Memory Capacity (Up To 8 GB, 8 GB To 16 GB, 16 GB To 32 GB, 32 GB To 64 GB, and Above 64 GB), Application (Gaming GPUs, Data Center and AI GPUs, Professional Visualization, and More), and Geography (North America, Europe, Asia-Pacific, South America and More). The Market Forecasts are Provided in Terms of Value (USD).

Global Memory Subsystem For GPUs Market Trends and Insights

Rising AI Accelerator Memory Density Requirements

The memory subsystem for GPUs market is moving higher because the amount of memory attached to each accelerator is rising faster than overall unit shipments. Higher memory density is now a basic requirement for AI training and large-scale inference platforms, so suppliers have to redesign stack counts, thermal behavior, and packaging flow more often than before. This shift matters because revenue per GPU deployment rises when the same system footprint carries more memory content. The market also benefits from the fact that memory bandwidth and memory capacity now influence accelerator usefulness as much as core compute performance. That makes premium memory less optional and more central to platform qualification across hyperscaler and enterprise buying programs. As a result, the memory subsystem for GPUs market is benefiting from a demand pattern that is tied to system specification depth, not only to shipment volume.

Transition From GDDR to HBM in Premium GPU Platforms

The memory subsystem for GPUs market is also being lifted by the move from GDDR toward HBM in the highest-performance GPU platforms. HBM requires a more involved integration process, which links memory supply more tightly with advanced packaging and GPU die assembly. Samsung stated that its next-generation HBM4 uses a 1c-class DRAM process and a 4 nm logic base die, with speeds up to 13 Gbps and bandwidth up to 3.3 TB/s, which shows how far premium memory requirements have moved beyond earlier graphics DRAM norms. This migration supports the memory subsystem for GPUs market because every transition to HBM raises the technical value of memory content within the total GPU bill of materials. It also narrows the field of suppliers that can serve premium platforms at scale. Over time, that makes the memory subsystem for GPUs market more dependent on high-end process execution and less dependent on commodity memory economics.

HBM Packaging Capacity Constraints

The main near-term restraint on the memory subsystem for GPUs market is not end demand but the difficulty of packaging high-bandwidth memory at scale. HBM output depends on advanced assembly steps that are more complex than standard graphics DRAM integration, so production cannot expand as quickly as demand for AI accelerators. This bottleneck affects the full memory subsystem for GPUs market because GPU shipments cannot fully convert into revenue when memory packaging remains tight. It also reinforces supplier pricing power, since available premium memory must be directed toward the highest-value programs first. The constraint is especially important in AI hardware because performance-class systems cannot easily substitute lower-end memory once a platform is designed around HBM. Until advanced packaging capacity broadens in a meaningful way, the memory subsystem for GPUs market will continue to face a ceiling that is created by supply execution rather than weak procurement interest.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid Adoption of GDDR7 in Gaming and Creator GPUs
2. Co-Design Between GPU Vendors and Memory Suppliers
3. High Cost Premium Versus Conventional Graphics DRAM

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

GDDR-Based Memory held 52.55% of the memory subsystem for GPUs market share in 2025, which shows how strongly the installed base still supports conventional graphics DRAM. The segment remained the larger revenue contributor because gaming, creator, and professional visualization systems continue to rely on GDDR6 and GDDR7 for balanced cost and bandwidth. In the memory subsystem for GPUs market, GDDR also benefits from simpler board-level integration and wider use across mainstream and performance consumer designs. That installed base gives the segment durability even as AI hardware spending shifts toward denser memory formats. The memory subsystem for GPUs industry still depends on GDDR for scale because many applications do not need HBM-class packaging or cost intensity.

HBM-Based Memory is projected to record a 21.52% CAGR through 2031, which makes it the fastest-growing architecture in the memory subsystem for GPUs market size discussion. Growth is tied to AI accelerators where memory bandwidth and memory density directly shape usable compute throughput. Samsung said its HBM4 platform reaches up to 13 Gbps and 3.3 TB/s, which reflects the performance step that premium GPU programs now require. NVIDIA and SK hynix also moved into multiyear co-development for next-generation AI memory, which supports the view that HBM will remain central to premium accelerator roadmaps. As more top-end platforms are designed around this memory class, the memory subsystem for GPUs market is likely to see HBM capture a larger share of value even if GDDR continues to lead in unit-driven categories.

Complete Report Scope:

• By Memory Architecture
  • GDDR-Based Memory
  • HBM-Based Memory
• By Memory Capacity
  • Up to 8 GB
  • 8 GB to 16 GB
  • 16 GB to 32 GB
  • 32 GB to 64 GB
  • Above 64 GB
• By Application
  • Gaming GPUs
  • Data Center and AI GPUs
  • Professional Visualization
  • Edge AI and Embedded
• By Geography
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • Germany
    • United Kingdom
    • France
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • India
    • Southeast Asia
    • Rest of Asia-Pacific
  • South America
  • Middle East and Africa

Geography Analysis

Asia-Pacific held 42.44% of the memory subsystem for GPUs market share in 2025 and is projected to grow at a 21.56% CAGR through 2031. The region leads because South Korea remains central to advanced DRAM and HBM production, while Taiwan remains critical for the packaging infrastructure that supports high-end GPU memory integration. The memory subsystem for GPUs market in Asia-Pacific also benefits from the close proximity of memory fabrication, packaging, and electronics manufacturing ecosystems. This concentration gives the region a structural edge in both supply responsiveness and technical coordination across the value chain. India and Southeast Asia remain smaller contributors today, but they are gaining relevance as local cloud and AI infrastructure activity expands.

North America is the main consumption center for premium AI memory by value, since the largest hyperscaler and accelerator programs are concentrated there. The memory subsystem for GPUs market in this region is shaped by procurement intensity from AI platform developers and cloud operators that can absorb high-end memory at scale. Export policy is reinforcing this position, since the BIS said advanced computing items tied to China-linked entities continue to require licensing regardless of the recipient's physical location outside those countries. That framework directs more advanced memory deployments toward allied geographies and supports stronger allocation visibility for North American programs. As a result, the memory subsystem for GPUs market in North America is constrained more by available supply than by weak end demand.

Europe remains concentrated in automotive AI, professional computing, and cloud infrastructure use cases where reliable supply and system quality matter. The memory subsystem for GPUs market in Europe benefits from a strong industrial and automotive base, especially where advanced driver assistance and simulation workloads need dependable GPU memory support. South America stays smaller and is led more by consumer graphics demand than by large-scale AI accelerator procurement. Middle East and Africa is still emerging, but sovereign AI programs are starting to generate a clearer path for data center GPU deployments. Together, these regions broaden the demand map for the memory subsystem for GPUs market, even though Asia-Pacific supply leadership and North American AI demand still shape the global balance most strongly.

1. Samsung Electronics Co., Ltd.
2. SK hynix Inc.
3. Micron Technology, Inc.
4. NVIDIA Corporation
5. Advanced Micro Devices, Inc.
6. Taiwan Semiconductor Manufacturing Company Limited
7. Intel Corporation
8. Qualcomm Technologies, Inc.
9. ASE Technology Holding Co., Ltd.
10. Rambus Inc.
11. Cadence Design Systems, Inc.
12. Synopsys, Inc.
13. Broadcom Inc.
14. Marvell Technology, Inc.
15. Amkor Technology, Inc.
16. Powerchip Semiconductor Manufacturing Corp.
17. Winbond Electronics Corporation
18. ChangXin Memory Technologies Inc.
19. GigaDevice Semiconductor Inc.
20. Kioxia Corporation
21. Arm Limited

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors on the Market
• 4.3 Market Drivers
  • 4.3.1 Rising AI Accelerator Memory Density Requirements
  • 4.3.2 Transition From GDDR to HBM in Premium GPU Platforms
  • 4.3.3 Rapid Adoption of GDDR7 in Gaming and Creator GPUs
  • 4.3.4 Co-Design Between GPU Vendors and Memory Suppliers
  • 4.3.5 Export-Control-Driven Supply Reallocation to Friendly Markets
  • 4.3.6 On-Package and Chiplet Integration Improving Bandwidth Per Watt
• 4.4 Market Restraints
  • 4.4.1 HBM Packaging Capacity Constraints
  • 4.4.2 High Cost Premium Versus Conventional Graphics DRAM
  • 4.4.3 Qualification Complexity Across GPU and Memory Generations
  • 4.4.4 Power and Thermal Limits in Compact GPU Designs
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Memory Architecture
  • 5.1.1 GDDR-Based Memory
  • 5.1.2 HBM-Based Memory
• 5.2 By Memory Capacity
  • 5.2.1 Up to 8 GB
  • 5.2.2 8 GB to 16 GB
  • 5.2.3 16 GB to 32 GB
  • 5.2.4 32 GB to 64 GB
  • 5.2.5 Above 64 GB
• 5.3 By Application
  • 5.3.1 Gaming GPUs
  • 5.3.2 Data Center and AI GPUs
  • 5.3.3 Professional Visualization
  • 5.3.4 Edge AI and Embedded
• 5.4 By Geography
  • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
  • 5.4.2 Europe
    • 5.4.2.1 Germany
    • 5.4.2.2 United Kingdom
    • 5.4.2.3 France
    • 5.4.2.4 Italy
    • 5.4.2.5 Rest of Europe
  • 5.4.3 Asia Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 India
    • 5.4.3.5 Southeast Asia
    • 5.4.3.6 Rest of Asia-Pacific
  • 5.4.4 South America
  • 5.4.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Positioning Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 Samsung Electronics Co., Ltd.
  • 6.4.2 SK hynix Inc.
  • 6.4.3 Micron Technology, Inc.
  • 6.4.4 NVIDIA Corporation
  • 6.4.5 Advanced Micro Devices, Inc.
  • 6.4.6 Taiwan Semiconductor Manufacturing Company Limited
  • 6.4.7 Intel Corporation
  • 6.4.8 Qualcomm Technologies, Inc.
  • 6.4.9 ASE Technology Holding Co., Ltd.
  • 6.4.10 Rambus Inc.
  • 6.4.11 Cadence Design Systems, Inc.
  • 6.4.12 Synopsys, Inc.
  • 6.4.13 Broadcom Inc.
  • 6.4.14 Marvell Technology, Inc.
  • 6.4.15 Amkor Technology, Inc.
  • 6.4.16 Powerchip Semiconductor Manufacturing Corp.
  • 6.4.17 Winbond Electronics Corporation
  • 6.4.18 ChangXin Memory Technologies Inc.
  • 6.4.19 GigaDevice Semiconductor Inc.
  • 6.4.20 Kioxia Corporation
  • 6.4.21 Arm Limited

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment